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Proceedings Papers

RoHS – Compliant Indirectly Material Evaluation for Manufacturing Study

Fenny Liu, Sean Huang, Sheng Fong Yu, Chun Yen Li, Liang-Yih Hung, Yu Po Wang

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A004, October 25–27, 2022

Paper No: IPACK2022-97175

DOI: https://doi.org/10.1115/IPACK2022-97175

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Topics: Hazardous substances, Manufacturing, Phthalate plasticizers, Electronic equipment, Plasticizers, Risk, Semiconductor industry, Temperature, Weight (Mass)

Proceedings Papers

CFD - Based Investigation of Effects of Obstruction in Front of Small Axial Cooling Fan and Deterioration of Supply Flow Rate

Tetsushi Fukuda, Yukio Masuda, Takashi Fukue, Yasuhiro Sugimoto, Tomoyuki Hatakeyama, Masaru Ishizuka, Katsuhiro Koizumi

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A007, October 26–28, 2021

Paper No: IPACK2021-72976

DOI: https://doi.org/10.1115/IPACK2021-72976

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Topics: Computational fluid dynamics, Cooling, Flow (Dynamics), Impellers, Density, Electronic equipment, Packaging, Fans, Flow visualization, Pressure

Proceedings Papers

Flow and Thermal Resistance Network Modeling of Finned Heat Sinks With Bypass Mounted in Rectangular Enclosure

Masaya Fukada, Takashi Fukue, Yasuhiro Sugimoto, Tomoyuki Hatakeyama, Masaru Ishizuka

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A006, October 26–28, 2021

Paper No: IPACK2021-72975

DOI: https://doi.org/10.1115/IPACK2021-72975

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Topics: Flow (Dynamics), Heat sinks, Modeling, Thermal resistance, Electronic equipment, Cooling, Design, Forced convection, Heat transfer, Network analysis

Proceedings Papers

Evolution of Anand Parameters With Elevated Temperature Aging for SAC Leadfree Alloys

Pradeep Lall, Vikas Yadav, Jeff Suhling, David Locker

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A009, October 27–29, 2020

Paper No: IPACK2020-2658

DOI: https://doi.org/10.1115/IPACK2020-2658

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Topics: Alloys, Temperature, Operating temperature, Solders, Avionics, Constitutive equations, Electronic equipment, Electronics, Energy dissipation, Engines

Proceedings Papers

System-Level Thermal Management and Reliability of Automotive Electronics: Goals and Opportunities in the Next Generation of Electric and Hybrid Electric Vehicles

Bakhtiyar Mohammad Nafis, Ange-Christian Iradukunda, Imam Al Razi, David R. Huitink, Yarui Peng

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A003, October 7–9, 2019

Paper No: IPACK2019-6429

DOI: https://doi.org/10.1115/IPACK2019-6429

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Topics: Electronics, Hybrid electric vehicles, Reliability, Thermal management, Phase change materials, Cooling, Temperature, Electronic packaging, Heat, Automobiles

Proceedings Papers

On Simple Prediction Method for Thermal Contact Resistance Between Wavy Surfaces With Thermal Interface Material Under Low Mean Nominal Contact Pressure (Fundamental Study Based on 1-D Model)

Toshio Tomimura, Yasushi Koito, Taewan Do, Masaru Ishizuka, Tomoyuki Hatakeyama

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A073, July 6–9, 2015

Paper No: IPACK2015-48302

DOI: https://doi.org/10.1115/IPACK2015-48302

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Topics: Contact resistance, Pressure, Heat, Surface roughness, Temperature, Bearings, Control systems, Electronic equipment, Errors, Satellites

Proceedings Papers

Comparative Analysis of Different In Row Cooler Management Configurations in a Hybrid Cooling Data Center

Tianyi Gao, Bahgat G. Sammakia, James Geer, Bruce Murray, Russell Tipton, Roger Schmidt

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A011, July 6–9, 2015

Paper No: IPACK2015-48069

DOI: https://doi.org/10.1115/IPACK2015-48069

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Topics: Cooling, Data centers, Coolers, Energy consumption, Cooling systems, Density, Heat, Temperature, Coal, Computational fluid dynamics

Proceedings Papers

Load Capacity and Thermal Efficiency Optimization of a Research Data Center Using Computational Modeling

Joseph R. H. Schaadt, Kamran Fouladi, Aaron P. Wemhoff, Joseph G. Pigeon

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A020, July 6–9, 2015

Paper No: IPACK2015-48364

DOI: https://doi.org/10.1115/IPACK2015-48364

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Topics: Computer simulation, Data centers, Optimization, Stress, Thermal efficiency, Design, Containment, Computational fluid dynamics, Air conditioning, Flow (Dynamics)

Proceedings Papers

Flow Resistance Network Analysis in Fan-Cooled High-Density Packaging Electronic Equipment

Takashi Fukue, Tomoyuki Hatakeyama, Masaru Ishizuka, Koichi Hirose, Kazuma Obata, Katsuhiro Koizumi

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A044, July 6–9, 2015

Paper No: IPACK2015-48600

DOI: https://doi.org/10.1115/IPACK2015-48600

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Topics: Density, Electronic equipment, Flow (Dynamics), Network analysis, Packaging, Air flow, Computational fluid dynamics, Cooling, Design, Diluents

Proceedings Papers

Effect of Relative Humidity, Temperature and Gaseous and Particulate Contaminations on Information Technology Equipment Reliability

Prabjit Singh, Levente Klein, Dereje Agonafer, Jimil M. Shah, Kanan D. Pujara

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A015, July 6–9, 2015

Paper No: IPACK2015-48176

DOI: https://doi.org/10.1115/IPACK2015-48176

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Topics: Contamination, Particulate matter, Reliability, Temperature, Data centers, Electronic equipment, Temperature effects, Cutting, High temperature, Risk

Proceedings Papers

Microprocessor Silicon Die Temperature Prediction by Simplified Boundary Conditions

Koji Nishi, Tomoyuki Hatakeyama, Shinji Nakagawa, Masaru Ishizuka

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A082, July 6–9, 2015

Paper No: IPACK2015-48205

DOI: https://doi.org/10.1115/IPACK2015-48205

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Topics: Boundary-value problems, Silicon, Temperature, Thermal resistance, Computation, Heat conduction, Heat transfer, Simulation results, Design, Electronic equipment

Proceedings Papers

An Innovative Way to Solve Problems Associated With Circular Connector Electrical Bonding Resistance

Frank Fan Wang

Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T01A001, July 16–18, 2013

Paper No: IPACK2013-73029

DOI: https://doi.org/10.1115/IPACK2013-73029

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Topics: Bonding, Aluminum, Aerospace industry, Electronic equipment, Military systems

Proceedings Papers

Relationships Between Supply Flow Rate of Small Cooling Fans and Pressure Drop Characteristics in Electronic Enclosure

Takashi Fukue, Tomoyuki Hatakeyama, Masaru Ishizuka, Koichi Hirose, Katsuhiro Koizumi

Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A020, July 16–18, 2013

Paper No: IPACK2013-73089

DOI: https://doi.org/10.1115/IPACK2013-73089

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Topics: Cooling, Fans, Flow (Dynamics), Pressure drop, Density, Packaging, Pressure, Design, Electronic equipment

Proceedings Papers

Characterization of a Server Thermal Mass Using Experimental Measurements

Mahmoud Ibrahim, Furat Afram, Bahgat Sammakia, Kanad Ghose, Bruce Murray, Madhusudan Iyengar, Roger Schmidt

Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 577-583, July 6–8, 2011

Paper No: IPACK2011-52165

DOI: https://doi.org/10.1115/IPACK2011-52165

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Topics: Cooling, Data centers, Electronic equipment, Energy dissipation, Energy efficiency, Fans, Heat, Materials properties, Sensors, Steady state

Proceedings Papers

Numerical Study on the Reduction of Recirculation Using Sealed Cold Aisles and its Effect on the Efficiency of the Cooling Infrastructure

Mahmoud Ibrahim, Bahgat Sammakia, Siddharth Bhopte, Bruce Murray, Madhusudan Iyengar, Roger Schmidt

Paper No: IPACK2011-52166

DOI: https://doi.org/10.1115/IPACK2011-52166

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Topics: Cooling, Electronic equipment, Temperature, Ceilings, Data centers, Energy dissipation, Heat, Sealing (Process), Air conditioning, Air flow

Proceedings Papers

Application of a Thermal Network Method to Thermal Analysis of Electronic Devices Using Phase Change Materials

Sadakazu Takakuwa, Masaru Ishizuka, Shinji Nakagawa, Kanji Takagi

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 471-477, July 19–23, 2009

Paper No: InterPACK2009-89218

DOI: https://doi.org/10.1115/InterPACK2009-89218

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Topics: Phase change materials, Thermal analysis, Fins, Temperature, Transients (Dynamics), Absorption, Cooling, Design, Electronic equipment, Energy dissipation

Proceedings Papers

Cooling Fan Model for Thermal Design of Compact Electronic Equipment: Improvement of Modeling Using PQ Curve

Hajime Nakamura

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 221-228, July 19–23, 2009

Paper No: InterPACK2009-89010

DOI: https://doi.org/10.1115/InterPACK2009-89010

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Topics: Cooling, Design, Electronic equipment, Modeling, Flow (Dynamics), Computational fluid dynamics, Fans, Pressure, Simulation, Forced convection

Proceedings Papers

Thermal Modeling of Snap-In Type Electrolytic Capacitors in Electronic Equipment

Katsuhiro Koizumi, Masaru Ishizuka, Shinji Nakagawa

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 239-245, July 19–23, 2009

Paper No: InterPACK2009-89052

DOI: https://doi.org/10.1115/InterPACK2009-89052

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Topics: Capacitors, Electronic equipment, Modeling, Computational fluid dynamics, Flow simulation, Temperature, Design, Flow (Dynamics), Switches, Thermal analysis

Proceedings Papers

Estimation of the Optimum Dimensions of a Vertical Channel Model for Natural Air Cooling in Electronic Equipment

Yasushi Nishino, Masaru Ishizuka, Shinji Nakagawa

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 341-346, July 19–23, 2009

Paper No: InterPACK2009-89103

DOI: https://doi.org/10.1115/InterPACK2009-89103

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Topics: Cooling, Dimensions, Electronic equipment, Clearances (Engineering), Copper, Flow (Dynamics), Temperature, Ducts, Particulate matter, Transparency

Proceedings Papers

Categorized Application Technology of Numerical Simulation on Electronic Equipment Thermal Design

Yasuyuki Yokono, Katsumi Hisano, Kenji Hirohata

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 247-252, July 19–23, 2009

Paper No: InterPACK2009-89057

DOI: https://doi.org/10.1115/InterPACK2009-89057

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Topics: Computer simulation, Design, Electronic equipment, Simulation, Product development, Physics, Product design

NARROW

RoHS – Compliant Indirectly Material Evaluation for Manufacturing Study

CFD - Based Investigation of Effects of Obstruction in Front of Small Axial Cooling Fan and Deterioration of Supply Flow Rate

Flow and Thermal Resistance Network Modeling of Finned Heat Sinks With Bypass Mounted in Rectangular Enclosure

Evolution of Anand Parameters With Elevated Temperature Aging for SAC Leadfree Alloys

System-Level Thermal Management and Reliability of Automotive Electronics: Goals and Opportunities in the Next Generation of Electric and Hybrid Electric Vehicles

On Simple Prediction Method for Thermal Contact Resistance Between Wavy Surfaces With Thermal Interface Material Under Low Mean Nominal Contact Pressure (Fundamental Study Based on 1-D Model)

Comparative Analysis of Different In Row Cooler Management Configurations in a Hybrid Cooling Data Center

Load Capacity and Thermal Efficiency Optimization of a Research Data Center Using Computational Modeling

Flow Resistance Network Analysis in Fan-Cooled High-Density Packaging Electronic Equipment

Effect of Relative Humidity, Temperature and Gaseous and Particulate Contaminations on Information Technology Equipment Reliability

Microprocessor Silicon Die Temperature Prediction by Simplified Boundary Conditions

An Innovative Way to Solve Problems Associated With Circular Connector Electrical Bonding Resistance

Relationships Between Supply Flow Rate of Small Cooling Fans and Pressure Drop Characteristics in Electronic Enclosure

Characterization of a Server Thermal Mass Using Experimental Measurements

Numerical Study on the Reduction of Recirculation Using Sealed Cold Aisles and its Effect on the Efficiency of the Cooling Infrastructure

Application of a Thermal Network Method to Thermal Analysis of Electronic Devices Using Phase Change Materials

Cooling Fan Model for Thermal Design of Compact Electronic Equipment: Improvement of Modeling Using PQ Curve

Thermal Modeling of Snap-In Type Electrolytic Capacitors in Electronic Equipment

Estimation of the Optimum Dimensions of a Vertical Channel Model for Natural Air Cooling in Electronic Equipment

Categorized Application Technology of Numerical Simulation on Electronic Equipment Thermal Design

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