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Proceedings Papers

Degradation Mechanisms of Underfills Subjected to Isothermal Long-Term Aging From 150°C to 200°C

Pradeep Lall, Yunli Zhang, Haotian Wu, Ed Davis, Jeff Suhling
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A014, October 27–29, 2020
Paper No: IPACK2020-2677
DOI: https://doi.org/10.1115/IPACK2020-2677
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Topics: Damage, Design, Elastic moduli, Electronic components, Electronic packaging, Elongation, High temperature, Mechanical properties, Mechanical testing, Operating temperature
Proceedings Papers

Development of a Novel Test Setup to Study the Combined Effects of Electromigration and Mechanical Stress in Solder Interconnects

Mahsa Montazeri, David R. Huitink
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A004, October 27–29, 2020
Paper No: IPACK2020-2598
DOI: https://doi.org/10.1115/IPACK2020-2598
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Topics: Electrodiffusion, Solders, Stress, Reliability, Tension, Copper, Current density, Wire, Bonding, Electrical resistance
Proceedings Papers

High Performance Computing Package With Chip Module on Substrate Solutions

Ching Chia Chen, David Lai, Vito Lin, Yu Po Wang
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A003, October 27–29, 2020
Paper No: IPACK2020-2547
DOI: https://doi.org/10.1115/IPACK2020-2547
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Topics: Ball-Grid-Array packaging, Bridges (Structures), Cloud computing, Corners (Structural elements), Data centers, Deformation, Elongation, Flip-chip, Flip-chip devices, Fracture (Materials)
Proceedings Papers

Investigation of Peeling Behavior of UV Curable Pressure Sensitive Adhesive for Bump-Wafer

Naoya Saiki, Yuichiro Komasu, Kazuto Aizawa, Jun Maeda
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A007, August 29–September 1, 2017
Paper No: IPACK2017-74010
DOI: https://doi.org/10.1115/IPACK2017-74010
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Topics: Adhesives, Pressure, Semiconductor wafers, Ultraviolet radiation, String, Finite element analysis, Deformation, Elongation, Finite element model, Fracture (Materials)
Proceedings Papers

Interfacial Delamination and Fracture Properties of Potting Compounds and PCB/Epoxy Interfaces Under Flexure Loading After Exposure to Multiple Cure Temperatures

Pradeep Lall, Kalyan Dornala, Jeff Suhling, John Deep
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A005, August 29–September 1, 2017
Paper No: IPACK2017-74322
DOI: https://doi.org/10.1115/IPACK2017-74322
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Topics: Bending (Stress), Delamination, Epoxy adhesives, Epoxy resins, Fracture toughness, Temperature, Fracture (Materials), Elongation, Shock (Mechanics), Failure
Proceedings Papers

Effect of Aging on Tensile Properties and Microstructures of Eutectic Sn-Pb Solder With Small Amounts of Au and Pd for Aerospace Application

Ryou Kikuchi, Ikuo Shohji, Yuta Saitoh, Norio Nemoto, Tsuyoshi Nakagawa, Nobuaki Ebihara, Fusao Iwase
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 667-672, July 6–8, 2011
Paper No: IPACK2011-52025
DOI: https://doi.org/10.1115/IPACK2011-52025
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Topics: Aerospace industry, Solders, Tensile strength, Tin, Elongation, Brittleness, Electrodes, Mechanical properties
Proceedings Papers

Micro Texture Dependence of Mechanical Properties of Electroplated Copper Thin Films Used for Thin Film Interconnection

Naokazu Murata, Kinji Tamakawa, Ken Suzuki, Hideo Miura
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 353-359, July 19–23, 2009
Paper No: InterPACK2009-89079
DOI: https://doi.org/10.1115/InterPACK2009-89079
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Topics: Copper, Mechanical properties, Texture (Materials), Thin films, Fracture (Materials), Fatigue strength, Grain boundaries, Brittle fracture, Ductile fracture, Fatigue testing