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Proceedings Papers

Predictive Methods for Electrical and Mechanical Process-Output for Inkjet Additive Printed Circuits

Pradeep Lall, Kartik Goyal, Scott Miller
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A004, October 25–27, 2022
Paper No: IPACK2022-97428
DOI: https://doi.org/10.1115/IPACK2022-97428
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Topics: Circuits, Drops, Electronics, Equipment performance, Experimental design, Inks, Manufacturing, Materials properties, Mechanical properties, Nanoparticles
Proceedings Papers

Mechanical and Electrical Properties of Additively Printed Circuits With Magnetically Orientated Anisotropic Conductive Adhesive Attachment for FHE Applications

Pradeep Lall, Jinesh Narangaparambil, Scott Miller
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A011, October 25–27, 2022
Paper No: IPACK2022-97456
DOI: https://doi.org/10.1115/IPACK2022-97456
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Topics: Adhesives, Anisotropy, Circuits, Electrical properties, Failure, Reliability, Temperature, Electronics, Low temperature, Bonding
Proceedings Papers

Experimental Analysis of Chiller Cooling Failure in a Small Size Data Center Environment Using Wireless Instrumentation

Mohammad Tradat, Bahgat Sammakia, Husam Alissa, Kourosh Nemati
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A006, August 27–30, 2018
Paper No: IPACK2018-8334
DOI: https://doi.org/10.1115/IPACK2018-8334
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Topics: Cooling, Data centers, Experimental analysis, Failure, Instrumentation, Cooling systems, Temperature, Containment, Equipment performance, Pressure
Proceedings Papers

Mechanical Constitutive Properties of Two High-Temperature Lead-Rich Solders

Qian Jiang, Subhasis Mukherjee, Bastian Vogt, Abhijit Dasgupta, David Shaddock, Liang Yin
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A005, July 6–9, 2015
Paper No: IPACK2015-48708
DOI: https://doi.org/10.1115/IPACK2015-48708
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Topics: High temperature, Solders, Temperature, Stress, Creep, Equipment performance, Mechanical properties, Melting, Wire
Proceedings Papers

Packaging Technology Development for Silicon on Sapphire Based Commercial RF IC Products

John Zhiyuan Yang
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 253-259, July 19–23, 2009
Paper No: InterPACK2009-89199
DOI: https://doi.org/10.1115/InterPACK2009-89199
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Topics: Packaging, Silicon-on-sapphire, Technology development, Equipment performance, Reliability
Proceedings Papers

Finite Element Analysis of Laser Fabricated Microjoint Performance in Cerebrospinal Fluid

Ahsan Mian, Jesse Law
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 703-709, July 8–12, 2007
Paper No: IPACK2007-33900
DOI: https://doi.org/10.1115/IPACK2007-33900
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Topics: Cerebrospinal fluid, Finite element analysis, Lasers, Biocompatibility, Bond strength, Equipment performance, Fluids, Modeling, Relaxation (Physics), Residual stresses