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Proceedings Papers

SOH Degradation Estimation of Thin Flexible Li-Ion Power Sources Subjected to Accelerated Life Cycling With Randomized Charge-Discharge and C-Rates

Pradeep Lall, Ved Soni
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A010, October 25–27, 2022
Paper No: IPACK2022-97451
DOI: https://doi.org/10.1115/IPACK2022-97451
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Topics: Batteries, Biomedical equipment, Cycles, Electronics, Errors, Flexible electronics, Industrial research, Model validation, Modeling, Service life (Equipment)
Proceedings Papers

BER Illusion Methodology: A Novel, Open Sourced and Scalable Approach to Troubleshooting High Radix Photonics Interconnects in a Modern Hyperscale Datacenter

Shreyas Rao, Abhijit Chakravarty, Dharmesh Jani
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A011, October 26–28, 2021
Paper No: IPACK2021-73253
DOI: https://doi.org/10.1115/IPACK2021-73253
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Topics: Dimensions, Errors, Failure, Failure analysis, Flow (Dynamics), Manufacturing, Optical interconnections, Optics, Photonics, Resolution (Optics)
Proceedings Papers

Piezoresistive Theory for 4H Silicon Carbide Stress Sensors on Four-Degree Off-Axis Wafers

Jun Chen, R. C. Jaeger, J. C. Suhling
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A019, October 7–9, 2019
Paper No: IPACK2019-6461
DOI: https://doi.org/10.1115/IPACK2019-6461
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Topics: Semiconductor wafers, Sensors, Silicon, Stress, Calibration, Errors, Approximation, Design, Electronics, High temperature
Proceedings Papers

On Thermal Interface Materials With Polydisperse Fillers: Packing Algorithm and Effective Properties

Piyas Chowdhury, Kamal Sikka, Anuja De Silva, Indira Seshadri
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A007, August 27–30, 2018
Paper No: IPACK2018-8337
DOI: https://doi.org/10.1115/IPACK2018-8337
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Topics: Algorithms, Fillers (Materials), Packing (Shipments), Packings (Cushioning), Design, Elastic moduli, Heat, Thermal conductivity, Viscosity, Errors
Proceedings Papers

Effects of Build-Up Material Properties on Warpage Dispersion of Organic Substrates Caused by Manufacturing Variations

Keishi Okamoto, Sayuri Kohara, Hiroyuki Mori
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A018, August 29–September 1, 2017
Paper No: IPACK2017-74098
DOI: https://doi.org/10.1115/IPACK2017-74098
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Topics: Manufacturing, Materials properties, Warping, Copper, Design, Finite element analysis, Simulation, Young's modulus, Errors, Flip-chip
Proceedings Papers

Two-Phase Mini-Thermosyphon for Cooling of Datacenters: Experiments, Modeling and Simulations

Chin L. Ong, Raffaele L. Amalfi, Jackson B. Marcinichen, Nicolas Lamaison, John R. Thome
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A003, August 29–September 1, 2017
Paper No: IPACK2017-74030
DOI: https://doi.org/10.1115/IPACK2017-74030
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Topics: Cooling, Modeling, Simulation, Heat, Density, Energy dissipation, Flow (Dynamics), Temperature, Water, Acoustics
Proceedings Papers

Development of Heat Transfer Tools for Sizing Flexible Graphite Spreaders in Mobile Applications

Rick Beyerle, Gary Shives
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A020, July 6–9, 2015
Paper No: IPACK2015-48523
DOI: https://doi.org/10.1115/IPACK2015-48523
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Topics: Graphite, Heat transfer, Computer software, Errors, Flat heat pipes, Heat, Thermal conductivity, Accounting, Adhesives, Computational fluid dynamics
Proceedings Papers

A Cost-Effective Modeling Approach for Simulating Phase Change and Flow Boiling in Microchannels

Zhenhai Pan, Justin A. Weibel, Suresh V. Garimella
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A023, July 6–9, 2015
Paper No: IPACK2015-48178
DOI: https://doi.org/10.1115/IPACK2015-48178
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Topics: Boiling, Flow (Dynamics), Microchannels, Modeling, Vapors, Bubbles, Simulation, Currents, Errors, Evaporation
Proceedings Papers

Prognostics Health Management Model for LED Package Failure Under Contaminated Environment

Pradeep Lall, Hao Zhang, Lynn Davis
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A047, July 6–9, 2015
Paper No: IPACK2015-48724
DOI: https://doi.org/10.1115/IPACK2015-48724
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Topics: Errors, Failure, Kalman filters, Maintenance, Organic compounds, Phosphors, Reliability, Robustness, Service life (Equipment), Stability
Proceedings Papers

On Simple Prediction Method for Thermal Contact Resistance Between Wavy Surfaces With Thermal Interface Material Under Low Mean Nominal Contact Pressure (Fundamental Study Based on 1-D Model)

Toshio Tomimura, Yasushi Koito, Taewan Do, Masaru Ishizuka, Tomoyuki Hatakeyama
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A073, July 6–9, 2015
Paper No: IPACK2015-48302
DOI: https://doi.org/10.1115/IPACK2015-48302
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Topics: Contact resistance, Pressure, Heat, Surface roughness, Temperature, Bearings, Control systems, Electronic equipment, Errors, Satellites
Proceedings Papers

Experimentally Validated Numerical Model of a Fully-Enclosed Hybrid Cooled Server Cabinet

Kourosh Nemati, Husam A. Alissa, Bruce T. Murray, Bahgat Sammakia, Mark Seymour
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A041, July 6–9, 2015
Paper No: IPACK2015-48244
DOI: https://doi.org/10.1115/IPACK2015-48244
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Topics: Computer simulation, Cooling, Data centers, Heat, Air flow, Energy dissipation, Leakage, Water, Boundary-value problems, Computational fluid dynamics
Proceedings Papers

Temperature Depression Under Heat Sources With Cylindrical Contact Thermocouples

Kayvan Abbasi, Sukhvinder Kang
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A006, July 6–9, 2015
Paper No: IPACK2015-48641
DOI: https://doi.org/10.1115/IPACK2015-48641
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Topics: Heat, Temperature, Thermocouples, Heat sinks, Temperature distribution, Approximation, Errors, Heat conduction, Heat transfer coefficients, Springs
Proceedings Papers

Experimental Validation of a Detailed Phase Change Model on a Hardware Testbed

Charlie De Vivero, Fulya Kaplan, Ayse K. Coskun
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A086, July 6–9, 2015
Paper No: IPACK2015-48568
DOI: https://doi.org/10.1115/IPACK2015-48568
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Topics: Hardware, Temperature, Phase change materials, Thermal management, Complementary metal oxide semiconductors, Computation, Cooling, Design, Errors, Heat
Proceedings Papers

Measuring Moisture Leakage Out of Water Cooling Hardware

Prabjit Singh, Michael Ellsworth
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A002, July 6–9, 2015
Paper No: IPACK2015-48154
DOI: https://doi.org/10.1115/IPACK2015-48154
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Topics: Cooling, Hardware, Leakage, Water, Computers, Cooling systems, Electronics, Acoustics, Coolants, Errors
Proceedings Papers

A Minimal Order Model From Zero to High Frequencies for Finite-Element Based Analysis of General 3-D Electromagnetic Problems

Feng Sheng, Dan Jiao
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T01A003, July 16–18, 2013
Paper No: IPACK2013-73177
DOI: https://doi.org/10.1115/IPACK2013-73177
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Topics: Finite element analysis, Design, Finite element methods, Algorithms, Approximation, Errors, Frequency-domain analysis, Integrated circuits, Linear systems, Modeling
Proceedings Papers

Dynamic Modeling of a Two-Phase On-Chip Cooling System Applied on Parallel High Performance Microprocessors

Nicolas Lamaison, Jackson B. Marcinichen, John R. Thome
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A021, July 16–18, 2013
Paper No: IPACK2013-73264
DOI: https://doi.org/10.1115/IPACK2013-73264
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Topics: Cooling systems, Dynamic modeling, Heat, Critical heat flux, Flow (Dynamics), Temperature, Transients (Dynamics), Condensers (steam plant), Pumps, Simulation
Proceedings Papers

Damage Pre-Cursors Based Prognostication of Accrued Damage and Assessment of Operational Readiness of Leadfree Electronics

Pradeep Lall, Mahendra Harsha, Jeff Suhling, Kai Goebel
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T05A014, July 16–18, 2013
Paper No: IPACK2013-73251
DOI: https://doi.org/10.1115/IPACK2013-73251
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Topics: Damage, Electronics, Cycles, Failure, Alloys, Elastic moduli, Electronic systems, Errors, High temperature, Reliability
Proceedings Papers

Design and Control of the IBM Power 775 Supercomputer Water Conditioning Unit

Michael J. Ellsworth, Jr., Randy J. Zoodsma, Frank Cascio, Eileen Behrendt
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A021, July 16–18, 2013
Paper No: IPACK2013-73090
DOI: https://doi.org/10.1115/IPACK2013-73090
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Topics: Design, Water, Heat, Stress, Cooling, Disks, Electronics, Flow (Dynamics), Heat exchangers, Motor drives
Proceedings Papers

Improved Zonal Model for Data Center Analysis

Zhihang Song, Bruce T. Murray, Bahgat Sammakia
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T09A001, July 16–18, 2013
Paper No: IPACK2013-73048
DOI: https://doi.org/10.1115/IPACK2013-73048
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Topics: Data centers, Computational fluid dynamics, Thermal analysis, Air flow, Computer software, Containment, Errors, Flow (Dynamics), Momentum, Temperature distribution
Proceedings Papers

Open and Contained Cold Aisle Experimentally Validated CFD Model Implementing CRAC and Server Fan Curves for a Data Center Test Laboratory

Sami A. Alkharabsheh, Bharathkrishnan Muralidharan, Mahmoud Ibrahim, Saurabh K. Shrivastava, Bahgat G. Sammakia
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T09A018, July 16–18, 2013
Paper No: IPACK2013-73214
DOI: https://doi.org/10.1115/IPACK2013-73214
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Topics: Computational fluid dynamics, Data centers, Tiles, Flow (Dynamics), Leakage, Containment, Errors, Calibration, Containment systems, Flow measurement