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Proceedings Papers

Characterization and Reliability Analysis of Direct-Write Additively Printed Flexible Humidity Sensor With Super Capacitive Material for Wearable Astronaut Sensor in Harsh Environments

Pradeep Lall, Hyesoo Jang, Curtis Hill
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A007, October 25–27, 2022
Paper No: IPACK2022-97432
DOI: https://doi.org/10.1115/IPACK2022-97432
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Topics: Astronauts, Event history analysis, Manufacturing, Reliability, Sensors
Proceedings Papers

Thermo-Mechanical Degradation of Thermal Interface Materials: Accelerated Test Development and Reliability Analysis

Dustin Pense, Hayden Carlton, David Huitink
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A009, October 7–9, 2019
Paper No: IPACK2019-6416
DOI: https://doi.org/10.1115/IPACK2019-6416
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Topics: Event history analysis, Thermomechanics, Reliability, Stress, Testing, Thermal conductivity, Adhesion, Adhesives, Cycles, Electronic packages
Proceedings Papers

Reliability Analysis of Ultra-Low-K Large-Die Package and Wire Bond Chip Package on Varying Structural Parameter Under Thermal Loading

Unique Rahangdale, Pavan Rajmane, Abel Misrak, Dereje Agonafer
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A020, August 29–September 1, 2017
Paper No: IPACK2017-74279
DOI: https://doi.org/10.1115/IPACK2017-74279
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Topics: Event history analysis, Wire, Reliability, Failure, Solders, Copper, Dielectric materials, Manufacturing, Microelectronic devices, Solder joints
Proceedings Papers

Mechanical Shock Reliability Analysis and Multiphysics Modeling of MEMS Accelerometers in Harsh Environments

Pradeep Lall, Nakul Kothari, Jessica Glover
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T07A007, July 6–9, 2015
Paper No: IPACK2015-48457
DOI: https://doi.org/10.1115/IPACK2015-48457
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Topics: Accelerometers, Event history analysis, Microelectromechanical systems, Modeling, Shock (Mechanics), Failure mechanisms, Capacitance, Failure, Defense industry, Deflection
Proceedings Papers

Reliability Analysis of Aging in Joint Microstructures for Sn-Ag-Cu Solder Joints During Thermal Cycling

Chaobo Shen, Zhou Hai, Cong Zhao, Jiawei Zhang, M. J. Bozack, J. C. Suhling, John L. Evans
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A033, July 6–9, 2015
Paper No: IPACK2015-48009
DOI: https://doi.org/10.1115/IPACK2015-48009
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Topics: Event history analysis, Solder joints, Tin, Ball-Grid-Array packaging, Fatigue failure, Finishes, Intermetallic compounds, Solders
Proceedings Papers

Visco-Elastic Effect of Underfill Material in Reliability Analysis of Flip-Chip Package

Yoshihiko Kanda, Kunihiro Zama, Yoshiharu Kariya, Takao Mikami, Takaya Kobayashi, Toshiyuki Sato, Toshiaki Enomoto, Koichi Hirata
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 755-759, July 19–23, 2009
Paper No: InterPACK2009-89152
DOI: https://doi.org/10.1115/InterPACK2009-89152
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Topics: Event history analysis, Flip-chip packages, Fatigue life, Finite element analysis, Viscoelasticity, Cooling, Solders, Warping
Proceedings Papers

Circuit Connection Reliability Analysis of Laser-Drilled Blind Via Holes Using Data-Mining Method

Keiji Ogawa, Toshiki Hirogaki, Eiichi Aoyama, Heisaburo Nakagawa
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 603-610, July 8–12, 2007
Paper No: IPACK2007-33077
DOI: https://doi.org/10.1115/IPACK2007-33077
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Topics: Circuits, Data mining, Event history analysis, Lasers, Thermal stresses, Finite element methods, Reliability, Copper, Plating, Copper foil
Proceedings Papers

Reliability Analysis of Solderless Press-Fit Interconnections

Hironori Tohmyoh, Kiichiro Yamanobe, Masumi Saka, Jiro Utsunomiya, Takeshi Nakamura, Yoshikatsu Nakano
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 611-615, July 8–12, 2007
Paper No: IPACK2007-33264
DOI: https://doi.org/10.1115/IPACK2007-33264
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Topics: Event history analysis, Press fits, Manufacturing, Stress, Friction, Printed circuit boards, Damage, Displacement, Failure, Finite element analysis
Proceedings Papers

Failure and Reliability Analysis Influenced by Various Factors Using Accelerated Disturbed State Concept

Russell D. Whitenack, Chandra S. Desai
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 595-604, July 6–11, 2003
Paper No: IPACK2003-35352
DOI: https://doi.org/10.1115/IPACK2003-35352
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Topics: Event history analysis, Failure, Cycles, Approximation, Computers, Design, Electronic packaging, Finite element analysis, Modeling, Reliability
Proceedings Papers

Design and Reliability Analysis of Wafer Level Package With Bubble-Like Buffer Layer

Chang-Chun Lee, Kuo-Ning Chiang
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 813-818, July 6–11, 2003
Paper No: IPACK2003-35052
DOI: https://doi.org/10.1115/IPACK2003-35052
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Topics: Bubbles, Design, Event history analysis, Polishing equipment, Reliability, Semiconductor wafers