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Proceedings Papers

A Control Strategy for Minimizing Temperature Fluctuations in High Power Liquid to Liquid CDUs Operated at Very Low Heat Loads

Ali Heydari, Pardeep Shahi, Vahideh Radmard, Bahareh Eslami, Uschas Chowdhury, Chandraprakash Hinge, Lochan Sai Reddy Cinthaparthy, Harold Miyamura, Himanshu Modi, Dereje Agonafer, Jeremy Rodriguez

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A011, October 25–27, 2022

Paper No: IPACK2022-97434

DOI: https://doi.org/10.1115/IPACK2022-97434

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Topics: Coolants, Cooling, Data centers, Fluctuations (Physics), Heat, Plates (structures), Stress, Temperature, Failure, Flow control

Proceedings Papers

Drop Durability of Printed Hybrid Electronic (PHE) Assemblies Under Extreme Acceleration Level

Hisham Abusalma, Abhijit Dasgupta, Andres Bujanda, Jian Yu, Harvey Tsang

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A003, October 25–27, 2022

Paper No: IPACK2022-97382

DOI: https://doi.org/10.1115/IPACK2022-97382

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Topics: Durability, Failure, Domes (Structural elements), Cantilever beams, Disks, Silver, Additive manufacturing, Bending (Stress), Clamps (Tools), Damage

Proceedings Papers

Mechanical and Electrical Properties of Additively Printed Circuits With Magnetically Orientated Anisotropic Conductive Adhesive Attachment for FHE Applications

Pradeep Lall, Jinesh Narangaparambil, Scott Miller

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A011, October 25–27, 2022

Paper No: IPACK2022-97456

DOI: https://doi.org/10.1115/IPACK2022-97456

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Topics: Adhesives, Anisotropy, Circuits, Electrical properties, Failure, Reliability, Temperature, Electronics, Low temperature, Bonding

Proceedings Papers

Study of Interface Monotonic and Fatigue Fracture Measurements at the Substrate Potting Compound Interfaces Under Flexure Loading

Pradeep Lall, Padmanava Choudhury, Ken Blecker

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A012, October 25–27, 2022

Paper No: IPACK2022-97448

DOI: https://doi.org/10.1115/IPACK2022-97448

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Topics: Bending (Stress), Cycles, Failure, Fatigue, Fracture (Materials), Fracture (Process), Stress

Proceedings Papers

Nonlocal Damage Modeling of Solder Joint Failure Under Thermomechanical Cyclic Loading

Youssef Maniar, Alexander Kabakchiev, Marta Kuczynska, Masoomeh Bazrafshan, Peter Binkele, Siegfried Schmauder

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A003, October 26–28, 2021

Paper No: IPACK2021-73100

DOI: https://doi.org/10.1115/IPACK2021-73100

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Topics: Damage, Failure, Modeling, Solder joints, Thermomechanics, Finite element analysis, Simulation, Stress, Deformation, Solders

Proceedings Papers

Performance Characteristics of Additively Printed Strain Gauges Under Different Conditions of Temperature and High Stress Loads

Pradeep Lall, Tony Thomas, Jinesh Narangaparambil

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A007, October 26–28, 2021

Paper No: IPACK2021-74074

DOI: https://doi.org/10.1115/IPACK2021-74074

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Topics: Performance characterization, Strain gages, Stress, Temperature, Inks, Printing, Sensors, Printed circuit boards, Silver, Vibration

Proceedings Papers

Prognostics and RUL Estimations of SAC305, SAC105 and SnAg Solders Under Temperature and Vibration Using Long Short-Term Memory (LSTM) Deep Learning

Pradeep Lall, Tony Thomas, Ken Blecker

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A019, October 26–28, 2021

Paper No: IPACK2021-74066

DOI: https://doi.org/10.1115/IPACK2021-74066

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Topics: Solders, Temperature, Vibration, Failure, Signals, Service life (Equipment), Time series, Complex systems, Dimensions, Maintenance

Proceedings Papers

Repeatability and Extended Time Stability Study of an Additively Printed Strain Gauge Under Different Load Conditions

Pradeep Lall, Jinesh Narangaparambil, Tony Thomas, Kyle Schulze

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A011, October 26–28, 2021

Paper No: IPACK2021-74570

DOI: https://doi.org/10.1115/IPACK2021-74570

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Topics: Failure, Gages, Inks, Printing, Shear (Mechanics), Stability, Strain gages, Stress

Proceedings Papers

Enhanced Processability and Thermal Fatigue Reliability With Low Melting Point SnBi Solder Alloy LMPA-Q

Bart Vandevelde, Chinmay Nawghane, Riet Labie, Ralph Lauwaert, Daniel Werkhoven

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A013, October 26–28, 2021

Paper No: IPACK2021-73456

DOI: https://doi.org/10.1115/IPACK2021-73456

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Topics: Alloys, Fatigue, Melting point, Reliability, Solders, Temperature, Ball-Grid-Array packaging, Contamination, Failure, Failure analysis

Proceedings Papers

BER Illusion Methodology: A Novel, Open Sourced and Scalable Approach to Troubleshooting High Radix Photonics Interconnects in a Modern Hyperscale Datacenter

Shreyas Rao, Abhijit Chakravarty, Dharmesh Jani

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A011, October 26–28, 2021

Paper No: IPACK2021-73253

DOI: https://doi.org/10.1115/IPACK2021-73253

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Topics: Dimensions, Errors, Failure, Failure analysis, Flow (Dynamics), Manufacturing, Optical interconnections, Optics, Photonics, Resolution (Optics)

Proceedings Papers

An Assessment of Effects of Nanofluids on Heat Transfer Performance of Two-Phase Cooling Systems

Alexander V. Korobko, Sana Fateh

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A003, October 26–28, 2021

Paper No: IPACK2021-68121

DOI: https://doi.org/10.1115/IPACK2021-68121

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Topics: Cooling systems, Heat transfer, Nanofluids, Heat, Critical heat flux, Data centers, Fluids, Thermal management, Boiling, Computation

Proceedings Papers

Evolution of Potting-PCB Interfacial Reliability After Long Term High Temperature Operation

Pradeep Lall, Aathi Raja Ram Pandurangan, Ken Blecker

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A018, October 26–28, 2021

Paper No: IPACK2021-74062

DOI: https://doi.org/10.1115/IPACK2021-74062

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Topics: Delamination, Epoxy adhesives, Epoxy resins, Fracture toughness, High temperature, Reliability, Shock (Mechanics), Stress, Fracture (Materials), Electronic components

Proceedings Papers

Experimental Study of Crack Propagation at the PCB/Underfill Interface due to Thermal Aging

Pradeep Lall, Padmanava Choudhury, Jaimal Williamson

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A013, October 27–29, 2020

Paper No: IPACK2020-2676

DOI: https://doi.org/10.1115/IPACK2020-2676

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Topics: Ball-Grid-Array packaging, Composite building materials, Crack propagation, Damage, Delamination, Displacement, Electronics, Failure, Flip-chip, Fracture (Materials)

Proceedings Papers

Design of Accelerated Degradation Test Method and Failure Analysis of Flexible Hybrid Electronic Devices

Alex Davila-Frias, Val Marinov, Om Prakash Yadav, Yuriy Atanasov

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A001, October 27–29, 2020

Paper No: IPACK2020-2525

DOI: https://doi.org/10.1115/IPACK2020-2525

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Topics: Design, Electronics, Failure analysis, Temperature, Stress, Failure, Testing, Accelerated life testing, Chain, Failure data

Proceedings Papers

Development of a Novel Test Setup to Study the Combined Effects of Electromigration and Mechanical Stress in Solder Interconnects

Mahsa Montazeri, David R. Huitink

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A004, October 27–29, 2020

Paper No: IPACK2020-2598

DOI: https://doi.org/10.1115/IPACK2020-2598

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Topics: Electrodiffusion, Solders, Stress, Reliability, Tension, Copper, Current density, Wire, Bonding, Electrical resistance

Proceedings Papers

Development of Process-Recipes for Multi-Layer Circuitry Printing With Z-Axis Interconnects Using Aerosol-Jet Nanoparticle Ink

Pradeep Lall, Jinesh Narangaparambil, Ved Soni, Scott Miller

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A003, October 27–29, 2020

Paper No: IPACK2020-2664

DOI: https://doi.org/10.1115/IPACK2020-2664

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Topics: Aerosols, Failure, Inks, Nanoparticles, Printing, Shear (Mechanics), Stress

Proceedings Papers

System and Component Level Risk Assessment for SiC MOSFET Based Inverter for Traction Application

Bakhtiyar Mohammad Nafis, Mohammad Mahmud, Zhongjing Wang, Yuheng Wu, David Huitink, Yue Zhao

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A007, October 27–29, 2020

Paper No: IPACK2020-2581

DOI: https://doi.org/10.1115/IPACK2020-2581

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Topics: MOSFET transistors, Risk assessment, Traction, Temperature, Failure, Reliability, Capacitors, Risk, Boundary-value problems, Cycles

Proceedings Papers

Numerical Investigation on Electromigration Oriented Failure of Lead Free Solder Joints With Aging Effects

Tusher Ahmed, Mohammad Motalab, Jeffrey C. Suhling

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A024, October 7–9, 2019

Paper No: IPACK2019-6521

DOI: https://doi.org/10.1115/IPACK2019-6521

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Topics: Electrodiffusion, Failure, Lead-free solders

Proceedings Papers

Application of Electronics Packaging Fundamentals to Photovoltaic Interconnects and Packaging

Laura Spinella, Nick Bosco

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A003, October 7–9, 2019

Paper No: IPACK2019-6520

DOI: https://doi.org/10.1115/IPACK2019-6520

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Topics: Electronic packaging, Fatigue, Packaging, Simulation, Solders, Thermomechanics, Reliability, Climate, Architecture, Electronics

Proceedings Papers

Process Capability of Aerosol-Jet Additive Processes for Long-Runs up to 10-Hours

Pradeep Lall, Amrit Abrol, Nakul Kothari, Ben Leever, Scott Miller

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A003, October 7–9, 2019

Paper No: IPACK2019-6569

DOI: https://doi.org/10.1115/IPACK2019-6569

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Topics: Additive manufacturing, Aerosols, Temperature, Printing, Sintering, Shear (Mechanics), Stress, Failure, Manufacturing, Mechanical properties

NARROW

A Control Strategy for Minimizing Temperature Fluctuations in High Power Liquid to Liquid CDUs Operated at Very Low Heat Loads

Drop Durability of Printed Hybrid Electronic (PHE) Assemblies Under Extreme Acceleration Level

Mechanical and Electrical Properties of Additively Printed Circuits With Magnetically Orientated Anisotropic Conductive Adhesive Attachment for FHE Applications

Study of Interface Monotonic and Fatigue Fracture Measurements at the Substrate Potting Compound Interfaces Under Flexure Loading

Nonlocal Damage Modeling of Solder Joint Failure Under Thermomechanical Cyclic Loading

Performance Characteristics of Additively Printed Strain Gauges Under Different Conditions of Temperature and High Stress Loads

Prognostics and RUL Estimations of SAC305, SAC105 and SnAg Solders Under Temperature and Vibration Using Long Short-Term Memory (LSTM) Deep Learning

Repeatability and Extended Time Stability Study of an Additively Printed Strain Gauge Under Different Load Conditions

Enhanced Processability and Thermal Fatigue Reliability With Low Melting Point SnBi Solder Alloy LMPA-Q

BER Illusion Methodology: A Novel, Open Sourced and Scalable Approach to Troubleshooting High Radix Photonics Interconnects in a Modern Hyperscale Datacenter

An Assessment of Effects of Nanofluids on Heat Transfer Performance of Two-Phase Cooling Systems

Evolution of Potting-PCB Interfacial Reliability After Long Term High Temperature Operation

Experimental Study of Crack Propagation at the PCB/Underfill Interface due to Thermal Aging

Design of Accelerated Degradation Test Method and Failure Analysis of Flexible Hybrid Electronic Devices

Development of a Novel Test Setup to Study the Combined Effects of Electromigration and Mechanical Stress in Solder Interconnects

Development of Process-Recipes for Multi-Layer Circuitry Printing With Z-Axis Interconnects Using Aerosol-Jet Nanoparticle Ink

System and Component Level Risk Assessment for SiC MOSFET Based Inverter for Traction Application

Numerical Investigation on Electromigration Oriented Failure of Lead Free Solder Joints With Aging Effects

Application of Electronics Packaging Fundamentals to Photovoltaic Interconnects and Packaging

Process Capability of Aerosol-Jet Additive Processes for Long-Runs up to 10-Hours

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