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Proceedings Papers

Feasibility Demonstration of Server Chip Package With Direct-to-Chip Optical Transceivers

Shidong Li, Bakul Parikh, Chelsea Savoy, Daniel Kuchta, Guillaume Jutras, Harry Bagheri, Hilton Toy, Joe Ross, Ken-Ichi Akasofu, Mark Kapfhammer, Mark Schultz, Steven Ostrander, Thomas Wassick
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A004, October 25–27, 2022
Paper No: IPACK2022-97455
DOI: https://doi.org/10.1115/IPACK2022-97455
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Topics: Cables, Construction, Copper, Cycles, Density, Elastomers, Fibers, Flat heat pipes, Flip-chip, Flip-chip devices
Proceedings Papers

Epoxy Die Attach Combined With Face-Up Die Bonding for Improved XYZ Placement Accuracy

Tadeh Avanessian, Jim Clatterbaugh, Robin L. Zinsmaster, Leyla Hashemi
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A001, October 26–28, 2021
Paper No: IPACK2021-69495
DOI: https://doi.org/10.1115/IPACK2021-69495
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Topics: Bonding, Epoxy adhesives, Epoxy resins, Flip-chip, Flip-chip devices
Proceedings Papers

High Performance Computing Package With Chip Module on Substrate Solutions

Ching Chia Chen, David Lai, Vito Lin, Yu Po Wang
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A003, October 27–29, 2020
Paper No: IPACK2020-2547
DOI: https://doi.org/10.1115/IPACK2020-2547
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Topics: Ball-Grid-Array packaging, Bridges (Structures), Cloud computing, Corners (Structural elements), Data centers, Deformation, Elongation, Flip-chip, Flip-chip devices, Fracture (Materials)
Proceedings Papers

The Dependence of Moisture Induced Die Stresses Upon Moisture Properties of Polymer Materials in Electronic Packages

Quang Nguyen, Jeffrey C. Suhling, Richard C. Jaeger, Pradeep Lall
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A003, August 29–September 1, 2017
Paper No: IPACK2017-74273
DOI: https://doi.org/10.1115/IPACK2017-74273
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Topics: Electronic packages, Polymers, Stress, Reliability, Simulation, Weight (Mass), Absorption, Ball-Grid-Array packaging, Corrosion, Cracking (Materials)
Proceedings Papers

Large Flip Chip Assembly Challenges and Risk Mitigation Process

Jeremy Plunkett, Suresh Subramaniam, Nokibul Islam, Kang KeonTaek, Gu SeonMo, Eric Ouyang
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A008, August 29–September 1, 2017
Paper No: IPACK2017-74026
DOI: https://doi.org/10.1115/IPACK2017-74026
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Topics: Ball-Grid-Array packaging, Copper, Cracking (Materials), Delamination, Failure, Flip-chip, Flip-chip assemblies, Flip-chip devices, Flip-chip packages, Fracture (Process)
Proceedings Papers

Fabrication, Packaging, and Catheter Assembly of 2D CMUT Arrays for Endoscopic Ultrasound and Cardiac Imaging

Azadeh Moini, Amin Nikoozadeh, Jung Woo Choe, Butrus T. Khuri-Yakub, Chienliu Chang, Doug Stephens, L. Scott Smith, David Sahn
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T07A008, July 6–9, 2015
Paper No: IPACK2015-48611
DOI: https://doi.org/10.1115/IPACK2015-48611
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Topics: Catheters, Endoscopic devices, Imaging, Manufacturing, Packaging, Ultrasound, Biomedical imaging, Ultrasonic transducers, Bonding, Design
Proceedings Papers

Measurement and Simulation of Moisture Induced Die Stresses in Flip Chip on Laminate Assemblies

Quang Nguyen, Jordan C. Roberts, Jeffrey C. Suhling, Richard C. Jaeger, Pradeep Lall
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A040, July 6–9, 2015
Paper No: IPACK2015-48626
DOI: https://doi.org/10.1115/IPACK2015-48626
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Topics: Flip-chip, Flip-chip devices, Laminates, Simulation, Stress, Flip-chip assemblies, Diffusion (Physics), Storage, Temperature, Absorption
Proceedings Papers

Thermal Design Analysis of 2.5-D Packages With Analytical TSV Submodels

H. Y. Zhang, Xiao Yan, W. H. Zhu, Leon Lin
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A001, July 6–9, 2015
Paper No: IPACK2015-48088
DOI: https://doi.org/10.1115/IPACK2015-48088
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Topics: Design, Heat sinks, Silicon, Aluminum, Copper, Energy dissipation, Heat, Modeling, Slug flows, Cooling
Proceedings Papers

An Efficient Bump Pad Design to Mitigate the Flip Chip Package Induced Stress

Mario Gonzalez, Joeri De Vos, Geert Van der Plas, Eric Beyne
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A018, July 6–9, 2015
Paper No: IPACK2015-48111
DOI: https://doi.org/10.1115/IPACK2015-48111
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Topics: Design, Flip-chip packages, Stress, Copper, Columns (Structural), Polishing equipment, Solders, Finite element model, Flip-chip, Flip-chip devices
Proceedings Papers

Effects of Low CTE Materials on Thermal Deformation of Organic Substrates in Flip Chip Package Application

Hiroyuki Mori, Sayuri Kohara, Keishi Okamoto, Hirokazu Noma, Kazushige Toriyama
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A016, July 6–9, 2015
Paper No: IPACK2015-48741
DOI: https://doi.org/10.1115/IPACK2015-48741
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Topics: Flip-chip packages, Thermal deformation, Warping, Finite element analysis, Manufacturing, Package on package, Shapes, Deformation, Finite element model, Flip-chip
Proceedings Papers

Application of Synchrotron Radiation X-Ray Laminography to Nondestructive Evaluation of the Fatigue Crack Propagation Process in Flip Chip Solder Joints

Hiroyuki Tsuritani, Toshihiko Sayama, Yoshiyuki Okamoto, Takeshi Takayanagi, Kentaro Uesugi, Masato Hoshino, Takao Mori
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T05A001, July 16–18, 2013
Paper No: IPACK2013-73091
DOI: https://doi.org/10.1115/IPACK2013-73091
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Topics: Fatigue cracks, Flip-chip, Flip-chip devices, Nondestructive evaluation, Solder joints, Synchrotron radiation, X-rays, Fracture (Materials), Microcracks, Solders
Proceedings Papers

Flip Chip Packaging of Wafer Level Encapsulated RF MEMS Tunable Capacitors

Shawn J. Cunningham, Yvonne Heng, Nabeel Idrisi, Brad Nelson, John McKillop
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T06A002, July 16–18, 2013
Paper No: IPACK2013-73222
DOI: https://doi.org/10.1115/IPACK2013-73222
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Topics: Capacitors, Flip-chip, Flip-chip devices, Microelectromechanical systems, Packaging, Semiconductor wafers, Solders, Stress, Deflection, Failure
Proceedings Papers

Measurement of Microprocessor Die Stress due to Thermal Cycling, Power Cycling, and Second Level Assembly

Jordan C. Roberts, Mohammad Motalab, Safina Hussain, Jeffrey C. Suhling, Richard C. Jaeger, Pradeep Lall
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T01A005, July 16–18, 2013
Paper No: IPACK2013-73244
DOI: https://doi.org/10.1115/IPACK2013-73244
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Topics: Flip-chip, Flip-chip devices, Manufacturing, Sensors, Stress
Proceedings Papers

A Method for Failure Analysis for Devices With Simultaneous Imaging of Electron Emission and Near IR Thermoreflectance

Kazuaki Yazawa, Dustin Kendig, James Christofferson, Ali Shakouri
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A023, July 16–18, 2013
Paper No: IPACK2013-73104
DOI: https://doi.org/10.1115/IPACK2013-73104
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Topics: Electron emission, Failure analysis, Imaging, Thermoreflectance, Circuits, Emissions, Failure, Electrons, Silicon, Temperature
Proceedings Papers

Topology Optimization on Targeting Frequency and Mode of Ultrasonic Bonding Tool for Microchip Packaging

Chang Yong Ha, Soo Il Lee
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 179-184, July 6–8, 2011
Paper No: IPACK2011-52100
DOI: https://doi.org/10.1115/IPACK2011-52100
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Topics: Bonding, Integrated circuits, Optimization, Packaging, Topology, Design, Modal assurance criterion, Vibration, Errors, Finite element model
Proceedings Papers

Lead Free Flip Chip Reliability for Various Package Types

Nokibul Islam, Miguel Jimarez, Ahmer Syed, TaeKyeong Hwang, JaeYun Gim, WonJoon Kang
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 609-615, July 6–8, 2011
Paper No: IPACK2011-52260
DOI: https://doi.org/10.1115/IPACK2011-52260
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Topics: Ball-Grid-Array packaging, Flip-chip, Flip-chip devices, Reliability, Warping
Proceedings Papers

Nature of Package-Induced Deformation and the Risk of Fracture in Low-k Dielectric Stacks

Hung-Yun Lin, Abhishek Tambat, Ian Claydon, Ganesh Subbarayan, Dae Young Jung, Bahgat Sammakia
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 351-356, July 6–8, 2011
Paper No: IPACK2011-52258
DOI: https://doi.org/10.1115/IPACK2011-52258
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Topics: Deformation, Fracture (Process), Risk, Temperature, Computer software, Cooling, Finite element analysis, Flip-chip, Flip-chip devices, Flip-chip packages
Proceedings Papers

Minimization of the Local Residual Stress in 3D Flip Chip Structures by Optimizing the Mechanical Properties of Electroplated Materials and the Alignment Structure of TSVs and Fine Bumps

Kohta Nakahira, Hironori Tago, Fumiaki Endo, Ken Suzuki, Hideo Miura
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 19-25, July 6–8, 2011
Paper No: IPACK2011-52063
DOI: https://doi.org/10.1115/IPACK2011-52063
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Topics: Flip-chip, Flip-chip devices, Mechanical properties, Stress, Copper, Silicon chips, Gages, Packaging, Sensors, Strain gages
Proceedings Papers

Detection of Poor Wetting of Lead-Free Solder Bumps in Ball Grid Array Packages Using Laser Ultrasound Technique

Jie Gong, I. Charles Ume
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 95-103, July 6–8, 2011
Paper No: IPACK2011-52294
DOI: https://doi.org/10.1115/IPACK2011-52294
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Topics: Ball-Grid-Array packages, Lasers, Lead-free solders, Ultrasound, Wetting, Solders, Inspection, Transients (Dynamics), Ball-Grid-Array packaging, Displacement
Proceedings Papers

Cure Profile Effects on the Mechanical Behavior and Reliability of Flip Chip on Laminate Assemblies

Guoyun Tian, Chang Lin, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 789-796, July 19–23, 2009
Paper No: InterPACK2009-89209
DOI: https://doi.org/10.1115/InterPACK2009-89209
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Topics: Flip-chip, Flip-chip devices, Hardening (Curing), Laminates, Mechanical behavior, Reliability, Stress-strain curves