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Proceedings Papers

A Control Strategy for Minimizing Temperature Fluctuations in High Power Liquid to Liquid CDUs Operated at Very Low Heat Loads

Ali Heydari, Pardeep Shahi, Vahideh Radmard, Bahareh Eslami, Uschas Chowdhury, Chandraprakash Hinge, Lochan Sai Reddy Cinthaparthy, Harold Miyamura, Himanshu Modi, Dereje Agonafer, Jeremy Rodriguez
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A011, October 25–27, 2022
Paper No: IPACK2022-97434
https://doi.org/10.1115/IPACK2022-97434
View Paper titled, A Control Strategy for Minimizing Temperature Fluctuations in High Power Liquid to Liquid CDUs Operated at Very Low Heat Loads
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Topics: Coolants, Cooling, Data centers, Fluctuations (Physics), Heat, Plates (structures), Stress, Temperature, Failure, Flow control
Proceedings Papers

Experimental Study of Transient Hydraulic Characteristics for Liquid Cooled Data Center Deployment

Ali Heydari, Pardeep Shahi, Vahideh Radmard, Bahareh Eslami, Uschas Chowdhury, Akiilessh Sivakumar, Akshay Lakshminarayana, Harold Miyamura, Gautam Gupta, Dereje Agonafer, Jeremy Rodriguez
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A009, October 25–27, 2022
Paper No: IPACK2022-97425
https://doi.org/10.1115/IPACK2022-97425
View Paper titled, Experimental Study of Transient Hydraulic Characteristics for Liquid Cooled Data Center Deployment
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Topics: Cooling, Data centers, Flow control, Plates (structures), Transients (Dynamics)
Proceedings Papers

Data Center Thermal Efficiency Improvement by Cooling Flow Vectoring Using Synthetic Jets

Eduardo Sepúlveda Jiménez, Jean Paul d’Alençon, Luis Silva-Llanca
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A012, October 7–9, 2019
Paper No: IPACK2019-6585
https://doi.org/10.1115/IPACK2019-6585
View Paper titled, Data Center Thermal Efficiency Improvement by Cooling Flow Vectoring Using Synthetic Jets
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Topics: Cooling, Data centers, Flow (Dynamics), Jets, Thermal efficiency, Energy consumption, Exergy, Tiles, Computer cooling, Computer software
Proceedings Papers

Thermal Metamaterials for Heat Flow Control in Electronics

Ercan M. Dede, Feng Zhou, Paul Schmalenberg, Tsuyoshi Nomura
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A006, August 29–September 1, 2017
Paper No: IPACK2017-74112
https://doi.org/10.1115/IPACK2017-74112
View Paper titled, Thermal Metamaterials for Heat Flow Control in Electronics
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Topics: Electronics, Flow control, Heat, Metamaterials, Flow (Dynamics), Anisotropy, Blocks (Building materials), Circuit design, Composite materials, Design
Proceedings Papers

Power Allocation Towards Hermetic Solder Joint Health of High Powered MEMS Chip for Harsh Environment Applications

Siddharth Bhopte, Parthiban Arunasalam, Fadi Alsaleem, Arvind Rao, Nataraj Hariharan
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 617-625, July 6–8, 2011
Paper No: IPACK2011-52296
https://doi.org/10.1115/IPACK2011-52296
View Paper titled, Power Allocation Towards Hermetic Solder Joint Health of High Powered MEMS Chip for Harsh Environment Applications
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Topics: Microelectromechanical systems, Solder joints, Solders, Actuators, Metals, Pressure sensors, Refrigeration, Reliability, Flow (Dynamics), Flow control
Proceedings Papers

An Investigation of Spray Cooling Thermal Management for Semiconductor Burn-In

T. Cader, B. Tolman, C. Tilton, M. C. Harris
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 65-71, July 6–11, 2003
Paper No: IPACK2003-35137
https://doi.org/10.1115/IPACK2003-35137
View Paper titled, An Investigation of Spray Cooling Thermal Management for Semiconductor Burn-In
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Topics: Cooling, Semiconductors (Materials), Sprays, Thermal management, Temperature, Junctions, Engineering prototypes, Failure, Flow control, Forced convection