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Proceedings Papers

Design and Fabrication of Graded Copper Inverse Opals (g-CIOs) for Capillary-Fed Boiling in High Heat Flux Cooling Applications

Qianying Wu, Chi Zhang, Mehdi Asheghi, Kenneth Goodson
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A011, October 27–29, 2020
Paper No: IPACK2020-2603
DOI: https://doi.org/10.1115/IPACK2020-2603
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Topics: Boiling, Cooling, Copper, Design, Heat flux, Manufacturing, Critical heat flux, Heat, Modeling, Permeability
Proceedings Papers

Design of Passive Two-Phase Thermosyphons for Server Cooling

Raffaele L. Amalfi, Jackson B. Marcinichen, John R. Thome, Filippo Cataldo
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A003, October 7–9, 2019
Paper No: IPACK2019-6386
DOI: https://doi.org/10.1115/IPACK2019-6386
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Topics: Cooling, Design, Energy consumption, Heat, Cooling systems, Artificial intelligence, Condensers (steam plant), Coolants, Databases, Electric vehicles
Proceedings Papers

Orientation Effects in Two-Phase Microgap Flow

Franklin L. Robinson, Avram Bar-Cohen
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A015, August 27–30, 2018
Paper No: IPACK2018-8383
DOI: https://doi.org/10.1115/IPACK2018-8383
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Topics: Flow (Dynamics), Gravity (Force), Coolers, Boiling, Cooling, Flux (Metallurgy), Heat, Aircraft, Fluids, Gravitational acceleration
Proceedings Papers

Heat Transfer Characteristics and Flow Pattern Visualization for Flow Boiling in a Vertical Narrow Microchannel

Kan Zhou, Junye Li, Zhao-zan Feng, Wei Li, Hua Zhu, Kuang Sheng
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A021, August 27–30, 2018
Paper No: IPACK2018-8447
DOI: https://doi.org/10.1115/IPACK2018-8447
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Topics: Boiling, Flow (Dynamics), Heat transfer, Microchannels, Visualization, Nucleate boiling, Bubbles, Fluids, Flux (Metallurgy), Heat
Proceedings Papers

Comparison of Evaporation and Condensation Characteristics Among Three Enhanced Tubes

Kunrong Shen, Zhichuan Sun, Xiaolong Yan, Wei Li, David J. Kukulka, Jianxin Zhou, Deyu Luan, Yan He, Bin Zhang
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A023, August 27–30, 2018
Paper No: IPACK2018-8449
DOI: https://doi.org/10.1115/IPACK2018-8449
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Topics: Condensation, Evaporation, Heat transfer, Heat transfer coefficients, Refrigerants, Pressure drop, Temperature, Vapors, Climate change, Flux (Metallurgy)
Proceedings Papers

Practical Concerns for Adoption of Microjet Cooling

Stephen M. Walsh, James P. Smith, Eric A. Browne, Timothy W. Hennighausen, Bernard A. Malouin
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A026, August 27–30, 2018
Paper No: IPACK2018-8468
DOI: https://doi.org/10.1115/IPACK2018-8468
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Topics: Cooling, Electronics, Erosion, Flux (Metallurgy), Heat, Numerical analysis, Operating temperature, Power density, Pressure, Robustness
Proceedings Papers

Multifunctional Chip for Use in Thermal Analysis of Power Systems

David Gonzalez-Nino, Lauren Boteler, Damian P. Urciuoli, Iain M. Kierzewski, Dimeji Ibitayo, Pedro O. Quintero
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A014, August 27–30, 2018
Paper No: IPACK2018-8355
DOI: https://doi.org/10.1115/IPACK2018-8355
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Topics: Design, Electronic systems, Flux (Metallurgy), Heat, Heat flux, High temperature, Instrumentation, Junctions, Military systems, Power systems (Machinery)
Proceedings Papers

Experimental Investigation of Parameters Affecting Performance of Pulsating Heat Pipe

Pawan Singh Kathait, Rajnish N. Sharma
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A023, August 29–September 1, 2017
Paper No: IPACK2017-74119
DOI: https://doi.org/10.1115/IPACK2017-74119
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Topics: Heat pipes, Computer cooling, Heat, Oscillations, Vapors, Bubbles, Construction, Design, Flux (Metallurgy), Heat transfer
Proceedings Papers

Integrated Vapor Chamber Heat Spreader for Power Module Applications

Clayton L. Hose, Dimeji Ibitayo, Lauren M. Boteler, Jens Weyant, Bradley Richard
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A013, August 29–September 1, 2017
Paper No: IPACK2017-74132
DOI: https://doi.org/10.1115/IPACK2017-74132
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Topics: Flat heat pipes, Vapors, Heat, Heat flux, Copper, Electronics, Flux (Metallurgy), Thermal resistance, Flow (Dynamics), Modeling
Proceedings Papers

Geometry Effects on Two-Phase Flow Regimes in a Diabatic Manifolded Microgap Channel

David C. Deisenroth, Avram Bar-Cohen, Michael Ohadi
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A025, August 29–September 1, 2017
Paper No: IPACK2017-74287
DOI: https://doi.org/10.1115/IPACK2017-74287
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Topics: Geometry, Two-phase flow, Cooling, Heat, Boiling, Evaporation, Flow (Dynamics), Manifolds, Cooling systems, Design
Proceedings Papers

Two-Phase Mini-Thermosyphon for Cooling of Datacenters: Experiments, Modeling and Simulations

Chin L. Ong, Raffaele L. Amalfi, Jackson B. Marcinichen, Nicolas Lamaison, John R. Thome
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A003, August 29–September 1, 2017
Paper No: IPACK2017-74030
DOI: https://doi.org/10.1115/IPACK2017-74030
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Topics: Cooling, Modeling, Simulation, Heat, Density, Energy dissipation, Flow (Dynamics), Temperature, Water, Acoustics
Proceedings Papers

Optimization of Graphite Composite Latent Heat Storage Systems

Anne Mallow, Kyle Gluesenkamp, Omar Abdelaziz, Samuel Graham
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A002, August 29–September 1, 2017
Paper No: IPACK2017-74244
DOI: https://doi.org/10.1115/IPACK2017-74244
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Topics: Composite materials, Graphite, Latent heat, Optimization, Storage, Density, Temperature, Heat, Power density, Thermal conductivity
Proceedings Papers

Embedded Two-Phase Cooling of Large 3D Compatible Chips With Radial Channels

Mark Schultz, Fanghao Yang, Evan Colgan, Robert Polastre, Bing Dang, Cornelia Tsang, Michael Gaynes, Pritish Parida, John Knickerbocker, Timothy Chainer
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A007, July 6–9, 2015
Paper No: IPACK2015-48348
DOI: https://doi.org/10.1115/IPACK2015-48348
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Topics: Cooling, Coolants, Temperature, Vehicles, Flux (Metallurgy), Heat, Dimensions, Flow (Dynamics), Heating, Pressure drop
Proceedings Papers

Quantitative Visualization of Vapor Bubble Growth in Diabatic Vapor-Liquid Microchannel Slug Flow

Todd A. Kingston, Justin A. Weibel, Suresh V. Garimella
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A014, July 6–9, 2015
Paper No: IPACK2015-48177
DOI: https://doi.org/10.1115/IPACK2015-48177
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Topics: Bubbles, Microchannels, Slug flows, Vapors, Visualization, Flow (Dynamics), Heating, Junctions, Boiling, Borosilicate glasses
Proceedings Papers

Quantification of Phase Change Material Energy Storage Capability Using Multiphysics Simulations

W. E. O’Connor, A. P. Wemhoff
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A065, July 6–9, 2015
Paper No: IPACK2015-48522
DOI: https://doi.org/10.1115/IPACK2015-48522
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Topics: Energy storage, Engineering simulation, Phase change materials, Simulation, Thermal energy storage, Finite element analysis, Heat flux, Heating, Latent heat, Melting
Proceedings Papers

Thermal Behavior of Rectangular Flux Channels With Discretely Specified Contact Flux and Temperature

Masood Razavi, Yuri S. Muzychka, Serpil Kocabiyik
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A050, July 6–9, 2015
Paper No: IPACK2015-48051
DOI: https://doi.org/10.1115/IPACK2015-48051
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Topics: Temperature, Boundary-value problems, Finite element methods, Computer software, Cooling, Flux (Metallurgy), Fourier series, Heat, Heat flux, Laplace equations
Proceedings Papers

Effect of Flow Guide Integration on the Thermal Performance of High Performance Liquid Cooled Immersion Server Modules

Joshua Gess, Tyler Dreher, Sushil Bhavnani, Wayne Johnson
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A047, July 6–9, 2015
Paper No: IPACK2015-48771
DOI: https://doi.org/10.1115/IPACK2015-48771
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Topics: Flow (Dynamics), Coolants, Pressure drop, Temperature, Energy dissipation, Fluids, Boiling, Cooling, Data centers, Design
Proceedings Papers

Performance and Integration Implications of Addressing Localized Hotspots Through Two Approaches: Clustering of Micro Pin-Fins and Dedicated Microgap Coolers

Craig E. Green, Peter A. Kottke, Thomas E. Sarvey, Andrei G. Fedorov, Yogendra Joshi, Muhannad S. Bakir
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A056, July 6–9, 2015
Paper No: IPACK2015-48537
DOI: https://doi.org/10.1115/IPACK2015-48537
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Topics: Coolers, Fins, Computer simulation, Cooling, Density, Flow (Dynamics), Flux (Metallurgy), Heat, Coolants, Design
Proceedings Papers

High Heat Flux Subcooled Flow Boiling of Methanol in Microtubes

Farzad Houshmand, Hyoungsoon Lee, Mehdi Asheghi, Kenneth E. Goodson
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A010, July 6–9, 2015
Paper No: IPACK2015-48734
DOI: https://doi.org/10.1115/IPACK2015-48734
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Topics: Boiling, Flow (Dynamics), Heat flux, Methanol, Subcooling, Critical heat flux, Flux (Metallurgy), Pressure drop, Heat, Cooling
Proceedings Papers

Multi-Objective Optimization of Micro Pin-Fin Arrays for Cooling of High Heat Flux Electronics With a Hot Spot

Sohail R. Reddy, Abas Abdoli, George S. Dulikravich, Cesar C. Pacheco, Genesis Vasquez, Rajesh Jha, Marcelo J. Colaco, Helcio R. B. Orlande
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A011, July 6–9, 2015
Paper No: IPACK2015-48242
DOI: https://doi.org/10.1115/IPACK2015-48242
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Topics: Cooling, Electronics, Heat flux, Pareto optimization, Fins, Stress, Temperature, Design, Shapes, Airfoils