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Proceedings Papers

Experimental Probing of the Bias Dependent Self-Heating in AlGaN/GaN HEMTs With a Transparent Indium Tin Oxide Gate

Anwarul Karim, Tae Kyoung Kim, Daniel Shoemaker, Yiwen Song, Joon Seop Kwak, Sukwon Choi
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T09A011, October 25–27, 2022
Paper No: IPACK2022-98800
DOI: https://doi.org/10.1115/IPACK2022-98800
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Topics: Gallium nitride, Gates (Closures), Heating, Reliability, Temperature, Transparency
Proceedings Papers

Thermal and Electrical Co-Optimization of a Multi-Chip Double-Sided Cooled GaN Module

Hayden Carlton, Md Maksudul Hossain, Arman Ur Rashid, Yuxiang Chen, Alan Mantooth, Asif Imran, Fang Luo, John Harris, Alexis Krone, David Huitink
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A004, October 26–28, 2021
Paper No: IPACK2021-72726
DOI: https://doi.org/10.1115/IPACK2021-72726
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Topics: Bridges (Structures), Cooling, Gallium nitride, Gates (Closures), Optimization
Proceedings Papers

Local Heat Energy Transport Analyses in Gallium-Indium-Nitride/Gallium Nitride Heterostructure by Microscopic Raman Imaging Exploiting Simultaneous Irradiation of Two Laser Beams

Shungo Okamoto, Naomichi Saito, Kotaro Ito, Bei Ma, Ken Morita, Daisuke Iida, Kazuhiro Ohkawa, Yoshihiro Ishitani
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A002, October 27–29, 2020
Paper No: IPACK2020-2570
DOI: https://doi.org/10.1115/IPACK2020-2570
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Topics: Gallium, Gallium nitride, Heat, Imaging, Irradiation (Radiation exposure), Laser beams
Proceedings Papers

Degradation of Gallium Nitride-Based Hall-Effect Sensors in High Temperature Environments

Alexis Krone, Hannah Alpert, Satish Shetty, Debbie G. Senesky, Gregory Salamo, David Huitink
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A008, October 27–29, 2020
Paper No: IPACK2020-2589
DOI: https://doi.org/10.1115/IPACK2020-2589
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Topics: Gallium, Gallium nitride, Hall effect, High temperature, Magnetic fields, Reliability, Sensors
Proceedings Papers

Integrated Optical Probing of the Thermal Dynamics of Wide Bandgap Power Electronics

James Spencer Lundh, Yiwen Song, Bikram Chatterjee, Albert G. Baca, Robert J. Kaplar, Andrew M. Armstrong, Andrew A. Allerman, Hyungtak Kim, Sukwon Choi
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A014, October 7–9, 2019
Paper No: IPACK2019-6440
DOI: https://doi.org/10.1115/IPACK2019-6440
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Topics: Dynamics (Mechanics), Electron mobility, Electronics, Energy gap, Gallium nitride, Heating, Imaging, Temperature measurement, Thermoreflectance, Transistors
Proceedings Papers

Correlated Effects of Self-Heating, Light Output, and Efficiency of GaN Light-Emitting Diodes on Junction Temperature

Bikramjit Chatterjee, James Spencer Lundh, Daniel Shoemaker, Tae Kyoung Kim, Joon Seop Kwak, Jaehee Cho, Sukwon Choi
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A004, October 7–9, 2019
Paper No: IPACK2019-6426
DOI: https://doi.org/10.1115/IPACK2019-6426
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Topics: Gallium nitride, Heating, Junctions, Light-emitting diodes, Temperature, Brightness (Photometry), Indium gallium nitride, Nanoparticles, Quantum wells, Temperature measurement
Proceedings Papers

Analysis of Thermal Properties of Power Multifinger HEMT Devices

Aleš Chvála, Robert Szobolovszký, Jaroslav Kováč, Jr., Martin Florovič, Juraj Marek, Luboš Černaj, Patrik Príbytný, Daniel Donoval, Jaroslav Kováč, Sylvain Laurent Delage, Jean-Claude Jacquet
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A003, August 27–30, 2018
Paper No: IPACK2018-8256
DOI: https://doi.org/10.1115/IPACK2018-8256
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Topics: Cooling, Design, Electrons, Gallium nitride, Heat, Manufacturing, Mechanical admittance, Optimization, Packaging, Raman spectroscopy
Proceedings Papers

Electrothermal Analysis of the Field-Plated AlGaN/GaN HEMTs With SiO 2 Passivation

Dogacan Kara, F. Nazli Donmezer Akgun
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A011, August 29–September 1, 2017
Paper No: IPACK2017-74125
DOI: https://doi.org/10.1115/IPACK2017-74125
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Topics: Gallium nitride, Plates (structures), Collapse, Electrons, Heating, Reliability, Electric fields, Electron mobility, Engineering simulation, Joules
Proceedings Papers

Numerical and Experimental Determination of Temperature Distribution in 3D Stacked Power Devices

Adam Morgan, Leila Choobineh, David Fresne, Douglas C. Hopkins
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A002, August 29–September 1, 2017
Paper No: IPACK2017-74222
DOI: https://doi.org/10.1115/IPACK2017-74222
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Topics: Temperature distribution, Electronic packaging, Packaging, Power density, Power semiconductor devices, Power conversion systems, Temperature, Computer simulation, Density, Gallium nitride
Proceedings Papers

Steady State and Transient Thermal Characterization of Vertical GaN PIN Diodes

Georges Pavlidis, James Dallas, Sukwon Choi, Shyh-Chiang Shen, Samuel Graham
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A011, August 29–September 1, 2017
Paper No: IPACK2017-74149
DOI: https://doi.org/10.1115/IPACK2017-74149
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Topics: Gallium nitride, Steady state, Thermal characterization, Transients (Dynamics), Temperature, Sapphire, Temperature distribution, Heating, Imaging, Joules
Proceedings Papers

Advanced Cooling Designs for GaN-on-Diamond MMICs

Geoffrey Campbell, Henry Eppich, Keith Lang, Carlton Creamer, Thomas Yurovchak, Kanin Chu, Adonis Kassinos, Michael Ohadi, Amir Shooshtari, Serguei Dessiatoun
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A007, July 6–9, 2015
Paper No: IPACK2015-48429
DOI: https://doi.org/10.1115/IPACK2015-48429
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Topics: Cooling, Diamonds, Gallium nitride, Temperature, Coolers, Microchannels, Thermal resistance, Cooling systems, Design, Engineering prototypes
Proceedings Papers

Inductive Coupled Plasma Etching of High Aspect Ratio Silicon Carbide Microchannels for Localized Cooling

Karen M. Dowling, Ateeq J. Suria, Yoonjin Won, Ashwin Shankar, Hyoungsoon Lee, Mehdi Asheghi, Kenneth E. Goodson, Debbie G. Senesky
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T07A006, July 6–9, 2015
Paper No: IPACK2015-48409
DOI: https://doi.org/10.1115/IPACK2015-48409
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Topics: Cooling, Microchannels, Plasma etching, Silicon, Gallium nitride, Electronics, Density, Etching, Finite element analysis, Heat transfer coefficients
Proceedings Papers

Novel Thermal Management of GaN Electronics: Diamond Substrates

Martin Kuball, James W. Pomeroy, Julian Anaya Calvo, Huarui Sun, Roland B. Simon, Daniel Francis, Firooz Faili, Daniel Twitchen, Stefano Rossi, Mohammed Alomari, Erhard Kohn, Lajos Tóth, Béla Pécz
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T08A001, July 6–9, 2015
Paper No: IPACK2015-48145
DOI: https://doi.org/10.1115/IPACK2015-48145
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Topics: Diamonds, Electronics, Gallium nitride, Thermal management, Thermal conductivity, Heat transfer, Junctions, Microwaves, Semiconductor wafers, Temperature
Proceedings Papers

Modeling and Simulation Challenges in Embedded Two Phase Cooling: DARPA’s ICECool Program

Kaiser Matin, Avram Bar-Cohen, Joseph J. Maurer
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A024, July 6–9, 2015
Paper No: IPACK2015-48334
DOI: https://doi.org/10.1115/IPACK2015-48334
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Topics: Cooling, Modeling, Simulation, Critical heat flux, Corrosion, Design, Electrodiffusion, Erosion, Fluids, Gallium nitride
Proceedings Papers

Intrinsic Thermal Conductivity of Wurtzite Al x Ga 1- x N, In x Ga 1- x N and In x Al 1- x N From First-Principles Calculation

Jinlong Ma, Baoling Huang, Wu Li, Xiaobing Luo
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A001, July 6–9, 2015
Paper No: IPACK2015-48032
DOI: https://doi.org/10.1115/IPACK2015-48032
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Topics: Thermal conductivity, Alloys, Crystals, Gallium nitride, Mean free path, Size effect, Temperature
Proceedings Papers

Computational Modeling of Extreme Heat Flux Microcooler for GaN-Based HEMT

Hyoungsoon Lee, Yoonjin Won, Farzad Houshmand, Catherine Gorle, Mehdi Asheghi, Kenneth E. Goodson
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A018, July 6–9, 2015
Paper No: IPACK2015-48670
DOI: https://doi.org/10.1115/IPACK2015-48670
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Topics: Computer simulation, Gallium nitride, Heat flux, Microcoolers, Microchannels, Simulation, Computational fluid dynamics, Flow (Dynamics), Fluids, Heat conduction
Proceedings Papers

Full Scale Simulation of an Integrated Monolithic Heat Sink for Thermal Management of a High Power Density GaN-SiC Chip

Tanya Liu, Farzad Houshmand, Catherine Gorle, Sebastian Scholl, Hyoungsoon Lee, Yoonjin Won, Mehdi Asheghi, Kenneth Goodson, Hooman Kazemi, Kenneth Vanhille
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A057, July 6–9, 2015
Paper No: IPACK2015-48592
DOI: https://doi.org/10.1115/IPACK2015-48592
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Topics: Gallium nitride, Heat sinks, Power density, Simulation, Thermal management, Cooling, Flow (Dynamics), Microchannels, Design, Heat transfer
Proceedings Papers

Thermally-Optimum Design of GaN-on-SiC HEMT

Caleb A. Holloway, Avram Bar-Cohen
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A052, July 6–9, 2015
Paper No: IPACK2015-48119
DOI: https://doi.org/10.1115/IPACK2015-48119
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Topics: Design, Gallium nitride, Temperature, Geometry, Heat, Interfacial thermal resistance, Junctions, Thermal resistance, Cooling, Dimensions
Proceedings Papers

The Impact of Interfacial Layers on the Thermal Boundary Resistance and Residual Stress in GaN on Si Epitaxial Layers

Luke Yates, Thomas L. Bougher, Thomas Beechem, Baratunde A. Cola, Samuel Graham
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A009, July 6–9, 2015
Paper No: IPACK2015-48259
DOI: https://doi.org/10.1115/IPACK2015-48259
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Topics: Gallium nitride, Interfacial thermal resistance, Stress, Polishing equipment, Electronics, Crystal structure, Electron mobility, Flow (Dynamics), Heat, Reliability
Proceedings Papers

Development of a Diamond Microfluidics-Based Intra-Chip Cooling Technology for GaN

David H. Altman, Anurag Gupta, Matthew Tyhach
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A006, July 6–9, 2015
Paper No: IPACK2015-48179
DOI: https://doi.org/10.1115/IPACK2015-48179
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Topics: Cooling, Diamonds, Gallium nitride, Microfluidics, Junctions, Heat, Integrated circuits, Packaging, Power density, Temperature