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Proceedings Papers

Optimal Arrangement of Multiple Heat Sources in Vertically Stacked Two-Layer 3-D IC Using Genetic Algorithm

Srikanth Rangarajan, Yaser Hadad, Leila Choobineh, Bahgat Sammakia
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A003, October 7–9, 2019
Paper No: IPACK2019-6334
DOI: https://doi.org/10.1115/IPACK2019-6334
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Topics: Artificial neural networks, Genetic algorithms, Heat
Proceedings Papers

Thermal-Hydraulic Performance and Optimization of Tube Ellipticity in a Plate Fin-and-Tube Heat Exchanger

Zhuo Yang, Tariq Amin Khan, Wei Li, Hua Zhu, Zhijian Sun, Zhengjiang Zhang, Jincai Du, Jianxin Zhou
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A022, August 27–30, 2018
Paper No: IPACK2018-8448
DOI: https://doi.org/10.1115/IPACK2018-8448
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Topics: Heat exchangers, Optimization, Artificial neural networks, Flow (Dynamics), Reynolds number, Friction, Pressure drop, Computational fluid dynamics, Computer simulation, Design
Proceedings Papers

Inverse Conduction Heat Transfer and Kriging Interpolation Applied to Temperature Sensor Location in Microchips

D. Gonzalez Cuadrado, A. Marconnet, G. Paniagua
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A028, August 29–September 1, 2017
Paper No: IPACK2017-74224
DOI: https://doi.org/10.1115/IPACK2017-74224
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Topics: Heat conduction, Heat transfer, Integrated circuits, Interpolation, Temperature sensors, Temperature, Optimization, Sensors, Finite element analysis, Genetic algorithms
Proceedings Papers

Multi-Objective Optimization of Micro Pin-Fin Arrays for Cooling of High Heat Flux Electronics With a Hot Spot

Sohail R. Reddy, Abas Abdoli, George S. Dulikravich, Cesar C. Pacheco, Genesis Vasquez, Rajesh Jha, Marcelo J. Colaco, Helcio R. B. Orlande
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A011, July 6–9, 2015
Paper No: IPACK2015-48242
DOI: https://doi.org/10.1115/IPACK2015-48242
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Topics: Cooling, Electronics, Heat flux, Pareto optimization, Fins, Stress, Temperature, Design, Shapes, Airfoils
Proceedings Papers

Numerical Optimization of Advanced Monolithic Microcoolers for High Heat Flux Microelectronics

Sebastian Scholl, Catherine Gorle, Farzad Houshmand, Mehdi Asheghi, Kenneth Goodson, Tom Verstraete
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A018, July 6–9, 2015
Paper No: IPACK2015-48123
DOI: https://doi.org/10.1115/IPACK2015-48123
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Topics: Heat flux, Microcoolers, Microelectronic devices, Optimization, Cooling, Fluids, Heat transfer, Computational fluid dynamics, Design, Engineering simulation
Proceedings Papers

Inverse Design of Cooling of Electronic Chips Subject to Specified Hot Spot Temperature and Coolant Inlet Temperature

Sohail R. Reddy, George S. Dulikravich
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A019, July 6–9, 2015
Paper No: IPACK2015-48346
DOI: https://doi.org/10.1115/IPACK2015-48346
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Topics: Coolants, Cooling, Design, Temperature, Heat, Heat flux, Fluids, Flux (Metallurgy), Airfoils, Computer cooling
Proceedings Papers

Prediction of Hot Aisle Partition Airflow Boundary Conditions

Zhihang Song, Bruce T. Murray, Bahgat Sammakia
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T09A002, July 16–18, 2013
Paper No: IPACK2013-73049
DOI: https://doi.org/10.1115/IPACK2013-73049
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Topics: Air flow, Boundary-value problems, Artificial neural networks, Computational fluid dynamics, Data centers, Computation, Flow (Dynamics), Server racks, Computer software, Design
Proceedings Papers

Genetic Algorithm for Nanoscale Electro-Thermal Optimization

Adam W. Skorek, Anna Gryko-Nikitin, Joanicjusz Nazarko
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 839-842, July 8–12, 2007
Paper No: IPACK2007-33827
DOI: https://doi.org/10.1115/IPACK2007-33827
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Topics: Genetic algorithms, Nanoscale phenomena, Optimization, Nanoelectronics, Heat, Optimization algorithms, Temperature
Proceedings Papers

Data Center Cooling Prediction Using Artificial Neural Network

Saurabh K. Shrivastava, James W. VanGilder, Bahgat G. Sammakia
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 765-771, July 8–12, 2007
Paper No: IPACK2007-33432
DOI: https://doi.org/10.1115/IPACK2007-33432
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Topics: Artificial neural networks, Cooling, Data centers, Computational fluid dynamics, Optimization, Air flow, Artificial intelligence, Errors, Genetic algorithms
Proceedings Papers

Multidisciplinary Heat Generating Logic Block Placement Optimization Using Genetic Algorithm

Tohru Suwa, Hamid Hadim
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 773-779, July 8–12, 2007
Paper No: IPACK2007-33443
DOI: https://doi.org/10.1115/IPACK2007-33443
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Topics: Electrical wires, Genetic algorithms, Heat, Optimization
Proceedings Papers

Multidisciplinary Placement Optimization of Heat Generating Electronic Components on Printed Circuit Boards Using Artificial Neural Networks

Tohru Suwa, Hamid A. Hadim
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 2079-2086, July 17–22, 2005
Paper No: IPACK2005-73178
DOI: https://doi.org/10.1115/IPACK2005-73178
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Topics: Artificial neural networks, Electronic components, Heat, Optimization, Printed circuit boards, Genetic algorithms, Algorithms, Cascades (Fluid dynamics), Density, Electrical wires
Proceedings Papers

Neural-Genetic Optimization of Temperature Control in a Continuous Flow Polymerase Chain Reaction Microdevice

Hing Wah Lee, Parthiban Arunasalam, Ishak A. Azid, Kankanhally N. Seetharamu
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 733-740, July 17–22, 2005
Paper No: IPACK2005-73280
DOI: https://doi.org/10.1115/IPACK2005-73280
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Topics: Chain, Flow (Dynamics), Optimization, Temperature control, Artificial neural networks, Finite element analysis, Microfluidics, Simulation results, Temperature distribution, Annealing
Proceedings Papers

Artificial Neural Network Trained, Genetic Algorithms Optimized Thermal Energy Storage Heatsinks for Electronics Cooling

Jeevan Kanesan, Parthiban Arunasalam, Kankanhalli N. Seetharamu, Ishak A. Azid
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1389-1395, July 17–22, 2005
Paper No: IPACK2005-73053
DOI: https://doi.org/10.1115/IPACK2005-73053
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Topics: Artificial neural networks, Computer cooling, Genetic algorithms, Thermal energy storage, Fins, Operating temperature, Optimization, Phase transition temperature, Computer simulation, Aluminum