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Proceedings Papers

SOH Degradation Estimation of Thin Flexible Li-Ion Power Sources Subjected to Accelerated Life Cycling With Randomized Charge-Discharge and C-Rates

Pradeep Lall, Ved Soni
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A010, October 25–27, 2022
Paper No: IPACK2022-97451
DOI: https://doi.org/10.1115/IPACK2022-97451
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Topics: Batteries, Biomedical equipment, Cycles, Electronics, Errors, Flexible electronics, Industrial research, Model validation, Modeling, Service life (Equipment)
Proceedings Papers

Life-Assessment for Thin Flexible Batteries Under U-Flex-to-Install and Dynamic Folding

Pradeep Lall, Ved Soni, Scott Miller
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A010, October 26–28, 2021
Paper No: IPACK2021-74115
DOI: https://doi.org/10.1115/IPACK2021-74115
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Topics: Batteries, Bending (Stress), Biomedical equipment, Electronics, Flexible electronics, Industrial research, Lithium-ion batteries, Regression models, Stress
Proceedings Papers

Effect of Flex-to-Install and Dynamic Folding on Li-Ion Battery Performance Degradation Subjected to Varying Orientations, Folding Speeds, Depths of Charge and C-Rates

Pradeep Lall, Ved Soni, Scott Miller
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A005, October 27–29, 2020
Paper No: IPACK2020-2661
DOI: https://doi.org/10.1115/IPACK2020-2661
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Topics: Lithium-ion batteries, Batteries, Industrial research, Reliability, Stress, Battery life, Bending (Stress), Biomedical equipment, Cycles, Electronics
Proceedings Papers

Thermal Metamaterials for Heat Flow Control in Electronics

Ercan M. Dede, Feng Zhou, Paul Schmalenberg, Tsuyoshi Nomura
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A006, August 29–September 1, 2017
Paper No: IPACK2017-74112
DOI: https://doi.org/10.1115/IPACK2017-74112
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Topics: Electronics, Flow control, Heat, Metamaterials, Flow (Dynamics), Anisotropy, Blocks (Building materials), Circuit design, Composite materials, Design
Proceedings Papers

Methods for Theoretical Assessment of Delamination Risks in Electronic Packaging

Torsten Hauck, Ilko Schmadlak, Nishant Lakhera, Sandeep Shantaram, David Samet, V. N. N. Trilochan Rambhatla, Suresh Sitaraman
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A007, August 29–September 1, 2017
Paper No: IPACK2017-74073
DOI: https://doi.org/10.1115/IPACK2017-74073
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Topics: Delamination, Electronic packaging, Fracture (Materials), Simulation, Electronic packages, Copper, Finite element analysis, Fracture mechanics, Risk, Stress
Proceedings Papers

A Study on Reliability of High-Temperature Joint in Packaging Structure

Takayuki Ishikawa, Toshikazu Oshidari, Hiromi Sugihara, Qiang Yu
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 45-51, July 6–8, 2011
Paper No: IPACK2011-52154
DOI: https://doi.org/10.1115/IPACK2011-52154
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Topics: High temperature, Packaging, Reliability, Nickel plating, Aluminum, Plating, Stress, Temperature, Cooling systems, Cycles
Proceedings Papers

Thermal Performance and Key Challenges for Future CPU Cooling Technologies

Ioan Sauciuc, Ravi Prasher, Je-Young Chang, Hakan Erturk, Gregory Chrysler, Chia-Pin Chiu, Ravi Mahajan
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 353-364, July 17–22, 2005
Paper No: IPACK2005-73242
DOI: https://doi.org/10.1115/IPACK2005-73242
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Topics: Blocks (Building materials), Boundary-value problems, Computer cooling, Cooling, Density, Design, Electrical conductivity, Heat pipes, Heat transfer, Industrial research
Proceedings Papers

An Overview of System in Package (SiP) Applications and Technologies for CPU and Communications Systems

Lesley Polka, Ravi Mahajan, Johanna Swan, Gaurang Choksi
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 971-975, July 17–22, 2005
Paper No: IPACK2005-73320
DOI: https://doi.org/10.1115/IPACK2005-73320
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Topics: System-in-package, Architecture, Industrial research, Packaging