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Proceedings Papers

Deep Learning for Prediction of Print Parameters and Realized Electrical Performance and Geometry on Inkjet Platform

Pradeep Lall, Shriram Kulkarni, Ved Soni, Kartik Goyal, Scott Miller

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A008, October 25–27, 2022

Paper No: IPACK2022-97437

DOI: https://doi.org/10.1115/IPACK2022-97437

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Topics: Artificial neural networks, Geometry, Inks, Printing, Dimensions, Particulate matter, Computer software, Control algorithms, Electronics, Regression models

Proceedings Papers

Predictive Methods for Electrical and Mechanical Process-Output for Inkjet Additive Printed Circuits

Pradeep Lall, Kartik Goyal, Scott Miller

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A004, October 25–27, 2022

Paper No: IPACK2022-97428

DOI: https://doi.org/10.1115/IPACK2022-97428

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Topics: Circuits, Drops, Electronics, Equipment performance, Experimental design, Inks, Manufacturing, Materials properties, Mechanical properties, Nanoparticles

Proceedings Papers

Mechanical and Electrical Properties of Additively Printed Circuits With Magnetically Orientated Anisotropic Conductive Adhesive Attachment for FHE Applications

Pradeep Lall, Jinesh Narangaparambil, Scott Miller

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A011, October 25–27, 2022

Paper No: IPACK2022-97456

DOI: https://doi.org/10.1115/IPACK2022-97456

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Topics: Adhesives, Anisotropy, Circuits, Electrical properties, Failure, Reliability, Temperature, Electronics, Low temperature, Bonding

Proceedings Papers

Additive Manufacturing of Electronic Patterns for Harsh Environments

Nicolas Delavault, Tanguy Lacondemine, Rémy Kalmar, Manuel Fendler, Sofiane Achache, Frederic Sanchette

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A001, October 25–27, 2022

Paper No: IPACK2022-94052

DOI: https://doi.org/10.1115/IPACK2022-94052

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Topics: Additive manufacturing, Extruding, Modeling, Strain measurement, Internet of things, Adhesives, Blocks (Building materials), Inks, Optimization, Oscillations

Proceedings Papers

Development of Multi-Layer Circuitry Using Electrically Conductive Adhesive and Low-Temperature Solder Material for Surface-Mount Component Attachment

Pradeep Lall, Jinesh Narangaparambil, Scott Miller

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A008, October 26–28, 2021

Paper No: IPACK2021-74086

DOI: https://doi.org/10.1115/IPACK2021-74086

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Topics: Adhesives, Flexible electronics, Inks, Low temperature, Printing, Solders, Surface mount components

Proceedings Papers

Performance Characteristics of Additively Printed Strain Gauges Under Different Conditions of Temperature and High Stress Loads

Pradeep Lall, Tony Thomas, Jinesh Narangaparambil

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A007, October 26–28, 2021

Paper No: IPACK2021-74074

DOI: https://doi.org/10.1115/IPACK2021-74074

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Topics: Performance characterization, Strain gages, Stress, Temperature, Inks, Printing, Sensors, Printed circuit boards, Silver, Vibration

Proceedings Papers

Repeatability and Extended Time Stability Study of an Additively Printed Strain Gauge Under Different Load Conditions

Pradeep Lall, Jinesh Narangaparambil, Tony Thomas, Kyle Schulze

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A011, October 26–28, 2021

Paper No: IPACK2021-74570

DOI: https://doi.org/10.1115/IPACK2021-74570

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Topics: Failure, Gages, Inks, Printing, Shear (Mechanics), Stability, Strain gages, Stress

Proceedings Papers

Print-Consistency and Process-Interaction for Inkjet-Printed Copper on Flexible Substrate

Pradeep Lall, Kartik Goyal, Kyle Schulze, Curtis Hill

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A003, October 26–28, 2021

Paper No: IPACK2021-74063

DOI: https://doi.org/10.1115/IPACK2021-74063

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Topics: Copper, Electronics, Inks, Sintering

Proceedings Papers

Development of Process-Recipes for Multi-Layer Circuitry Printing With Z-Axis Interconnects Using Aerosol-Jet Nanoparticle Ink

Pradeep Lall, Jinesh Narangaparambil, Ved Soni, Scott Miller

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A003, October 27–29, 2020

Paper No: IPACK2020-2664

DOI: https://doi.org/10.1115/IPACK2020-2664

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Topics: Aerosols, Failure, Inks, Nanoparticles, Printing, Shear (Mechanics), Stress

Proceedings Papers

Damage of Flexible Electronic Line Printed With Ag Nanoparticle Ink due to High-Current Density

Daiki Saito, Kazuhiko Sasagawa, Takeshi Moriwaki, Kazuhiro Fujisaki

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A001, October 7–9, 2019

Paper No: IPACK2019-6408

DOI: https://doi.org/10.1115/IPACK2019-6408

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Topics: Damage, Density, Flexible electronics, Inks, Nanoparticles, Metals, Anodes, Current density, Printing, Reliability

Proceedings Papers

Process Capability of Aerosol-Jet Additive Processes for Long-Runs up to 10-Hours

Pradeep Lall, Amrit Abrol, Nakul Kothari, Ben Leever, Scott Miller

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A003, October 7–9, 2019

Paper No: IPACK2019-6569

DOI: https://doi.org/10.1115/IPACK2019-6569

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Topics: Additive manufacturing, Aerosols, Temperature, Printing, Sintering, Shear (Mechanics), Stress, Failure, Manufacturing, Mechanical properties

Proceedings Papers

Direct Ink Printing of Cavities in DPC Ceramic Substrates With Kaolin Pastes for Hermetic Packaging

Qinglei Sun, Yang Peng, Hao Cheng, Yun Mou, Mingxiang Chen

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A006, October 7–9, 2019

Paper No: IPACK2019-6616

DOI: https://doi.org/10.1115/IPACK2019-6616

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Topics: Cavities, Ceramics, Inks, Kaolin, Packaging, Printing, Rheology

Proceedings Papers

Preliminary Results on the Fabrication of Interconnect Structures Using Microscale Selective Laser Sintering

Nilabh Roy, Obehi Dibua, Chee Seng Foong, Michael Cullinan

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A001, August 29–September 1, 2017

Paper No: IPACK2017-74173

DOI: https://doi.org/10.1115/IPACK2017-74173

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Topics: Lasers, Manufacturing, Microscale devices, Sintering, Fluence (Radiation measurement), Additive manufacturing, Copper, Density, Design, Energy dissipation

Proceedings Papers

A Model to Guide Template-Based Nanoparticle Printing Development

David A. Rolfe, Kristen L. Dorsey, Jim C. Cheng, Albert P. Pisano

Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T03A006, July 6–9, 2015

Paper No: IPACK2015-48449

DOI: https://doi.org/10.1115/IPACK2015-48449

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Topics: Nanoparticles, Printing, Inks, Sorption, Fluid dynamics, Fluids, Molding, Vapors, Diffusion (Physics), Engineering simulation

Proceedings Papers

3-D Antenna Structures Using Novel Direct-Write Additive Manufacturing Method

Md Taibur Rahman, Rahul Panat, Deuk Heo

Paper No: IPACK2015-48187

DOI: https://doi.org/10.1115/IPACK2015-48187

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Topics: Additive manufacturing, Aerosols, Metals, Inks, Manufacturing, Nanoparticles, Shapes, Sintering, Ultraviolet radiation, Wavelength

Proceedings Papers

Subtractive Laser Processing of Low Temperature Inkjet Printed Micro Electric Components of Functional Nano-Ink for Flexible Electronics

Seung Hwan Ko, Jaewon Chung, Yeonho Choi, David J. Hwang, Costas P. Grigoropoulos, Dimos Poulikakos

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1935-1941, July 17–22, 2005

Paper No: IPACK2005-73186

DOI: https://doi.org/10.1115/IPACK2005-73186

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Topics: Electrical components, Flexible electronics, Inks, Lasers, Low temperature, Nanoparticles

Proceedings Papers

Multilayer Direct-Writing of Electrical Conductors With Gold Nanoinks Using the Fountain-Pen Principle

Ce´dric P. R. Dockendorf, Tae-Youl Choi, Dimos Poulikakos, C. P. Grigoropoulos

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1959-1961, July 17–22, 2005

Paper No: IPACK2005-73497

DOI: https://doi.org/10.1115/IPACK2005-73497

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Topics: Circuits, Electronic circuits, Flexible electronics, Inks, Manufacturing, Melting point, Nanoparticles, Plastics, Probes, Silicon

NARROW

Deep Learning for Prediction of Print Parameters and Realized Electrical Performance and Geometry on Inkjet Platform

Predictive Methods for Electrical and Mechanical Process-Output for Inkjet Additive Printed Circuits

Mechanical and Electrical Properties of Additively Printed Circuits With Magnetically Orientated Anisotropic Conductive Adhesive Attachment for FHE Applications

Additive Manufacturing of Electronic Patterns for Harsh Environments

Development of Multi-Layer Circuitry Using Electrically Conductive Adhesive and Low-Temperature Solder Material for Surface-Mount Component Attachment

Performance Characteristics of Additively Printed Strain Gauges Under Different Conditions of Temperature and High Stress Loads

Repeatability and Extended Time Stability Study of an Additively Printed Strain Gauge Under Different Load Conditions

Print-Consistency and Process-Interaction for Inkjet-Printed Copper on Flexible Substrate

Development of Process-Recipes for Multi-Layer Circuitry Printing With Z-Axis Interconnects Using Aerosol-Jet Nanoparticle Ink

Damage of Flexible Electronic Line Printed With Ag Nanoparticle Ink due to High-Current Density

Process Capability of Aerosol-Jet Additive Processes for Long-Runs up to 10-Hours

Direct Ink Printing of Cavities in DPC Ceramic Substrates With Kaolin Pastes for Hermetic Packaging

Preliminary Results on the Fabrication of Interconnect Structures Using Microscale Selective Laser Sintering

A Model to Guide Template-Based Nanoparticle Printing Development

3-D Antenna Structures Using Novel Direct-Write Additive Manufacturing Method

Subtractive Laser Processing of Low Temperature Inkjet Printed Micro Electric Components of Functional Nano-Ink for Flexible Electronics

Multilayer Direct-Writing of Electrical Conductors With Gold Nanoinks Using the Fountain-Pen Principle

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