1-20 of 25
Manifolds
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

Comparative Study of Single-Phase Immersion Cooled Two Socket Server in Tank and Sled Configurations

Krishna Bhavana Sivaraju, Pratik Bansode, Gautam Gupta, Jacob Lamotte-Dawaghreh, Satyam Saini, Vibin Simon, Joseph Herring, II, Saket Karajgikar, Veerendra Mulay, Dereje Agonafer
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A010, October 25–27, 2022
Paper No: IPACK2022-97429
DOI: https://doi.org/10.1115/IPACK2022-97429
View Paper
PDF
Topics: Building renovation, Computational fluid dynamics, Coolants, Cooling, Data centers, Flow (Dynamics), Fluids, Geometry, Heat, Heat transfer
Proceedings Papers

Thermal Optimization of a Silicon Carbide, Half-Bridge Power Module

Gilberto Moreno, Joshua Major, Douglas DeVoto, Faisal Khan, Sreekant Narumanchi, Xuhui Feng, Paul Paret
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T09A003, October 25–27, 2022
Paper No: IPACK2022-97283
DOI: https://doi.org/10.1115/IPACK2022-97283
View Paper
PDF
Topics: Bridges (Structures), Electronics, Energy gap, Optimization, Silicon, Design, Thermal resistance, Computational fluid dynamics, Heat exchangers, Fluids
Proceedings Papers

Computational Models of Additive Manufactured Heat Spreading Device for Enhanced Localized Cooling

Zion Clarke, Sonya Smith, Reece Whitt, David Huitink
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T09A006, October 25–27, 2022
Paper No: IPACK2022-97446
DOI: https://doi.org/10.1115/IPACK2022-97446
View Paper
PDF
Topics: Additive manufacturing, Computer simulation, Cooling, Geometry, Heat, Heat sinks, Heat transfer, Manifolds, Nozzles
Proceedings Papers

Design and Fabrication of Graded Copper Inverse Opals (g-CIOs) for Capillary-Fed Boiling in High Heat Flux Cooling Applications

Qianying Wu, Chi Zhang, Mehdi Asheghi, Kenneth Goodson
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A011, October 27–29, 2020
Paper No: IPACK2020-2603
DOI: https://doi.org/10.1115/IPACK2020-2603
View Paper
PDF
Topics: Boiling, Cooling, Copper, Design, Heat flux, Manufacturing, Critical heat flux, Heat, Modeling, Permeability
Proceedings Papers

A Porous Medium Approach for Single-Phase Flow and Heat Transfer Modeling in Manifold Microchannel Heat Exchangers

Fabio Battaglia, Raphael Mandel, Amir Shooshtari, Michael M. Ohadi
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A002, October 27–29, 2020
Paper No: IPACK2020-2564
DOI: https://doi.org/10.1115/IPACK2020-2564
View Paper
PDF
Topics: Flow (Dynamics), Heat exchangers, Heat transfer, Manifolds, Microchannels, Modeling, Porous materials
Proceedings Papers

Addressing the Challenges in Laser Micro-Machining and Bonding of Silicon Microchannel Cold-Plate and 3D-Manifold for Embedded Cooling Applications: Perfect Debris Removal

Sougata Hazra, Ki Wook Jung, Madhusudan Iyengar, Chris Malone, Mehdi Asheghi, Kenneth E. Goodson
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A010, October 7–9, 2019
Paper No: IPACK2019-6539
DOI: https://doi.org/10.1115/IPACK2019-6539
View Paper
PDF
Topics: Bonding, Cooling, Lasers, Manifolds, Microchannels, Microfabrication, Micromachining, Silicon
Proceedings Papers

Parametric Study of Silicon-Based Embedded Microchannels With 3D Manifold Coolers (EMMC) for High Heat Flux (~1 kW/cm 2 ) Power Electronics Cooling

Ki Wook Jung, Sougata Hazra, Heungdong Kwon, Alisha Piazza, Edward Jih, Mehdi Asheghi, Man Prakash Gupta, Mike Degner, Kenneth E. Goodson
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A021, October 7–9, 2019
Paper No: IPACK2019-6472
DOI: https://doi.org/10.1115/IPACK2019-6472
View Paper
PDF
Topics: Computational fluid dynamics, Computer cooling, Coolers, Heat flux, Manifolds, Microchannels, Silicon, Water
Proceedings Papers

Experimental Investigation of Single-Phase Cooling in Embedded Microchannels: 3D Manifold Heat Exchanger With R-245fa

Ki Wook Jung, Hyoungsoon Lee, Chirag Kharangate, Feng Zhou, Mehdi Asheghi, Ercan M. Dede, Kenneth E. Goodson
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A007, October 7–9, 2019
Paper No: IPACK2019-6400
DOI: https://doi.org/10.1115/IPACK2019-6400
View Paper
PDF
Topics: Cooling, Heat exchangers, Manifolds, Microchannels
Proceedings Papers

Thermal and Mechanical Design of the Fastest Supercomputer of the World in Cognitive Systems: IBM POWER AC 922

Anil Yuksel, Vic Mahaney, Chris Marroquin, Shurong Tian, Mark Hoffmeyer, Mark Schultz, Todd Takken
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A006, October 7–9, 2019
Paper No: IPACK2019-6444
DOI: https://doi.org/10.1115/IPACK2019-6444
View Paper
PDF
Topics: Cooling, Design, Design engineering, Thermal management, Water, Graphics processing units, Electronic components, Flow (Dynamics), Artificial intelligence, Data centers
Proceedings Papers

Effect of Bonding Structure and Heater Design on Performance Enhancement of FEEDS Embedded Manifold-Microchannel Cooling

Daniel Bae, Raphael Mandel, Michael Ohadi
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A024, August 29–September 1, 2017
Paper No: IPACK2017-74158
DOI: https://doi.org/10.1115/IPACK2017-74158
View Paper
PDF
Topics: Bonding, Cooling, Design, Manifolds, Microchannels, Heat flux, Electronics, Fluids, Manufacturing, Computational fluid dynamics
Proceedings Papers

Geometry Effects on Two-Phase Flow Regimes in a Diabatic Manifolded Microgap Channel

David C. Deisenroth, Avram Bar-Cohen, Michael Ohadi
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A025, August 29–September 1, 2017
Paper No: IPACK2017-74287
DOI: https://doi.org/10.1115/IPACK2017-74287
View Paper
PDF
Topics: Geometry, Two-phase flow, Cooling, Heat, Boiling, Evaporation, Flow (Dynamics), Manifolds, Cooling systems, Design
Proceedings Papers

Modular Flow Structure Design for a Single-Phase Manifold Microchannel Cold Plate

Feng Zhou, Yan Liu, Shailesh N. Joshi, Yanghe Liu, Ercan M. Dede
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A008, July 6–9, 2015
Paper No: IPACK2015-48029
DOI: https://doi.org/10.1115/IPACK2015-48029
View Paper
PDF
Topics: Design, Flow (Dynamics), Manifolds, Microchannels, Cooling, Shapes, Coolants, Temperature, Channel flow, Computer cooling
Proceedings Papers

Thermal Solution of High Flux Phased Radar Antenna for Military Application

Murat Parlak, Murat Yaban
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A008, July 6–9, 2015
Paper No: IPACK2015-48055
DOI: https://doi.org/10.1115/IPACK2015-48055
View Paper
PDF
Topics: Defense industry, Radar, Design, Cooling, Heat flux, Manifolds, Computational fluid dynamics, Computer software, Finite element methods, Flow (Dynamics)
Proceedings Papers

Numerical Simulation of Advanced Monolithic Microcooler Designs for High Heat Flux Microelectronics

Sebastian Scholl, Catherine Gorle, Farzad Houshmand, Tanya Liu, Hyoungsoon Lee, Yoonjin Won, Mehdi Asheghi, Kenneth Goodson, Hooman Kazemi
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A009, July 6–9, 2015
Paper No: IPACK2015-48122
DOI: https://doi.org/10.1115/IPACK2015-48122
View Paper
PDF
Topics: Boundary-value problems, Computational fluid dynamics, Computer simulation, Cooling, Design, Fins, Flow (Dynamics), Fluid dynamics, Geometry, Heat conduction
Proceedings Papers

Full Scale Simulation of an Integrated Monolithic Heat Sink for Thermal Management of a High Power Density GaN-SiC Chip

Tanya Liu, Farzad Houshmand, Catherine Gorle, Sebastian Scholl, Hyoungsoon Lee, Yoonjin Won, Mehdi Asheghi, Kenneth Goodson, Hooman Kazemi, Kenneth Vanhille
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A057, July 6–9, 2015
Paper No: IPACK2015-48592
DOI: https://doi.org/10.1115/IPACK2015-48592
View Paper
PDF
Topics: Gallium nitride, Heat sinks, Power density, Simulation, Thermal management, Cooling, Flow (Dynamics), Microchannels, Design, Heat transfer
Proceedings Papers

Lid-Integral Cold Plate Topology Integration, Performance, and Reliability

Gerd Schlottig, Marco de Fazio, Werner Escher, Paola Granatieri, Vijayeshwar D. Khanna, Thomas Brunschwiler
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A004, July 6–9, 2015
Paper No: IPACK2015-48427
DOI: https://doi.org/10.1115/IPACK2015-48427
View Paper
PDF
Topics: Reliability, Topology, Silicon, Packaging, Composite materials, Cooling, Finite element model, Fracture (Materials), Fracture (Process), Gaskets
Proceedings Papers

Embedded Two-Phase Cooling of High Flux Electronics via Micro-Enabled Surfaces and Fluid Delivery Systems (FEEDS)

Raphael Mandel, Serguei Dessiatoun, Patrick McCluskey, Michael Ohadi
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A012, July 6–9, 2015
Paper No: IPACK2015-48496
DOI: https://doi.org/10.1115/IPACK2015-48496
View Paper
PDF
Topics: Cooling, Electronics, Fluids, Vapors, Heat flux, Pressure drop, Computational fluid dynamics, Engineering simulation, Experimental design, Heat transfer
Proceedings Papers

Development of a Diamond Microfluidics-Based Intra-Chip Cooling Technology for GaN

David H. Altman, Anurag Gupta, Matthew Tyhach
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A006, July 6–9, 2015
Paper No: IPACK2015-48179
DOI: https://doi.org/10.1115/IPACK2015-48179
View Paper
PDF
Topics: Cooling, Diamonds, Gallium nitride, Microfluidics, Junctions, Heat, Integrated circuits, Packaging, Power density, Temperature
Proceedings Papers

Embedded Cooling of High Heat Flux Electronics Utilizing Distributed Microfluidic Impingement Jets

John Ditri, Joseph Hahn, Roland Cadotte, Michael McNulty, Denise Luppa
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A014, July 6–9, 2015
Paper No: IPACK2015-48689
DOI: https://doi.org/10.1115/IPACK2015-48689
View Paper
PDF
Topics: Cooling, Electronics, Heat flux, Jets, Microfluidics, Simulation, Computational fluid dynamics, Reliability, Coolers, Cooling systems
Proceedings Papers

Applications of Cold Plate Units With Micro-Channel for Cooling Electronics

Koichi Mashiko, Masataka Mochizuki, Kazuhiko Goto, Makoto Takahashi, Masahiro Matsuda, Yasuhiro Horiuchi, Tien Nguyen
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A001, July 16–18, 2013
Paper No: IPACK2013-73028
DOI: https://doi.org/10.1115/IPACK2013-73028
View Paper
PDF
Topics: Cooling, Electronics, Microchannels, Computers, Water, Brazing, Cooling systems, Data centers, Collaboration, Design