Search Results | InterPACK | ASME Digital Collection

1-17 of 17

Sort by

Sort Order Select

Proceedings Papers

Advanced Cooling Designs for GaN-on-Diamond MMICs

Geoffrey Campbell, Henry Eppich, Keith Lang, Carlton Creamer, Thomas Yurovchak, Kanin Chu, Adonis Kassinos, Michael Ohadi, Amir Shooshtari, Serguei Dessiatoun

Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A007, July 6–9, 2015

Paper No: IPACK2015-48429

DOI: https://doi.org/10.1115/IPACK2015-48429

View Paper

Topics: Cooling, Diamonds, Gallium nitride, Temperature, Coolers, Microchannels, Thermal resistance, Cooling systems, Design, Engineering prototypes

Proceedings Papers

Novel Thermal Management of GaN Electronics: Diamond Substrates

Martin Kuball, James W. Pomeroy, Julian Anaya Calvo, Huarui Sun, Roland B. Simon, Daniel Francis, Firooz Faili, Daniel Twitchen, Stefano Rossi, Mohammed Alomari, Erhard Kohn, Lajos Tóth, Béla Pécz

Paper No: IPACK2015-48145

DOI: https://doi.org/10.1115/IPACK2015-48145

View Paper

Topics: Diamonds, Electronics, Gallium nitride, Thermal management, Thermal conductivity, Heat transfer, Junctions, Microwaves, Semiconductor wafers, Temperature

Proceedings Papers

Modeling and Simulation Challenges in Embedded Two Phase Cooling: DARPA’s ICECool Program

Kaiser Matin, Avram Bar-Cohen, Joseph J. Maurer

Paper No: IPACK2015-48334

DOI: https://doi.org/10.1115/IPACK2015-48334

View Paper

Topics: Cooling, Modeling, Simulation, Critical heat flux, Corrosion, Design, Electrodiffusion, Erosion, Fluids, Gallium nitride

Proceedings Papers

Development of a Diamond Microfluidics-Based Intra-Chip Cooling Technology for GaN

David H. Altman, Anurag Gupta, Matthew Tyhach

Paper No: IPACK2015-48179

DOI: https://doi.org/10.1115/IPACK2015-48179

View Paper

Topics: Cooling, Diamonds, Gallium nitride, Microfluidics, Junctions, Heat, Integrated circuits, Packaging, Power density, Temperature

Proceedings Papers

Non-Contact and Remote Measurement Method of the Change of the Electrical Conductivity of Carbon Nanotubes-Dispersed Resin Under Strain

Yusuke Ohashi, Yusuke Suzuki, Masato Ohnishi, Ken Suzuki, Hideo Miura

Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 703-708, July 6–8, 2011

Paper No: IPACK2011-52064

DOI: https://doi.org/10.1115/IPACK2011-52064

View Paper

Topics: Carbon, Electrical conductivity, Nanotubes, Resins, Carbon nanotubes, Microwaves, Reflectance, Impedance (Electricity), Stress, Electrical properties

Proceedings Papers

Optimization of the Tip of Microwave AFM Probe

Yang Ju, Motohiro Hamada, Atsushi Hosoi, Akifumi Fujimoto

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 485-490, July 19–23, 2009

Paper No: InterPACK2009-89252

DOI: https://doi.org/10.1115/InterPACK2009-89252

View Paper

Topics: Atomic force microscopy, Microwaves, Optimization, Probes, Gallium arsenide, Manufacturing, Resolution (Optics), Waveguides, Cantilevers, Diffraction gratings

Proceedings Papers

Fabrication of a GaAs Microwave Probe Used for Atomic Force Microscope

Yang Ju, Tetsuya Kobayashi, Hitoshi Soyama

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 963-966, July 8–12, 2007

Paper No: IPACK2007-33613

DOI: https://doi.org/10.1115/IPACK2007-33613

View Paper

Topics: Atomic force microscopy, Gallium arsenide, Manufacturing, Microwaves, Probes, Waveguides, Cantilevers, Diffraction gratings, Dimensions, Evaporation

Proceedings Papers

3D-SOP Millimeter-Wave Functions for High Data Rate Wireless Systems Using LTCC and LCP Technologies

J.-H. Lee, S. Sarkar, S. Pinel, J. Papapolymerou, J. Laskar, M. M. Tentzeris

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1607-1611, July 17–22, 2005

Paper No: IPACK2005-73127

DOI: https://doi.org/10.1115/IPACK2005-73127

View Paper

Topics: Millimeter waves, Design, Ceramics, Filters, Dimensions, Electromagnetic spectrum, Filtration, Internet, Liquid crystalline polymers, Low temperature

Proceedings Papers

Evaluation of Spiral Inductors Embedded in Low Temperature Co-Fired Ceramic Substrates

Woon Choi, Shintaro Ono, Seiichiro Yoshida, Hajime Tomokage

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1989-1993, July 17–22, 2005

Paper No: IPACK2005-73469

DOI: https://doi.org/10.1115/IPACK2005-73469

View Paper

Topics: Ceramics, Inductors, Low temperature, Design, Simulation results, Microscopes, Lasers, Microwaves, System-in-package

Proceedings Papers

Flip-Chip Assembly of RF MEMS for Microwave Hybrid Circuitry

Daniel J. Hyman, Roger Kuroda

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 2053-2056, July 17–22, 2005

Paper No: IPACK2005-73419

DOI: https://doi.org/10.1115/IPACK2005-73419

View Paper

Topics: Flip-chip assemblies, Microelectromechanical systems, Microwaves, Packaging, Flip-chip, Reliability, Filters, Performance characterization, Yield strength

Proceedings Papers

Fabrication of the Tip of GaAs Microwave Probe by Wet Etching

Yang Ju, Hiroyuki Sato, Hitoshi Soyama

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1919-1922, July 17–22, 2005

Paper No: IPACK2005-73140

DOI: https://doi.org/10.1115/IPACK2005-73140

View Paper

Topics: Chemical etching, Gallium arsenide, Manufacturing, Microwaves, Probes, Etching, Atomic force microscopy, Atoms, Microscopes, Semiconductor wafers

Proceedings Papers

Antenna Miniaturization Using Flexible PBG Materials

Pekka Salonen, Lauri Syda¨nheimo, Mikko Keskilammi

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 1-5, July 6–11, 2003

Paper No: IPACK2003-35010

DOI: https://doi.org/10.1115/IPACK2003-35010

View Paper

Topics: Ceramics, Design, Dimensions, Energy gap, Microwaves, Physical laws, Radiation (Physics), Resonance, Signals, Standing waves

Proceedings Papers

Characterization of Vertical Interconnects in 3-D System in a Package

Qinghua Kang, Altan M. Ferendeci

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 13-18, July 6–11, 2003

Paper No: IPACK2003-35247

DOI: https://doi.org/10.1115/IPACK2003-35247

View Paper

Topics: System-in-package, Circuits, Microwaves, Microelectromechanical systems, Dimensions, Junctions, Microfabrication, Millimeter waves, Transmission lines, Wavelength

Proceedings Papers

Characterization of A6 LTCC Systems for Microwave and Millimeter-Wave Applications

Liang Chai, Aziz Shaikh, Vern Stygar

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 827-831, July 6–11, 2003

Paper No: IPACK2003-35134

DOI: https://doi.org/10.1115/IPACK2003-35134

View Paper

Topics: Microwaves, Millimeter waves, Strip transmission lines, Ceramics, Metals, Silver, Arches, Capacitors, Cavities, Imaging

Proceedings Papers

Microwave Module Thermal Considerations for Future Higher Powered MMICs in Phased Array Radars

James S. Wilson

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 545-550, July 6–11, 2003

Paper No: IPACK2003-35256

DOI: https://doi.org/10.1115/IPACK2003-35256

View Paper

Topics: Design, Electricity (Physics), Energy dissipation, Energy generation, Heat, Integrated circuits, Junctions, Microwaves, Packaging, Radar

Proceedings Papers

Low Cycle Fatigue in RF Microwave Module Housings

Terry V. Baughn, Shea Chen

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 859-866, July 6–11, 2003

Paper No: IPACK2003-35263

DOI: https://doi.org/10.1115/IPACK2003-35263

View Paper

Topics: Low cycle fatigue, Microwaves, Metals, Pressure, Ceramics, Cycles, Electronics, High cycle fatigue, Circuits, Fatigue life

Proceedings Papers

Microwave Imaging of Conductivity Distribution of Silicon Wafers

Yang Ju, Masumi Saka, Hiroyuki Abe´

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 61-64, July 6–11, 2003

Paper No: IPACK2003-35117

DOI: https://doi.org/10.1115/IPACK2003-35117

View Paper

Topics: Electrical conductivity, Imaging, Microwaves, Semiconductor wafers, Thermal conductivity, Reflectance, Sensors, Signals, Resolution (Optics)

NARROW

Advanced Cooling Designs for GaN-on-Diamond MMICs

Novel Thermal Management of GaN Electronics: Diamond Substrates

Modeling and Simulation Challenges in Embedded Two Phase Cooling: DARPA’s ICECool Program

Development of a Diamond Microfluidics-Based Intra-Chip Cooling Technology for GaN

Non-Contact and Remote Measurement Method of the Change of the Electrical Conductivity of Carbon Nanotubes-Dispersed Resin Under Strain

Optimization of the Tip of Microwave AFM Probe

Fabrication of a GaAs Microwave Probe Used for Atomic Force Microscope

3D-SOP Millimeter-Wave Functions for High Data Rate Wireless Systems Using LTCC and LCP Technologies

Evaluation of Spiral Inductors Embedded in Low Temperature Co-Fired Ceramic Substrates

Flip-Chip Assembly of RF MEMS for Microwave Hybrid Circuitry

Fabrication of the Tip of GaAs Microwave Probe by Wet Etching

Antenna Miniaturization Using Flexible PBG Materials

Characterization of Vertical Interconnects in 3-D System in a Package

Characterization of A6 LTCC Systems for Microwave and Millimeter-Wave Applications

Microwave Module Thermal Considerations for Future Higher Powered MMICs in Phased Array Radars

Low Cycle Fatigue in RF Microwave Module Housings

Microwave Imaging of Conductivity Distribution of Silicon Wafers

Journals

Conference Proceedings

eBooks

Resources

Opportunities

Journals

Conference Proceedings

eBooks

Resources

Opportunities

This Feature Is Available To Subscribers Only