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Proceedings Papers

Characterization of Fatigue Crack Growth of Epoxy Molding Compounds Under High-Temperature Long-Term Aging

Pradeep Lall, Yunli Zhang, Jeff Suhling, Jaimal Williamson, Pat Thompson
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A014, October 25–27, 2022
Paper No: IPACK2022-97453
DOI: https://doi.org/10.1115/IPACK2022-97453
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Topics: Epoxy adhesives, Epoxy resins, Fatigue, Fatigue cracks, High temperature, Molding, Reliability
Proceedings Papers

Characterization of Linear Viscoelasticity Evolution of Epoxy Molding Compound Subjected to High Temperature Long Term Aging

Pradeep Lall, Yunli Zhang, Haotian Wu, Jeff Suhling, Edward Davis, Jaimal Williamson
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A023, October 26–28, 2021
Paper No: IPACK2021-74075
DOI: https://doi.org/10.1115/IPACK2021-74075
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Topics: Epoxy adhesives, Epoxy resins, High temperature, Molding, Viscoelasticity
Proceedings Papers

Double Side System in Package Development Challenge for Heterogeneous Integration

Feng Kao, Yu-Po Wang, Davidlion Wang, Jensen Tsai, Mike Tsai, Ryan Chiu, Eric He
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A004, October 7–9, 2019
Paper No: IPACK2019-6354
DOI: https://doi.org/10.1115/IPACK2019-6354
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Topics: System-in-package, Molding, Simulation, Accelerated life testing, Copper, Design, Energy dissipation, Internet of things, Manufacturing, Packaging
Proceedings Papers

Nanoindentation Measurements of the Mechanical Properties of Individual Phases Within Lead Free Solder Joints Subjected to Isothermal Aging

Abdullah Fahim, Sudan Ahmed, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A005, August 27–30, 2018
Paper No: IPACK2018-8408
DOI: https://doi.org/10.1115/IPACK2018-8408
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Topics: Lead-free solders, Mechanical properties, Nanoindentation, Tin, Solder joints, Particulate matter, Composite materials, Creep, Deformation, Elastic moduli
Proceedings Papers

Copper, Silver, and PCC Wirebonds Reliability in Automotive Underhood Environments

Pradeep Lall, Shantanu Deshpande, Luu Nguyen
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A006, August 27–30, 2018
Paper No: IPACK2018-8358
DOI: https://doi.org/10.1115/IPACK2018-8358
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Topics: Copper, Reliability, Silver, Wire, Failure mechanisms, Shear strength, High temperature, Shear (Mechanics), Wire bonding, Aluminum
Proceedings Papers

Piezoresistive Silicon Stress Sensor As a Tool to Monitor Health of an Electronic System

Alicja Palczynska, Alexandru Prisacaru, Przemyslaw Gromala, Bongtae Han, Dirk Mayer, Tobias Melz
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A004, August 29–September 1, 2017
Paper No: IPACK2017-74058
DOI: https://doi.org/10.1115/IPACK2017-74058
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Topics: Electronic systems, Sensors, Silicon, Stress, Algorithms, Delamination, Failure, Vehicles, Accelerated life testing, Acoustics
Proceedings Papers

An Investigation of Moisture-Induced Interfacial Delamination in Plastic IC Package During Solder Reflow

Jing Wang, Yuling Niu, Seungbae Park
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A011, August 29–September 1, 2017
Paper No: IPACK2017-74017
DOI: https://doi.org/10.1115/IPACK2017-74017
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Topics: Delamination, Reflow soldering, Fracture (Materials), Stress, Vapor pressure, Ball-Grid-Array packages, Displacement, Finite element analysis, Fracture mechanics, Lead-free solders
Proceedings Papers

A Model to Guide Template-Based Nanoparticle Printing Development

David A. Rolfe, Kristen L. Dorsey, Jim C. Cheng, Albert P. Pisano
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T03A006, July 6–9, 2015
Paper No: IPACK2015-48449
DOI: https://doi.org/10.1115/IPACK2015-48449
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Topics: Nanoparticles, Printing, Inks, Sorption, Fluid dynamics, Fluids, Molding, Vapors, Diffusion (Physics), Engineering simulation
Proceedings Papers

Characterization of Die Stresses in Plastic Packages Subjected to Moisture and Thermal Exposures

Quang Nguyen, M. Kaysar Rahim, Jordan C. Roberts, Jeffrey C. Suhling, Richard C. Jaeger
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A041, July 6–9, 2015
Paper No: IPACK2015-48627
DOI: https://doi.org/10.1115/IPACK2015-48627
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Topics: Stress, Shear stress, Molding, Storage, Weight (Mass), Computer simulation, Electronic packages, Engineering simulation, Failure, Finite element analysis
Proceedings Papers

Fuming Acid Based Decapsulation Process for Copper-Aluminum Wirebond System Molded With Different EMCs

Pradeep Lall, Shantanu Deshpande, Luu Nguyen
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A004, July 6–9, 2015
Paper No: IPACK2015-48638
DOI: https://doi.org/10.1115/IPACK2015-48638
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Topics: Aluminum, Copper, Wire, Temperature, Chemistry, Compression, Failure analysis, Image processing, Metals, Molding
Proceedings Papers

Chlorine-Ion Related Corrosion in Cu-Al Wirebond Microelectronic Packages

Pradeep Lall, Yihua Luo, Luu Nguyen
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A012, July 6–9, 2015
Paper No: IPACK2015-48639
DOI: https://doi.org/10.1115/IPACK2015-48639
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Topics: Corrosion, Wire, Diffusion (Physics), Electrolytic corrosion, Ions, Copper, Electrical resistivity, Molding, Temperature, Deformation
Proceedings Papers

A Microfluidic-Based Tactile Sensor for 3-DOF Force/Torque Detection

Yichao Yang, Zhili Hao
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T07A010, July 6–9, 2015
Paper No: IPACK2015-48133
DOI: https://doi.org/10.1115/IPACK2015-48133
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Topics: Microfluidics, Tactile sensors, Torque, Transducers, Microchannels, Electrolytes, Computer numerical control machine tools, Electrodes, Engineering prototypes, Lithography
Proceedings Papers

Characterization of Cure-Dependent Viscoelastic Behavior for Molding Compound and Application to Package Warpage Simulation

Tz-Cheng Chiu, Je-Li Kung, Yi-Shao Lai
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 9-17, July 19–23, 2009
Paper No: InterPACK2009-89040
DOI: https://doi.org/10.1115/InterPACK2009-89040
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Topics: Molding, Simulation, Viscoelasticity, Warping, Ball-Grid-Array packaging, Finite element analysis, Temperature, Constitutive equations, Cooling, Epoxy adhesives
Proceedings Papers

Characterization of Viscoelasticity of Molding Compounds in Time Domain

Seung-Hyun Chae, Jie-Hua Zhao, Darvin R. Edwards, Paul S. Ho
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 435-441, July 19–23, 2009
Paper No: InterPACK2009-89388
DOI: https://doi.org/10.1115/InterPACK2009-89388
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Topics: Molding, Viscoelasticity, Relaxation (Physics), Polymers, Stress, Microelectronic packaging, Stress analysis (Engineering), Temperature
Proceedings Papers

Investigation of Transfer Mold Process Effects on Semiconductor Package Warpage

Jason M. Brand, Myung J. Yim, Ravi Kumar
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 75-81, July 19–23, 2009
Paper No: InterPACK2009-89414
DOI: https://doi.org/10.1115/InterPACK2009-89414
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Topics: Materials properties, Molding, Package on package, Semiconductors (Materials), Warping
Proceedings Papers

Dimensional and Locational Integrity in the Replication of Polymeric Microdevices

Byoung Hee You, Daniel S. Park, Ping-Chuan Chen, Wilfredo M. Caceres, Dimitris E. Nikitopoulos, Steven A. Soper, Michael C. Murphy
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 955-959, July 8–12, 2007
Paper No: IPACK2007-33482
DOI: https://doi.org/10.1115/IPACK2007-33482
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Topics: Dimensions, Embossing, Injection molding, Manufacturing, Microfluidics, Molding, Polymers, Shrinkage (Materials), Thermal expansion
Proceedings Papers

Mold Adhesion Force Measurement

Huei-Huang Lee, Sheng-Jye Hwang, Durn-Yuan Huang, Yeong-Jyh Lin
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 51-58, July 8–12, 2007
Paper No: IPACK2007-33826
DOI: https://doi.org/10.1115/IPACK2007-33826
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Topics: Adhesion, Force measurement, Coatings, Molding, Engineers, Instrumentation, Temperature, Foundry coatings, Surface finishing, Cavities
Proceedings Papers

Stress-Induced Effects in Electronic Characteristics of n-Type MOSFETs in Resin-Molded Packages

Masaaki Koganemaru, Toru Ikeda, Noriyuki Miyazaki, Hajime Tomokage
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 277-284, July 8–12, 2007
Paper No: IPACK2007-33533
DOI: https://doi.org/10.1115/IPACK2007-33533
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Topics: Resins, Stress, Electron mobility, Molding, Diffusion (Physics), Experimental analysis, Silicon chips, Simulation
Proceedings Papers

Simulation of Warpage Considering Both Thermal and Cure Induced Shrinkage During Molding in IC Packaging

Shiang-Yu Teng, Sheng-Jye Hwang
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 867-872, July 17–22, 2005
Paper No: IPACK2005-73062
DOI: https://doi.org/10.1115/IPACK2005-73062
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Topics: Integrated circuit packaging, Molding, Shrinkage (Materials), Simulation, Warping, Pressure, Simulation models, Temperature, Thermal expansion
Proceedings Papers

Reliability of Low Glass Transition Temperature COTS PEM’s for Space Applications

M. Sandor, S. Agarwal, D. Peters, M. S. Cooper
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 809-815, July 6–11, 2003
Paper No: IPACK2003-35177
DOI: https://doi.org/10.1115/IPACK2003-35177
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Topics: Glass transition, Reliability, Molding, Proton exchange membranes, Temperature, Chemistry, Epoxy adhesives, Epoxy resins, Flame retardants, Manufacturing