Search Results | InterPACK | ASME Digital Collection

1-11 of 11

Sort by

Sort Order Select

Proceedings Papers

Pool Boiling Heat Transfer in Dielectric Fluids and Impact of Surfaces on the Repeatability

Tolga Emir, Yakup Gokalp Yazici, Mete Budakli, Mehmet Arik

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A002, October 25–27, 2022

Paper No: IPACK2022-97266

DOI: https://doi.org/10.1115/IPACK2022-97266

View Paper

Topics: Critical heat flux, Fluids, Heat transfer, Oxidation, Pool boiling

Proceedings Papers

Correlation of Microstructural Evolution With the Dynamic-Mechanical Viscoelastic Properties of Underfill Under Sustained High Temperature Operation

Pradeep Lall, Madhu Kasturi, Haotian Wu, Ed Davis, Jeff Suhling

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A012, October 27–29, 2020

Paper No: IPACK2020-2675

DOI: https://doi.org/10.1115/IPACK2020-2675

View Paper

Topics: Glass transition, High temperature, Mechanical properties, Optical microscopes, Oxidation, Viscoelasticity, Electronics, Operating temperature, Reliability, Storage

Proceedings Papers

Lab-on-a-Chip Device for Hydrogen Sulfide Sensing in Biomedical and Environmental Applications Using Electrochemical Approach

A. Baniya, S. Thapa, E. Borquist, D. Bailey, D. Wood, G. Dutta, P. Arumugam, J. Glawe, C. Kevil, L. Weiss

Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T05A002, July 6–9, 2015

Paper No: IPACK2015-48491

DOI: https://doi.org/10.1115/IPACK2015-48491

View Paper

Topics: Biomedicine, Hydrogen, Electrodes, Oxidation, Blood, Calibration, Chemistry, Diseases, Plasma desorption mass spectrometry, Plasmas (Ionized gases)

Proceedings Papers

Investigation of Liquid Metal Ohmic Contacts for Graphene Photonic Devices

Richard C. Ordonez, Noah Acosta, Jordan Melcher, Nackieb Kamin, David Garmire

Paper No: IPACK2015-48567

DOI: https://doi.org/10.1115/IPACK2015-48567

View Paper

Topics: Graphene, Liquid metals, Ohmic contacts, Photonic equipment, Contact resistance, Carbon, Engineering standards, Overlays (Materials engineering), Oxidation, Pressure

Proceedings Papers

Experimental Study of Damage Mechanism of Carbon Nanotube as Nano-Component of Electronic Devices Under High Current Density

Kazuhiko Sasagawa, Kazuhiro Fujisaki, Jun Unuma, Ryota Azuma

Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T03A003, July 16–18, 2013

Paper No: IPACK2013-73130

DOI: https://doi.org/10.1115/IPACK2013-73130

View Paper

Topics: Carbon nanotubes, Current density, Damage, Oxidation, Oxygen, Atoms, Carbon, Density, Electrodes, Electrodiffusion

Proceedings Papers

Effect of Oxygen Concentration on Damage Mechanism of Carbon Nanotubes Under High Current Density

Kazuhiko Sasagawa, Jun Unuma, Takehiro Abo

Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 487-491, July 6–8, 2011

Paper No: IPACK2011-52169

DOI: https://doi.org/10.1115/IPACK2011-52169

View Paper

Topics: Carbon nanotubes, Current density, Damage, Oxygen, Multi-walled carbon nanotubes, Oxidation, Carbon, Density, Electrodiffusion, Electrons

Proceedings Papers

Thermal-Structural Performance of Orthotropic Pin Fin Applications

Abul Fazal M. Arif, Syed M. Zubair

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 125-134, July 19–23, 2009

Paper No: InterPACK2009-89125

DOI: https://doi.org/10.1115/InterPACK2009-89125

View Paper

Topics: Composite materials, Cooling, Corrosion, Density, Design, Finite element methods, Heat sinks, Heat transfer, Materials properties, Metals

Proceedings Papers

Novel Cyanide Free Electroless Au Plating for the Reliable Joint Between Ni-P/Au and Sn-Ag-Cu Based Lead Free Solder

Akihiro Aiba, Kazumi Kawamura, Masashi Kumagai

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 873-877, July 17–22, 2005

Paper No: IPACK2005-73079

DOI: https://doi.org/10.1115/IPACK2005-73079

View Paper

Topics: Lead-free solders, Plating, Tin, Corrosion, Stability, Ball-Grid-Array packaging, Cyanide process, Displacement, Metals, Oxidation

Proceedings Papers

Mechanical Stress-Induced Damage on Breakdown Characteristic of Dielectric Thin Films in MOS Transistors

Hideo Miura, Hiroshi Moriya

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 729-734, July 6–11, 2003

Paper No: IPACK2003-35080

DOI: https://doi.org/10.1115/IPACK2003-35080

View Paper

Topics: Damage, Stress, Thin films, Transistors, Electrodes, Silicon, Bonding, Crystals, Deformation, Density

Proceedings Papers

Very High Performance Thermal Interface Material and Attachment Technology

Ralph L. Webb, Jin Wook Paek, David Pickrell

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 537-543, July 6–11, 2003

Paper No: IPACK2003-35253

DOI: https://doi.org/10.1115/IPACK2003-35253

View Paper

Topics: Alloys, Contact resistance, Contamination, Copper, Diffusion (Physics), Errors, Melting, Melting point, Modeling, Oxidation

Proceedings Papers

Evaluation of Surface Finish on Build Up Substrate

L. Y. Hung, Y. P. Wang, C. S. Hsiao

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 839-843, July 6–11, 2003

Paper No: IPACK2003-35153

DOI: https://doi.org/10.1115/IPACK2003-35153

View Paper

Topics: Finishes, High temperature, Intermetallic compounds, Nickel, Storage, Plating, Solder joints, Shear (Mechanics), Ball-Grid-Array packaging, Electrons

NARROW

Pool Boiling Heat Transfer in Dielectric Fluids and Impact of Surfaces on the Repeatability

Correlation of Microstructural Evolution With the Dynamic-Mechanical Viscoelastic Properties of Underfill Under Sustained High Temperature Operation

Lab-on-a-Chip Device for Hydrogen Sulfide Sensing in Biomedical and Environmental Applications Using Electrochemical Approach

Investigation of Liquid Metal Ohmic Contacts for Graphene Photonic Devices

Experimental Study of Damage Mechanism of Carbon Nanotube as Nano-Component of Electronic Devices Under High Current Density

Effect of Oxygen Concentration on Damage Mechanism of Carbon Nanotubes Under High Current Density

Thermal-Structural Performance of Orthotropic Pin Fin Applications

Novel Cyanide Free Electroless Au Plating for the Reliable Joint Between Ni-P/Au and Sn-Ag-Cu Based Lead Free Solder

Mechanical Stress-Induced Damage on Breakdown Characteristic of Dielectric Thin Films in MOS Transistors

Very High Performance Thermal Interface Material and Attachment Technology

Evaluation of Surface Finish on Build Up Substrate

Journals

Conference Proceedings

eBooks

Resources

Opportunities

Journals

Conference Proceedings

eBooks

Resources

Opportunities

This Feature Is Available To Subscribers Only