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Proceedings Papers

Additively Printed Flexible Charging Circuits and Effect on Evolution of Line Resistance and Charging Current in Charging Thin Flexible Batteries

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A009, October 25–27, 2022

Paper No: IPACK2022-97450

DOI: https://doi.org/10.1115/IPACK2022-97450

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Topics: Circuits, Electronics, Printing

Proceedings Papers

Deep Learning for Prediction of Print Parameters and Realized Electrical Performance and Geometry on Inkjet Platform

Pradeep Lall, Shriram Kulkarni, Ved Soni, Kartik Goyal, Scott Miller

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A008, October 25–27, 2022

Paper No: IPACK2022-97437

DOI: https://doi.org/10.1115/IPACK2022-97437

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Topics: Artificial neural networks, Geometry, Inks, Printing, Dimensions, Particulate matter, Computer software, Control algorithms, Electronics, Regression models

Proceedings Papers

Evolution of Circuit Performance With Sustained 50°C Temperature Exposure for Additively Printed Inkjet Circuits With SMT Components

Pradeep Lall, Kartik Goyal, Scott Miller

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A005, October 25–27, 2022

Paper No: IPACK2022-97430

DOI: https://doi.org/10.1115/IPACK2022-97430

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Topics: Circuits, Electronics, Temperature, Surface mount components, Filters, Manufacturing, Printing, Wearable devices, Energy dissipation, Heat

Proceedings Papers

Predictive Methods for Electrical and Mechanical Process-Output for Inkjet Additive Printed Circuits

Pradeep Lall, Kartik Goyal, Scott Miller

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A004, October 25–27, 2022

Paper No: IPACK2022-97428

DOI: https://doi.org/10.1115/IPACK2022-97428

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Topics: Circuits, Drops, Electronics, Equipment performance, Experimental design, Inks, Manufacturing, Materials properties, Mechanical properties, Nanoparticles

Proceedings Papers

Influence of Cure-Reflow Profile and High-Temperature Operation of Additively Printed Conductive Circuits on Performance and Reliability

Pradeep Lall, Jinesh Narangaparambil, Curtis Hill

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A012, October 25–27, 2022

Paper No: IPACK2022-97457

DOI: https://doi.org/10.1115/IPACK2022-97457

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Topics: Artificial neural networks, Circuits, Copper, Flexible electronics, High temperature, Reliability, Electrical resistivity, Sintering, Adhesives, Electronics

Proceedings Papers

Mechanical and Electrical Properties of Additively Printed Circuits With Magnetically Orientated Anisotropic Conductive Adhesive Attachment for FHE Applications

Pradeep Lall, Jinesh Narangaparambil, Scott Miller

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A011, October 25–27, 2022

Paper No: IPACK2022-97456

DOI: https://doi.org/10.1115/IPACK2022-97456

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Topics: Adhesives, Anisotropy, Circuits, Electrical properties, Failure, Reliability, Temperature, Electronics, Low temperature, Bonding

Proceedings Papers

Development of Multi-Layer Circuitry Using Electrically Conductive Adhesive and Low-Temperature Solder Material for Surface-Mount Component Attachment

Pradeep Lall, Jinesh Narangaparambil, Scott Miller

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A008, October 26–28, 2021

Paper No: IPACK2021-74086

DOI: https://doi.org/10.1115/IPACK2021-74086

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Topics: Adhesives, Flexible electronics, Inks, Low temperature, Printing, Solders, Surface mount components

Proceedings Papers

Performance Characteristics of Additively Printed Strain Gauges Under Different Conditions of Temperature and High Stress Loads

Pradeep Lall, Tony Thomas, Jinesh Narangaparambil

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A007, October 26–28, 2021

Paper No: IPACK2021-74074

DOI: https://doi.org/10.1115/IPACK2021-74074

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Topics: Performance characterization, Strain gages, Stress, Temperature, Inks, Printing, Sensors, Printed circuit boards, Silver, Vibration

Proceedings Papers

Repeatability and Extended Time Stability Study of an Additively Printed Strain Gauge Under Different Load Conditions

Pradeep Lall, Jinesh Narangaparambil, Tony Thomas, Kyle Schulze

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A011, October 26–28, 2021

Paper No: IPACK2021-74570

DOI: https://doi.org/10.1115/IPACK2021-74570

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Topics: Failure, Gages, Inks, Printing, Shear (Mechanics), Stability, Strain gages, Stress

Proceedings Papers

Printed Flexible LC Filter Using Additive Micro-Dispensing With Silver Conductive Paste and ECA for Component Attachment

Pradeep Lall, Jinesh Narangaparambil, Kyle Schulze, Scott Miller

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A006, October 26–28, 2021

Paper No: IPACK2021-74073

DOI: https://doi.org/10.1115/IPACK2021-74073

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Topics: Adhesives, Filters, Printing, Silver, Sintering

Proceedings Papers

Temperature Cycling Study of Aerosol-Jet Printed Conductive Silver Traces in Printed Electronics

Beihan Zhao, Christopher Riso, David Leslie, Abhijit Dasgupta, Siddhartha Das, Jason Fleischer, Daniel Hines

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A008, October 26–28, 2021

Paper No: IPACK2021-73197

DOI: https://doi.org/10.1115/IPACK2021-73197

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Topics: Aerosols, Electronics, Finite element methods, Finite element model, Modeling, Printing, Silver, Temperature

Proceedings Papers

Development of Process-Recipes for Multi-Layer Circuitry Printing With Z-Axis Interconnects Using Aerosol-Jet Nanoparticle Ink

Pradeep Lall, Jinesh Narangaparambil, Ved Soni, Scott Miller

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A003, October 27–29, 2020

Paper No: IPACK2020-2664

DOI: https://doi.org/10.1115/IPACK2020-2664

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Topics: Aerosols, Failure, Inks, Nanoparticles, Printing, Shear (Mechanics), Stress

Proceedings Papers

Damage of Flexible Electronic Line Printed With Ag Nanoparticle Ink due to High-Current Density

Daiki Saito, Kazuhiko Sasagawa, Takeshi Moriwaki, Kazuhiro Fujisaki

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A001, October 7–9, 2019

Paper No: IPACK2019-6408

DOI: https://doi.org/10.1115/IPACK2019-6408

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Topics: Damage, Density, Flexible electronics, Inks, Nanoparticles, Metals, Anodes, Current density, Printing, Reliability

Proceedings Papers

Process Capability of Aerosol-Jet Additive Processes for Long-Runs up to 10-Hours

Pradeep Lall, Amrit Abrol, Nakul Kothari, Ben Leever, Scott Miller

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A003, October 7–9, 2019

Paper No: IPACK2019-6569

DOI: https://doi.org/10.1115/IPACK2019-6569

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Topics: Additive manufacturing, Aerosols, Temperature, Printing, Sintering, Shear (Mechanics), Stress, Failure, Manufacturing, Mechanical properties

Proceedings Papers

Direct Ink Printing of Cavities in DPC Ceramic Substrates With Kaolin Pastes for Hermetic Packaging

Qinglei Sun, Yang Peng, Hao Cheng, Yun Mou, Mingxiang Chen

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A006, October 7–9, 2019

Paper No: IPACK2019-6616

DOI: https://doi.org/10.1115/IPACK2019-6616

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Topics: Cavities, Ceramics, Inks, Kaolin, Packaging, Printing, Rheology

Proceedings Papers

Effect of Process Parameters on Aerosol Jet Printing of Multi-Layer Circuitry

Pradeep Lall, Kartik Goyal, Nakul Kothari, Ben Leever, Scott Miller

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A005, October 7–9, 2019

Paper No: IPACK2019-6574

DOI: https://doi.org/10.1115/IPACK2019-6574

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Topics: Aerosols, Printing

Proceedings Papers

Experimental Study of Flexible Electrohydrodynamic Conduction Pumping for Electronics Cooling

Nicolas Vayas Tobar, Pavolas N. Christidis, Nathaniel J. O'Connor, Michal Talmor, Jamal Seyed-Yagoobi

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A012, August 27–30, 2018

Paper No: IPACK2018-8322

DOI: https://doi.org/10.1115/IPACK2018-8322

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Topics: Computer cooling, Electrohydrodynamics, Heat conduction, Pumps, Flow (Dynamics), Flexible electronics, Microscale devices, Actuators, Biology, Biomedicine

Proceedings Papers

All-Inorganic Multi-Color Converter Based on Eu3+-Doped Phosphor-in-Glass for White Light-Emitting Diodes

Yang Peng, Yun Mou, Xujia Xu, Hao Cheng, Hong Li, Mingxiang Chen, Xiaobing Luo

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A002, August 27–30, 2018

Paper No: IPACK2018-8225

DOI: https://doi.org/10.1115/IPACK2018-8225

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Topics: Glass, Light-emitting diodes, Phosphors, Emissions, Ions, Low temperature, Melting, Printing, Rendering, Sintering

Proceedings Papers

A Model to Guide Template-Based Nanoparticle Printing Development

David A. Rolfe, Kristen L. Dorsey, Jim C. Cheng, Albert P. Pisano

Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T03A006, July 6–9, 2015

Paper No: IPACK2015-48449

DOI: https://doi.org/10.1115/IPACK2015-48449

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Topics: Nanoparticles, Printing, Inks, Sorption, Fluid dynamics, Fluids, Molding, Vapors, Diffusion (Physics), Engineering simulation

Proceedings Papers

Basic Study on Transient Temperature Response of Papers in a Thermal Transfer Printer

Koichi Hirose, Takashi Fukue, Fumiya Nakagawa, Risa Ito, Tomoko Wauke, Hisashi Hoshino, Hirotoshi Terao

Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A019, July 16–18, 2013

Paper No: IPACK2013-73088

DOI: https://doi.org/10.1115/IPACK2013-73088

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Topics: Temperature, Transients (Dynamics), Printing, Contact resistance, Heat, Heating, Network analysis, Thermal papers

NARROW

Additively Printed Flexible Charging Circuits and Effect on Evolution of Line Resistance and Charging Current in Charging Thin Flexible Batteries

Deep Learning for Prediction of Print Parameters and Realized Electrical Performance and Geometry on Inkjet Platform

Evolution of Circuit Performance With Sustained 50°C Temperature Exposure for Additively Printed Inkjet Circuits With SMT Components

Predictive Methods for Electrical and Mechanical Process-Output for Inkjet Additive Printed Circuits

Influence of Cure-Reflow Profile and High-Temperature Operation of Additively Printed Conductive Circuits on Performance and Reliability

Mechanical and Electrical Properties of Additively Printed Circuits With Magnetically Orientated Anisotropic Conductive Adhesive Attachment for FHE Applications

Development of Multi-Layer Circuitry Using Electrically Conductive Adhesive and Low-Temperature Solder Material for Surface-Mount Component Attachment

Performance Characteristics of Additively Printed Strain Gauges Under Different Conditions of Temperature and High Stress Loads

Repeatability and Extended Time Stability Study of an Additively Printed Strain Gauge Under Different Load Conditions

Printed Flexible LC Filter Using Additive Micro-Dispensing With Silver Conductive Paste and ECA for Component Attachment

Temperature Cycling Study of Aerosol-Jet Printed Conductive Silver Traces in Printed Electronics

Development of Process-Recipes for Multi-Layer Circuitry Printing With Z-Axis Interconnects Using Aerosol-Jet Nanoparticle Ink

Damage of Flexible Electronic Line Printed With Ag Nanoparticle Ink due to High-Current Density

Process Capability of Aerosol-Jet Additive Processes for Long-Runs up to 10-Hours

Direct Ink Printing of Cavities in DPC Ceramic Substrates With Kaolin Pastes for Hermetic Packaging

Effect of Process Parameters on Aerosol Jet Printing of Multi-Layer Circuitry

Experimental Study of Flexible Electrohydrodynamic Conduction Pumping for Electronics Cooling

All-Inorganic Multi-Color Converter Based on Eu3+-Doped Phosphor-in-Glass for White Light-Emitting Diodes

A Model to Guide Template-Based Nanoparticle Printing Development

Basic Study on Transient Temperature Response of Papers in a Thermal Transfer Printer

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