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Proceedings Papers

Multifunctional Chip for Use in Thermal Analysis of Power Systems

David Gonzalez-Nino, Lauren Boteler, Damian P. Urciuoli, Iain M. Kierzewski, Dimeji Ibitayo, Pedro O. Quintero
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A014, August 27–30, 2018
Paper No: IPACK2018-8355
DOI: https://doi.org/10.1115/IPACK2018-8355
View Paper titled, Multifunctional Chip for Use in Thermal Analysis of Power Systems
Click here to open pdf in another window PDF for Multifunctional Chip for Use in Thermal Analysis of Power Systems
Topics: Design, Electronic systems, Flux (Metallurgy), Heat, Heat flux, High temperature, Instrumentation, Junctions, Military systems, Power systems (Machinery)
Proceedings Papers

Local Measurements of Flow Boiling Heat Transfer on Hot Spots in 3D Compatible Radial Microchannels

Fanghao Yang, Mark Schultz, Pritish Parida, Evan Colgan, Robert Polastre, Bing Dang, Cornelia Tsang, Michael Gaynes, John Knickerbocker, Timothy Chainer
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A006, July 6–9, 2015
Paper No: IPACK2015-48341
DOI: https://doi.org/10.1115/IPACK2015-48341
View Paper titled, Local Measurements of Flow Boiling Heat Transfer on Hot Spots in 3D Compatible Radial Microchannels
Click here to open pdf in another window PDF for Local Measurements of Flow Boiling Heat Transfer on Hot Spots in 3D Compatible Radial Microchannels
Topics: Boiling, Flow (Dynamics), Heat transfer, Microchannels, Heating, Temperature, Cooling, Resistance thermometers, Coolants, Density