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Proceedings Papers

Power Envelope Analysis for the Thermal Optimization of a Chiplet Module

Eric Ouyang, Xiao Gu, Yonghyuk Jeong, Michael Liu

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A001, October 25–27, 2022

Paper No: IPACK2022-97204

DOI: https://doi.org/10.1115/IPACK2022-97204

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Topics: Design, Heat sinks, Junctions, Optimization, Reliability, Resistors, Risk, Simulation, Temperature

Proceedings Papers

PHM Features for Large Circuit Boards to Be Implemented Into Electric Drivetrain Applications

A. Otto, E. Kaulfersch, P. Singh, C. Romano, M. Hildebrandt, S. Rzepka

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A005, October 27–29, 2020

Paper No: IPACK2020-2614

DOI: https://doi.org/10.1115/IPACK2020-2614

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Topics: Printed circuit boards, Thermomechanics, Stress, Ceramics, Control panels, Deformation, Electronic components, Experimental methods, Finite element analysis, Reliability

Proceedings Papers

Design and Calibration of Resistive Stress Sensors on 4H Silicon Carbide

Richard C. Jaeger, Jun Chen, Jeffrey C. Suhling, Leonid Fursin

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A001, August 27–30, 2018

Paper No: IPACK2018-8219

DOI: https://doi.org/10.1115/IPACK2018-8219

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Topics: Calibration, Design, Sensors, Silicon, Stress, Resistors, Temperature, Aerospace systems, Drilling, Geothermal power stations

Proceedings Papers

Thermal Characterization of Si BEOL Microelectronic Structures

Assaad El Helou, Peter E. Raad, Archana Venugopal, Dhishan Kande

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A002, August 27–30, 2018

Paper No: IPACK2018-8350

DOI: https://doi.org/10.1115/IPACK2018-8350

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Topics: Computer simulation, Design, Dimensions, Heat sinks, Operating temperature, Reliability, Resistors, Temperature, Thermal characterization, Thermal properties

Proceedings Papers

Multifunctional Chip for Use in Thermal Analysis of Power Systems

David Gonzalez-Nino, Lauren Boteler, Damian P. Urciuoli, Iain M. Kierzewski, Dimeji Ibitayo, Pedro O. Quintero

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A014, August 27–30, 2018

Paper No: IPACK2018-8355

DOI: https://doi.org/10.1115/IPACK2018-8355

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Topics: Design, Electronic systems, Flux (Metallurgy), Heat, Heat flux, High temperature, Instrumentation, Junctions, Military systems, Power systems (Machinery)

Proceedings Papers

Power Packaging Thermal and Stress Model for Quick Parametric Analyses

L. M. Boteler, S. M. Miner

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A012, August 29–September 1, 2017

Paper No: IPACK2017-74130

DOI: https://doi.org/10.1115/IPACK2017-74130

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Topics: Packaging, Stress, Finite element analysis, Design, Matlab, Temperature, Thermal stresses, Computer-aided design, Resistors, Computer-aided engineering

Proceedings Papers

Computational Strategies to Minimize Transient Response During Time-Domain Analysis of Structures Under Vibratory Loading

Matthew Ernst, Cholmin Choi, Abhijit Dasgupta

Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A014, July 16–18, 2013

Paper No: IPACK2013-73200

DOI: https://doi.org/10.1115/IPACK2013-73200

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Topics: Time-domain analysis, Transients (Dynamics), Finite element analysis, Cycles, Dynamic analysis, Vibration, Cantilever beams, Circuits, Durability, Manufacturing

Proceedings Papers

Examination of Solder Interconnects Formed on ENEPIG Finished Printed Wiring Boards Under Drop Loading Conditions

Adam Pearl, Michael Osterman

Paper No: IPACK2013-73278

DOI: https://doi.org/10.1115/IPACK2013-73278

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Topics: Printed circuit boards, Solders, Finishes, Failure mechanisms, Lumber, Reliability, Cracking (Materials), Fracture (Process), Resistors, Shock (Mechanics)

Proceedings Papers

Two-Phase Minichannel Cold Plate for Army Vehicle Power Electronics

Darin J. Sharar, Brian Morgan, Nicholas R. Jankowski, Avram Bar-Cohen

Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 133-142, July 6–8, 2011

Paper No: IPACK2011-52079

DOI: https://doi.org/10.1115/IPACK2011-52079

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Topics: Army, Electronics, Vehicles, Temperature, Energy dissipation, Heat, Coolants, Cooling, Design, Electrical resistivity

Proceedings Papers

Three Dimensional and Nondestructive Evaluation of Thermal Fatigue Crack Propagation Process in Complex-Shaped Solder Joints by Synchrotron Radiation X-Ray Micro-Tomography

Hiroyuki Tsuritani, Toshihiko Sayama, Yoshiyuki Okamoto, Takeshi Takayanagi, Kentaro Uesugi, Takao Mori

Paper No: IPACK2011-52047

DOI: https://doi.org/10.1115/IPACK2011-52047

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Topics: Fatigue cracks, Nondestructive evaluation, Solder joints, Synchrotron radiation, X-rays, Crack propagation, Fatigue, Fracture (Materials), Microcracks, Computerized tomography

Proceedings Papers

A First-Principle Guided Circuit Simulator of Linear Complexity and its Linear Speedup for Die-Package Co-Design

Qing He, Duo Chen, Dan Jiao

Paper No: IPACK2011-52276

DOI: https://doi.org/10.1115/IPACK2011-52276

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Topics: Circuits, Design, Simulation, Capacitors, Complementary metal oxide semiconductors, Computation, Electromagnetic force, Electromagnetism, Inductors, Resistors

Proceedings Papers

Development of Boundary Condition Independent Compact Thermal Models for Opto-Electronic Packages

Arun Prakash Raghupathy, Attila Aranyosi, Urmila Ghia, Karman Ghia, William Maltz

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 741-751, July 19–23, 2009

Paper No: InterPACK2009-89092

DOI: https://doi.org/10.1115/InterPACK2009-89092

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Topics: Boundary-value problems, Heat, Construction, Design, Errors, Flow (Dynamics), Junctions, Matlab, Natural convection, Optimization

Proceedings Papers

Nondestructive Evaluation of Thermal Fatigue Crack Propagation in Sn-Ag-Cu Solder Joints by Synchrotron Radiation X-Ray Micro-Tomography

Hiroyuki Tsuritani, Toshihiko Sayama, Yoshiyuki Okamoto, Takeshi Takayanagi, Kentaro Uesugi, Takao Mori

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 761-769, July 19–23, 2009

Paper No: InterPACK2009-89155

DOI: https://doi.org/10.1115/InterPACK2009-89155

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Topics: Fatigue cracks, Nondestructive evaluation, Solder joints, Synchrotron radiation, Tin, X-rays, Solders, Crack propagation, Cycles, Computerized tomography

Proceedings Papers

Thermal Shock and Drop Test Behaviour of Area Array Packages in Forward and Backward Compatible Assemblies

Bankeem V. Chheda, Sathishkumar Sakthivelan, S. Manian Ramkumar, Reza Ghaffarian

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 309-316, July 19–23, 2009

Paper No: InterPACK2009-89321

DOI: https://doi.org/10.1115/InterPACK2009-89321

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Topics: Thermal shock, Solders, Alloys, Failure, Chain, Manufacturing, Solder joints, Ball-Grid-Array packaging, Finishes, Lead-free solders

Proceedings Papers

Stress Measurement Errors in Flip Chip Packages Using Multi-Element Sensor Rosettes on (111) Silicon

Richard C. Jaeger, Jeffrey C. Suhling, Safina Hussain, Jordan C. Roberts, Mohammad A. Motalab, Chun-Hyung Cho

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 15-25, July 19–23, 2009

Paper No: InterPACK2009-89245

DOI: https://doi.org/10.1115/InterPACK2009-89245

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Topics: Errors, Flip-chip packages, Sensors, Silicon, Stress, Temperature, Integrated circuits, Electronic packages, Finite element model, Flip-chip

Proceedings Papers

Application of Phase Growth Approach to Prediction of Thermal Fatigue Crack Initiation Lifetime in Sn-3.0Ag-0.5Cu Solder Joints

Yoshiyuki Okamoto, Takeshi Takayanagi, Toshihiko Sayama, Yasuhiro Ejiri, Hiroyuki Nakano, Takao Mori

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 809-814, July 19–23, 2009

Paper No: InterPACK2009-89262

DOI: https://doi.org/10.1115/InterPACK2009-89262

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Topics: Fatigue cracks, Solder joints, Tin, Cycles, Fatigue damage, Fracture (Materials), Printed circuit boards, Resistors, Scanning electron microscopes, Solders

Proceedings Papers

Characterization of the Piezoresistive Coefficients of (100) Silicon From −150 to +125C

Chun-Hyung Cho, Richard C. Jaeger, Jeffrey C. Suhling

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 451-464, July 8–12, 2007

Paper No: IPACK2007-33053

DOI: https://doi.org/10.1115/IPACK2007-33053

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Topics: Silicon, Stress, Temperature, Sensors, Anisotropy, Calibration, Chemical etching, Electrical resistivity, Electron mobility, Engineering simulation

Proceedings Papers

A New Resistor-Capacitor (RC) Transient Thermal Network Approach for Power Amplifier Module in Handheld Telecommunication

Youmin Yu, Victor Adrian Chiriac, Tien-Yu Tom Lee

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 783-790, July 8–12, 2007

Paper No: IPACK2007-33335

DOI: https://doi.org/10.1115/IPACK2007-33335

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Topics: Capacitors, Resistors, Telecommunications, Transients (Dynamics), Temperature, Cycles, Heat, Topology, Curve fitting, Simulation

Proceedings Papers

Chip-on-Beam and Hydrostatic Calibration of the Piezoresistive Coefficients on (111) Silicon

Chun-Hyung Cho, Richard C. Jaeger, Jeffrey C. Suhling, M. Kaysar Rahim

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 297-307, July 8–12, 2007

Paper No: IPACK2007-33570

DOI: https://doi.org/10.1115/IPACK2007-33570

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Topics: Calibration, Hydrostatics, Silicon, Stress, Sensors, Temperature, Pressure, Electrical resistivity, Experimental methods, Manufacturing

Proceedings Papers

Effect of Forward and Backward Compatibility of Solder Paste and Component Finish on Fine-Pitch Component Assemblies Using ENIG and IMAG PWB Finishes

Anand Kannabiran, Sreekanth Varma Penmatsa, S. Manian Ramkumar, Reza Ghaffarian

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 945-952, July 8–12, 2007

Paper No: IPACK2007-33963

DOI: https://doi.org/10.1115/IPACK2007-33963

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Topics: Finishes, Printed circuit boards, Solders, Tin, Manufacturing, Solder joints, Testing, Design, Intermetallic compounds, Surface mount packaging

NARROW

Power Envelope Analysis for the Thermal Optimization of a Chiplet Module

PHM Features for Large Circuit Boards to Be Implemented Into Electric Drivetrain Applications

Design and Calibration of Resistive Stress Sensors on 4H Silicon Carbide

Thermal Characterization of Si BEOL Microelectronic Structures

Multifunctional Chip for Use in Thermal Analysis of Power Systems

Power Packaging Thermal and Stress Model for Quick Parametric Analyses

Computational Strategies to Minimize Transient Response During Time-Domain Analysis of Structures Under Vibratory Loading

Examination of Solder Interconnects Formed on ENEPIG Finished Printed Wiring Boards Under Drop Loading Conditions

Two-Phase Minichannel Cold Plate for Army Vehicle Power Electronics

Three Dimensional and Nondestructive Evaluation of Thermal Fatigue Crack Propagation Process in Complex-Shaped Solder Joints by Synchrotron Radiation X-Ray Micro-Tomography

A First-Principle Guided Circuit Simulator of Linear Complexity and its Linear Speedup for Die-Package Co-Design

Development of Boundary Condition Independent Compact Thermal Models for Opto-Electronic Packages

Nondestructive Evaluation of Thermal Fatigue Crack Propagation in Sn-Ag-Cu Solder Joints by Synchrotron Radiation X-Ray Micro-Tomography

Thermal Shock and Drop Test Behaviour of Area Array Packages in Forward and Backward Compatible Assemblies

Stress Measurement Errors in Flip Chip Packages Using Multi-Element Sensor Rosettes on (111) Silicon

Application of Phase Growth Approach to Prediction of Thermal Fatigue Crack Initiation Lifetime in Sn-3.0Ag-0.5Cu Solder Joints

Characterization of the Piezoresistive Coefficients of (100) Silicon From −150 to +125C

A New Resistor-Capacitor (RC) Transient Thermal Network Approach for Power Amplifier Module in Handheld Telecommunication

Chip-on-Beam and Hydrostatic Calibration of the Piezoresistive Coefficients on (111) Silicon

Effect of Forward and Backward Compatibility of Solder Paste and Component Finish on Fine-Pitch Component Assemblies Using ENIG and IMAG PWB Finishes

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