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Proceedings Papers

Liquid to Liquid Cooling for High Heat Density Liquid Cooled Data Centers

Ali Heydari, Pardeep Shahi, Vahideh Radmard, Bahareh Eslami, Uschas Chowdhury, Satyam Saini, Pratik Bansode, Harold Miyamura, Dereje Agonafer, Jeremy Rodriguez
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A007, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97416
https://doi.org/10.1115/IPACK2022-97416
View Paper titled, Liquid to Liquid Cooling for High Heat Density Liquid Cooled Data Centers
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Topics: Cooling, Data centers, Density, Heat, Plates (structures), Coolants, Cooling systems, Flow (Dynamics), Modeling, Server racks
Proceedings Papers

Experimental Validation and Design Simulations of a Passive Two-Phase Cooling System for Datacenters

Jackson B. Marcinichen, John R. Thome, Raffaele L. Amalfi, Filippo Cataldo
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A001, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2541
https://doi.org/10.1115/IPACK2020-2541
View Paper titled, Experimental Validation and Design Simulations of a Passive Two-Phase Cooling System for Datacenters
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Topics: Cooling systems, Design, Engineering simulation, Simulation, Cooling, Flow (Dynamics), Heat, Architecture, Boiling, Computer cooling
Proceedings Papers

Ultra-Compact Micro-Scale Heat Exchanger for Advanced Thermal Management in Datacenters

Raffaele L. Amalfi, Todd Salamon, Filippo Cataldo, Jackson B. Marcinichen, John R. Thome
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A002, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2542
https://doi.org/10.1115/IPACK2020-2542
View Paper titled, Ultra-Compact Micro-Scale Heat Exchanger for Advanced Thermal Management in Datacenters
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Topics: Heat exchangers, Microscale devices, Thermal management, Cooling, Heat, Pressure drop, Density, Flow (Dynamics), Heat transfer, Refrigerants
Proceedings Papers

Thermodynamic Characterization of a Direct Water Cooled Server Rack Running Synthetic and Real High Performance Computing Work Loads

Lynn Parnell, Garrison Vaughan, John Thompson, Daniel Duffy, Louis Capps, Mark E. Steinke, Vinod Kamath
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A031, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48470
https://doi.org/10.1115/IPACK2015-48470
View Paper titled, Thermodynamic Characterization of a Direct Water Cooled Server Rack Running Synthetic and Real High Performance Computing Work Loads
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Topics: Server racks, Stress, Water, Cooling, Flow (Dynamics), Temperature, Computers, Coolants, Density, Design
Proceedings Papers

Rack Server Solution in Data Center

Sheng Kang, Guofeng Chen, Chun Wang, Ruiquan Ding, Jiajun Zhang, Pinyan Zhu, Chao Liu, Nishi Ahuja
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A042, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48258
https://doi.org/10.1115/IPACK2015-48258
View Paper titled, Rack Server Solution in Data Center
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Topics: Data centers, Cooling, Energy consumption, Design, Fans, Air flow, Energy efficiency, Server racks, Cloud computing, Heat
Proceedings Papers

Raised Floor Hybrid Cooled Data Center: Effect on Rack Inlet Air Temperatures When In Row Cooling Units are Installed Between the Racks

Tianyi Gao, James Geer, Russell Tipton, Bruce Murray, Bahgat G. Sammakia, Alfonso Ortega, Roger Schmidt
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A012, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48071
https://doi.org/10.1115/IPACK2015-48071
View Paper titled, Raised Floor Hybrid Cooled Data Center: Effect on Rack Inlet Air Temperatures When In Row Cooling Units are Installed Between the Racks
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Topics: Cooling, Data centers, Temperature, Heat, Air flow, Computational fluid dynamics, Cooling systems, Stress, Computer simulation, Density
Proceedings Papers

Prediction of Hot Aisle Partition Airflow Boundary Conditions

Zhihang Song, Bruce T. Murray, Bahgat Sammakia
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T09A002, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73049
https://doi.org/10.1115/IPACK2013-73049
View Paper titled, Prediction of Hot Aisle Partition Airflow Boundary Conditions
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Topics: Air flow, Boundary-value problems, Artificial neural networks, Computational fluid dynamics, Data centers, Computation, Flow (Dynamics), Server racks, Computer software, Design
Proceedings Papers

Experimental Characterization of Server Rack Energy Use at Elevated Ambient Temperatures

Madhusudan Iyengar, Roger Schmidt, Vinod Kamath, Bejoy Kochuparambil
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 617-622, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52207
https://doi.org/10.1115/IPACK2011-52207
View Paper titled, Experimental Characterization of Server Rack Energy Use at Elevated Ambient Temperatures
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Topics: Energy consumption, Experimental characterization, Server racks, Temperature, Doors, Heat exchangers, Data centers, Stress, Algorithms, Cooling
Proceedings Papers

Design of Simulated Server Racks for Data Center Research

James F. Smith, Waleed A. Abdelmaksoud, Hamza S. Erden, John F. Dannenhoffer, Thong Q. Dang, H. Ezzat Khalifa, Roger R. Schmidt, Madhusudan Iyengar
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 415-422, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52016
https://doi.org/10.1115/IPACK2011-52016
View Paper titled, Design of Simulated Server Racks for Data Center Research
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Topics: Data centers, Design, Server racks, Computers, Fans, Heating, Temperature, Density, Flow (Dynamics), Pressure drop
Proceedings Papers

Liquid Cooling Network Systems for Energy Conservation in Data Centers

Mayumi Ouchi, Yoshiyuki Abe, Masato Fukagaya, Haruhiko Ohta, Yasuhisa Shinmoto, Masahide Sato, Ken-ichi Iimura
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 443-449, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52066
https://doi.org/10.1115/IPACK2011-52066
View Paper titled, Liquid Cooling Network Systems for Energy Conservation in Data Centers
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Topics: Cooling, Data centers, Energy conservation, Heat exchangers, Cooling systems, Heat, Flat heat pipes, Server racks, Air conditioning, Condensation
Proceedings Papers

Refrigeration Heat Exchanger Systems for Server Rack Cooling in Data Centers

Takeshi Tsukamoto, Jyunji Takayoshi, Roger R. Schmidt, Madhusudan K. Iyengar
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 915-921, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89258
https://doi.org/10.1115/InterPACK2009-89258
View Paper titled, Refrigeration Heat Exchanger Systems for Server Rack Cooling in Data Centers
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Topics: Cooling, Data centers, Heat exchangers, Refrigeration, Server racks, Refrigerants, Water, Compression, Construction, Coolants
Proceedings Papers

Advanced Integrated Cooling Systems for Thermal Management in Data Centers

Yoshiyuki Abe, Masato Fukagaya, Takashi Kitagawa, Haruhiko Ohta, Yasuhisa Shinmoto, Masahide Sato, Ken-ichi Iimura
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 619-624, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89009
https://doi.org/10.1115/InterPACK2009-89009
View Paper titled, Advanced Integrated Cooling Systems for Thermal Management in Data Centers
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Topics: Cooling systems, Data centers, Thermal management, Server racks, Heat pipes, Cables, Fluids, Heat exchangers, Heat sinks, Nanofluids
Proceedings Papers

Server Rack Rear Door Heat Exchanger and the New ASHRAE Recommended Environmental Guidelines

Roger Schmidt, Madhusudan Iyengar
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 851-862, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89212
https://doi.org/10.1115/InterPACK2009-89212
View Paper titled, Server Rack Rear Door Heat Exchanger and the New ASHRAE Recommended Environmental Guidelines
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Topics: Doors, Heat exchangers, Server racks, Water
Proceedings Papers

Facility Level Energy and Cost Analyses for Water Cooled Supercomputer Systems

Evan G. Colgan, Madhusudan K. Iyengar
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 799-806, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89177
https://doi.org/10.1115/InterPACK2009-89177
View Paper titled, Facility Level Energy and Cost Analyses for Water Cooled Supercomputer Systems
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Topics: Water, Cooling, Design, Heat exchangers, Locations, Server racks, Temperature, Architecture, Computers, Data centers
Proceedings Papers

Comparison Between Numerical and Experimental Temperature Distributions in a Small Data Center Test Cell

Madhusudan Iyengar, Roger R. Schmidt, Hendrik Hamann, Jim VanGilder
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 819-826, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33508
https://doi.org/10.1115/IPACK2007-33508
View Paper titled, Comparison Between Numerical and Experimental Temperature Distributions in a Small Data Center Test Cell
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Topics: Data centers, Temperature distribution, Errors, Server racks, Temperature, Air conditioning, Computer simulation, Exhaust systems, Flow (Dynamics), Modeling
Proceedings Papers

Experimental Investigation of the Impact of Under Floor Blockages on Flow Distribution in a Data Center Cell

Siddharth Bhopte, Bahgat Sammakia, Madhusudan K. Iyengar, Roger Schmidt
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 827-836, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33540
https://doi.org/10.1115/IPACK2007-33540
View Paper titled, Experimental Investigation of the Impact of Under Floor Blockages on Flow Distribution in a Data Center Cell
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Topics: Data centers, Flow (Dynamics), Tiles, Air conditioning, Computational fluid dynamics, Pipes, Air flow, Cables, Computer simulation, Computers
Proceedings Papers

Analysis of Airflow Distribution Across a Front-to-Rear Server Rack

Amir Radmehr, Kailash C. Karki, Suhas V. Patankar
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 837-843, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33574
https://doi.org/10.1115/IPACK2007-33574
View Paper titled, Analysis of Airflow Distribution Across a Front-to-Rear Server Rack
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Topics: Air flow, Server racks, Cooling, Data centers, Boundary-value problems, Computational fluid dynamics, Symmetry (Physics), Tiles, Computers, Density
Proceedings Papers

Server-Rack Air Flow and Heat Transfer Interactions in Data Centers

S. P. Tan, K. C. Toh, Y. W. Wong
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 845-849, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33672
https://doi.org/10.1115/IPACK2007-33672
View Paper titled, Server-Rack Air Flow and Heat Transfer Interactions in Data Centers
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Topics: Air flow, Data centers, Heat transfer, Server racks, Flow (Dynamics), Pressure, Modeling, Temperature, Approximation, Design
Proceedings Papers

Fan Laws for Rack Systems

Maurice F. Holahan, Bret P. Elison
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 255-266, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33892
https://doi.org/10.1115/IPACK2007-33892
View Paper titled, Fan Laws for Rack Systems
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Topics: Acoustic emissions, Acoustics, Air flow, Design, Electronics, Fans, Flow (Dynamics), Noise (Sound), Packaging, Parity (Physics)
Proceedings Papers

A CFD Analysis of Telecommunication Racks, Including Effects of Air Filter Locations

L. T. Yeh, B. T. F. Chung, Joseph Yeh
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1359-1364, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73008
https://doi.org/10.1115/IPACK2005-73008
View Paper titled, A CFD Analysis of Telecommunication Racks, Including Effects of Air Filter Locations
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Topics: Air filters, Computational fluid dynamics, Server racks, Air flow, Computer software, Failure, Fans, Flow (Dynamics)