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Proceedings Papers

Influence of Cure-Reflow Profile and High-Temperature Operation of Additively Printed Conductive Circuits on Performance and Reliability

Pradeep Lall, Jinesh Narangaparambil, Curtis Hill

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A012, October 25–27, 2022

Paper No: IPACK2022-97457

DOI: https://doi.org/10.1115/IPACK2022-97457

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Topics: Artificial neural networks, Circuits, Copper, Flexible electronics, High temperature, Reliability, Electrical resistivity, Sintering, Adhesives, Electronics

Proceedings Papers

Reliable Additive Manufacturing Using Transient Liquid Phase Sintering

Gilad Nave, Clifton Buxbaum, F. Patrick McCluskey

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A012, October 26–28, 2021

Paper No: IPACK2021-73367

DOI: https://doi.org/10.1115/IPACK2021-73367

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Topics: Additive manufacturing, Sintering, Tension-leg platforms, Transients (Dynamics)

Proceedings Papers

Printed Flexible LC Filter Using Additive Micro-Dispensing With Silver Conductive Paste and ECA for Component Attachment

Pradeep Lall, Jinesh Narangaparambil, Kyle Schulze, Scott Miller

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A006, October 26–28, 2021

Paper No: IPACK2021-74073

DOI: https://doi.org/10.1115/IPACK2021-74073

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Topics: Adhesives, Filters, Printing, Silver, Sintering

Proceedings Papers

Print-Consistency and Process-Interaction for Inkjet-Printed Copper on Flexible Substrate

Pradeep Lall, Kartik Goyal, Kyle Schulze, Curtis Hill

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A003, October 26–28, 2021

Paper No: IPACK2021-74063

DOI: https://doi.org/10.1115/IPACK2021-74063

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Topics: Copper, Electronics, Inks, Sintering

Proceedings Papers

Process-Consistency in Additive Printed Multilayer Substrates With Offset-Vias Using Aerosol Jet Technology

Pradeep Lall, Kartik Goyal, Scott Miller

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A004, October 27–29, 2020

Paper No: IPACK2020-2680

DOI: https://doi.org/10.1115/IPACK2020-2680

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Topics: Aerosols, Electronics, Sintering

Proceedings Papers

Design and Fabrication of Graded Copper Inverse Opals (g-CIOs) for Capillary-Fed Boiling in High Heat Flux Cooling Applications

Qianying Wu, Chi Zhang, Mehdi Asheghi, Kenneth Goodson

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A011, October 27–29, 2020

Paper No: IPACK2020-2603

DOI: https://doi.org/10.1115/IPACK2020-2603

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Topics: Boiling, Cooling, Copper, Design, Heat flux, Manufacturing, Critical heat flux, Heat, Modeling, Permeability

Proceedings Papers

Process Capability of Aerosol-Jet Additive Processes for Long-Runs up to 10-Hours

Pradeep Lall, Amrit Abrol, Nakul Kothari, Ben Leever, Scott Miller

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A003, October 7–9, 2019

Paper No: IPACK2019-6569

DOI: https://doi.org/10.1115/IPACK2019-6569

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Topics: Additive manufacturing, Aerosols, Temperature, Printing, Sintering, Shear (Mechanics), Stress, Failure, Manufacturing, Mechanical properties

Proceedings Papers

Mechanical Characterization Study of Sintered Silver Pastes Bonded in a Double-Lap Configuration

Paul Paret, Joshua Major, Douglas DeVoto, Sreekant Narumanchi, Yansong Tan, Guo-Quan Lu

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A006, August 27–30, 2018

Paper No: IPACK2018-8276

DOI: https://doi.org/10.1115/IPACK2018-8276

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Topics: Silver, Particulate matter, Pressure, Collaboration, Displacement, Electronics, Energy gap, High pressure (Physics), High temperature, Manufacturing

Proceedings Papers

All-Inorganic Multi-Color Converter Based on Eu3+-Doped Phosphor-in-Glass for White Light-Emitting Diodes

Yang Peng, Yun Mou, Xujia Xu, Hao Cheng, Hong Li, Mingxiang Chen, Xiaobing Luo

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A002, August 27–30, 2018

Paper No: IPACK2018-8225

DOI: https://doi.org/10.1115/IPACK2018-8225

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Topics: Glass, Light-emitting diodes, Phosphors, Emissions, Ions, Low temperature, Melting, Printing, Rendering, Sintering

Proceedings Papers

Prediction and Mitigation of Vertical Cracking in High-Temperature Transient Liquid Phase Sintered Joints by Thermo-Mechanical Simulation

Hannes Greve, S. Ali Moeini, Patrick McCluskey, Shailesh Joshi

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A003, August 29–September 1, 2017

Paper No: IPACK2017-74138

DOI: https://doi.org/10.1115/IPACK2017-74138

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Topics: Cracking (Materials), Fracture (Process), High temperature, Simulation, Thermomechanics, Transients (Dynamics), Tension-leg platforms, Stress, Fracture (Materials), Tin

Proceedings Papers

Preliminary Results on the Fabrication of Interconnect Structures Using Microscale Selective Laser Sintering

Nilabh Roy, Obehi Dibua, Chee Seng Foong, Michael Cullinan

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A001, August 29–September 1, 2017

Paper No: IPACK2017-74173

DOI: https://doi.org/10.1115/IPACK2017-74173

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Topics: Lasers, Manufacturing, Microscale devices, Sintering, Fluence (Radiation measurement), Additive manufacturing, Copper, Density, Design, Energy dissipation

Proceedings Papers

Reliability of Interconnections Made of Sintered Silver Nano Particles

Przemyslaw K. Matkowski, Tomasz Falat, Andrzej Moscicki

Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A016, July 6–9, 2015

Paper No: IPACK2015-48795

DOI: https://doi.org/10.1115/IPACK2015-48795

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Topics: Nanoparticles, Reliability, Silver, Sensors, Algorithms, Chain, Coating processes, Coatings, Computerized tomography, Failure mechanisms

Proceedings Papers

Tailoring of Permeability in Copper Inverse Opal for Electronic Cooling Applications

Chi Zhang, Guoguang Rong, James W. Palko, Thomas J. Dusseault, Mehdi Asheghi, Juan G. Santiago, Kenneth E. Goodson

Paper No: IPACK2015-48262

DOI: https://doi.org/10.1115/IPACK2015-48262

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Topics: Computer cooling, Copper, Permeability, Sintering, Cooling, Fluids, Capillarity, Electrodeposition, Electronics, Heat flux

Proceedings Papers

High Temperature Shear Strength of Cu-Sn Transient Liquid Phase Sintered Interconnects

Hannes Greve, S. Ali Moeini, Patrick McCluskey, Shailesh Joshi

Paper No: IPACK2015-48577

DOI: https://doi.org/10.1115/IPACK2015-48577

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Topics: High temperature, Shear strength, Tin, Transients (Dynamics), Creep, Sinter (Metallurgy), Temperature, Sintering, Tension-leg platforms, Copper

Proceedings Papers

3-D Antenna Structures Using Novel Direct-Write Additive Manufacturing Method

Md Taibur Rahman, Rahul Panat, Deuk Heo

Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T03A002, July 6–9, 2015

Paper No: IPACK2015-48187

DOI: https://doi.org/10.1115/IPACK2015-48187

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Topics: Additive manufacturing, Aerosols, Metals, Inks, Manufacturing, Nanoparticles, Shapes, Sintering, Ultraviolet radiation, Wavelength

Proceedings Papers

Transient Liquid Phase Sintered Joints for Power Electronic Modules

Hannes Greve, F. Patrick McCluskey

Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T01A004, July 16–18, 2013

Paper No: IPACK2013-73209

DOI: https://doi.org/10.1115/IPACK2013-73209

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Topics: Transients (Dynamics), Melting point, Metals, Shear strength, Sinter (Metallurgy), Temperature, Copper, Shear (Mechanics), Tension-leg platforms, Binders (Materials)

Proceedings Papers

Effect of Interfacial Layers on the Performance of Cu-In Liquid Phase Sintered Composites as Thermal Interface and Interconnect Materials

J. Liu, P. Kumar, I. Dutta, C. M. Nagaraj, R. Raj, M. Renavikar, R. Mahajan

Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 773-780, July 6–8, 2011

Paper No: IPACK2011-52221

DOI: https://doi.org/10.1115/IPACK2011-52221

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Topics: Composite materials, Solders, Sintering, Yield strength, Melting, Contact resistance, Diffusion (Physics), Electrical properties, Intermetallic compounds, Shear (Mechanics)

Proceedings Papers

Next Generation Solder-Systems for Thermal Interface and Interconnect Applications via Liquid Phase Sintering

J. Liu, P. Kumar, I. Dutta, R. Raj, M. Renavikar

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 385-387, July 19–23, 2009

Paper No: InterPACK2009-89194

DOI: https://doi.org/10.1115/InterPACK2009-89194

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Topics: Sintering, Solders, Grain boundaries, Melting point, Thermal conductivity, Deformation, Design, Tin

Proceedings Papers

Thermal Fatigue Reliability of High-Temperature-Resistant Joint for Power Devices

Hiromi Sugihara, Masanori Yamagiwa, Masato Fujita, Toshikazu Oshidari, Qiang Yu

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 937-943, July 19–23, 2009

Paper No: InterPACK2009-89342

DOI: https://doi.org/10.1115/InterPACK2009-89342

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Topics: Fatigue, Reliability, Temperature, Finite element analysis, Nickel plating, Circuits, Cooling, Cycles, Electric vehicles, Electronics

Proceedings Papers

The Sintering Process of Ag Metallo-Organic Nanoparticles and the Influence of the Joining Parameters Upon Cu-to-Cu Joining

Shinji Angata, Eiichi Ide, Akio Hirose, Kojiro F. Kobayashi

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 887-892, July 17–22, 2005

Paper No: IPACK2005-73164

DOI: https://doi.org/10.1115/IPACK2005-73164

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Topics: Joining, Nanoparticles, Sintering, Bonding, Shells, Agglomeration (Materials), Nanotechnology, Pressure, Solders, Surface energy

NARROW

Influence of Cure-Reflow Profile and High-Temperature Operation of Additively Printed Conductive Circuits on Performance and Reliability

Reliable Additive Manufacturing Using Transient Liquid Phase Sintering

Printed Flexible LC Filter Using Additive Micro-Dispensing With Silver Conductive Paste and ECA for Component Attachment

Print-Consistency and Process-Interaction for Inkjet-Printed Copper on Flexible Substrate

Process-Consistency in Additive Printed Multilayer Substrates With Offset-Vias Using Aerosol Jet Technology

Design and Fabrication of Graded Copper Inverse Opals (g-CIOs) for Capillary-Fed Boiling in High Heat Flux Cooling Applications

Process Capability of Aerosol-Jet Additive Processes for Long-Runs up to 10-Hours

Mechanical Characterization Study of Sintered Silver Pastes Bonded in a Double-Lap Configuration

All-Inorganic Multi-Color Converter Based on Eu3+-Doped Phosphor-in-Glass for White Light-Emitting Diodes

Prediction and Mitigation of Vertical Cracking in High-Temperature Transient Liquid Phase Sintered Joints by Thermo-Mechanical Simulation

Preliminary Results on the Fabrication of Interconnect Structures Using Microscale Selective Laser Sintering

Reliability of Interconnections Made of Sintered Silver Nano Particles

Tailoring of Permeability in Copper Inverse Opal for Electronic Cooling Applications

High Temperature Shear Strength of Cu-Sn Transient Liquid Phase Sintered Interconnects

3-D Antenna Structures Using Novel Direct-Write Additive Manufacturing Method

Transient Liquid Phase Sintered Joints for Power Electronic Modules

Effect of Interfacial Layers on the Performance of Cu-In Liquid Phase Sintered Composites as Thermal Interface and Interconnect Materials

Next Generation Solder-Systems for Thermal Interface and Interconnect Applications via Liquid Phase Sintering

Thermal Fatigue Reliability of High-Temperature-Resistant Joint for Power Devices

The Sintering Process of Ag Metallo-Organic Nanoparticles and the Influence of the Joining Parameters Upon Cu-to-Cu Joining

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