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Proceedings Papers

Design and Fabrication of an Inverter Module Co-Designed With the Busbar and Gate Driver

Aishworya Roy, Christina DiMarino, Jesi Miranda-Santos
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A008, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111921
https://doi.org/10.1115/IPACK2023-111921
View Paper titled, Design and Fabrication of an Inverter Module Co-Designed With the Busbar and Gate Driver
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Topics: Design, Gates (Closures), Manufacturing, Cooling, Bridges (Structures), Electric vehicles, Energy dissipation, Heat, Junctions, MOSFET transistors
Proceedings Papers

A Control Strategy for Minimizing Temperature Fluctuations in High Power Liquid to Liquid CDUs Operated at Very Low Heat Loads

Ali Heydari, Pardeep Shahi, Vahideh Radmard, Bahareh Eslami, Uschas Chowdhury, Chandraprakash Hinge, Lochan Sai Reddy Cinthaparthy, Harold Miyamura, Himanshu Modi, Dereje Agonafer, Jeremy Rodriguez
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A011, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97434
https://doi.org/10.1115/IPACK2022-97434
View Paper titled, A Control Strategy for Minimizing Temperature Fluctuations in High Power Liquid to Liquid CDUs Operated at Very Low Heat Loads
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Topics: Coolants, Cooling, Data centers, Fluctuations (Physics), Heat, Plates (structures), Stress, Temperature, Failure, Flow control
Proceedings Papers

Liquid to Liquid Cooling for High Heat Density Liquid Cooled Data Centers

Ali Heydari, Pardeep Shahi, Vahideh Radmard, Bahareh Eslami, Uschas Chowdhury, Satyam Saini, Pratik Bansode, Harold Miyamura, Dereje Agonafer, Jeremy Rodriguez
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A007, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97416
https://doi.org/10.1115/IPACK2022-97416
View Paper titled, Liquid to Liquid Cooling for High Heat Density Liquid Cooled Data Centers
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Topics: Cooling, Data centers, Density, Heat, Plates (structures), Coolants, Cooling systems, Flow (Dynamics), Modeling, Server racks
Proceedings Papers

Thermal Optimization of a Silicon Carbide, Half-Bridge Power Module

Gilberto Moreno, Joshua Major, Douglas DeVoto, Faisal Khan, Sreekant Narumanchi, Xuhui Feng, Paul Paret
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T09A003, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97283
https://doi.org/10.1115/IPACK2022-97283
View Paper titled, Thermal Optimization of a Silicon Carbide, Half-Bridge Power Module
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Topics: Bridges (Structures), Electronics, Energy gap, Optimization, Silicon, Design, Thermal resistance, Computational fluid dynamics, Heat exchangers, Fluids
Proceedings Papers

BER Illusion Methodology: A Novel, Open Sourced and Scalable Approach to Troubleshooting High Radix Photonics Interconnects in a Modern Hyperscale Datacenter

Shreyas Rao, Abhijit Chakravarty, Dharmesh Jani
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A011, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-73253
https://doi.org/10.1115/IPACK2021-73253
View Paper titled, BER Illusion Methodology: A Novel, Open Sourced and Scalable Approach to Troubleshooting High Radix Photonics Interconnects in a Modern Hyperscale Datacenter
Open the PDF for BER Illusion Methodology: A Novel, Open Sourced and Scalable Approach to Troubleshooting High Radix Photonics Interconnects in a Modern Hyperscale Datacenter in another window
Topics: Dimensions, Errors, Failure, Failure analysis, Flow (Dynamics), Manufacturing, Optical interconnections, Optics, Photonics, Resolution (Optics)
Proceedings Papers

Impact of Internal Design on the Efficiency of IT Equipment in a Hot Aisle Containment System: An Experimental Study

Sadegh Khalili, Husam Alissa, Kourosh Nemati, Mark Seymour, Robert Curtis, David Moss, Bahgat Sammakia
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A009, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8422
https://doi.org/10.1115/IPACK2018-8422
View Paper titled, Impact of Internal Design on the Efficiency of IT Equipment in a Hot Aisle Containment System: An Experimental Study
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Topics: Containment systems, Design, Air flow, Containment, Cooling, Fans, Leakage, Sensors, Control equipment, Data centers
Proceedings Papers

3D Wire Bondless Integration: The Future of Silicon Carbide (SiC) Packaging

Sayan Seal, Andrea K. Wallace, John E. Zumbro, H. Alan Mantooth
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A015, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74213
https://doi.org/10.1115/IPACK2017-74213
View Paper titled, 3D Wire Bondless Integration: The Future of Silicon Carbide (SiC) Packaging
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Topics: Packaging, Silicon, Wire, MOSFET transistors, Bonding, Electromagnetic interference, Electronics, Energy gap, Flip-chip, High temperature
Proceedings Papers

Raised Floor Hybrid Cooled Data Center: Effect on Rack Inlet Air Temperatures When In Row Cooling Units are Installed Between the Racks

Tianyi Gao, James Geer, Russell Tipton, Bruce Murray, Bahgat G. Sammakia, Alfonso Ortega, Roger Schmidt
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A012, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48071
https://doi.org/10.1115/IPACK2015-48071
View Paper titled, Raised Floor Hybrid Cooled Data Center: Effect on Rack Inlet Air Temperatures When In Row Cooling Units are Installed Between the Racks
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Topics: Cooling, Data centers, Temperature, Heat, Air flow, Computational fluid dynamics, Cooling systems, Stress, Computer simulation, Density
Proceedings Papers

Design Considerations of Packaging a High Voltage Current Switch

Ankan De, Adam Morgan, Subhashish Bhattacharya, Douglas C. Hopkins
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A014, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48714
https://doi.org/10.1115/IPACK2015-48714
View Paper titled, Design Considerations of Packaging a High Voltage Current Switch
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Topics: Design, Packaging, Switches, Anodes, Computer software, Current density, Electromagnetic fields, Gates (Closures), Packing (Shipments), Packings (Cushioning)
Proceedings Papers

Multiphysics Simulation of RF-MEMS With Quantified Uncertainties

Lin Sun, Hojin Kim, Alejandro Strachan, Sanjay R. Mathur, Jayathi Y. Murthy
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T05A007, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73175
https://doi.org/10.1115/IPACK2013-73175
View Paper titled, Multiphysics Simulation of RF-MEMS With Quantified Uncertainties
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Topics: Microelectromechanical systems, Simulation, Uncertainty, Deformation, Chaos, Complex systems, Damping, Displacement, Electrostatics, Fluids
Proceedings Papers

Flat Tree Networks

P. Khanduri, A. Wood, D. Cohen, I. Birkeli, F. Sem-Jacobsen
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 49-55, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89336
https://doi.org/10.1115/InterPACK2009-89336
View Paper titled, Flat Tree Networks
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Topics: Packaging, Signals, Switches, Textiles, Topology
Proceedings Papers

Reliable Power Electronics for Wind Turbines

Patrick McCluskey, Peter Hansen, Douglas DeVoto
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 771-773, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89174
https://doi.org/10.1115/InterPACK2009-89174
View Paper titled, Reliable Power Electronics for Wind Turbines
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Topics: Electronics, Wind turbines, Electronic systems, Failure, Fatigue, Packaging, Heat, Temperature, Bonding, Ceramics
Proceedings Papers

Heat Switch to Control the Local Thermal Resistance Using Liquid Pillar Control

Su-Heon Jeong, Wataru Nakayama, Sun-Kyu Lee
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 1021-1024, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89368
https://doi.org/10.1115/InterPACK2009-89368
View Paper titled, Heat Switch to Control the Local Thermal Resistance Using Liquid Pillar Control
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Topics: Columns (Structural), Heat, Switches, Thermal resistance, Electronic packages, Temperature, Flow (Dynamics), Geometry, Plates (structures), Reservoirs
Proceedings Papers

Thermal Modeling of Snap-In Type Electrolytic Capacitors in Electronic Equipment

Katsuhiro Koizumi, Masaru Ishizuka, Shinji Nakagawa
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 239-245, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89052
https://doi.org/10.1115/InterPACK2009-89052
View Paper titled, Thermal Modeling of Snap-In Type Electrolytic Capacitors in Electronic Equipment
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Topics: Capacitors, Electronic equipment, Modeling, Computational fluid dynamics, Flow simulation, Temperature, Design, Flow (Dynamics), Switches, Thermal analysis
Proceedings Papers

Development of Boundary Condition Independent Compact Thermal Models for Opto-Electronic Packages

Arun Prakash Raghupathy, Attila Aranyosi, Urmila Ghia, Karman Ghia, William Maltz
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 741-751, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89092
https://doi.org/10.1115/InterPACK2009-89092
View Paper titled, Development of Boundary Condition Independent Compact Thermal Models for Opto-Electronic Packages
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Topics: Boundary-value problems, Heat, Construction, Design, Errors, Flow (Dynamics), Junctions, Matlab, Natural convection, Optimization
Proceedings Papers

A Stamp-Sealed Microshell Package for RF MEMS Switches

John Heck, Hanan Bar, Tsung-Kuan A. Chou, Quan Tran, Qing Ma, Boaz Weinfeld, Valluri Rao
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 73-77, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33887
https://doi.org/10.1115/IPACK2007-33887
View Paper titled, A Stamp-Sealed Microshell Package for RF MEMS Switches
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Topics: Microelectromechanical systems, Switches, Semiconductor wafers, Manufacturing, Sealing (Process), Tunnels, Bonding, Embossing, Metal stamping, Packaging
Proceedings Papers

Thermal Management in RF MEMS Ohmic Switches

Ryszard J. Pryputniewicz
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 185-191, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33502
https://doi.org/10.1115/IPACK2007-33502
View Paper titled, Thermal Management in RF MEMS Ohmic Switches
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Topics: Heat, Joules, Microelectromechanical systems, Switches, Thermal analysis, Thermal management
Proceedings Papers

Thermal Management for Chip-Scale Atomic Clocks

Alexander Laws, Richard Y. J. Chang, Victor M. Bright, Y. C. Lee
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 741-745, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73444
https://doi.org/10.1115/IPACK2005-73444
View Paper titled, Thermal Management for Chip-Scale Atomic Clocks
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Topics: Atomic clocks, Thermal management, Temperature, Switches, Clocks, Design, Energy dissipation, Vehicles, Waste heat, Cavities
Proceedings Papers

Enhancing Thermoelectric Energy Recovery Via Modulations of Source Temperature for Cyclical Heat Loadings

R. McCarty, K. P. Hallinan, B. Sanders, T. Somphone
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 2109-2122, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73010
https://doi.org/10.1115/IPACK2005-73010
View Paper titled, Enhancing Thermoelectric Energy Recovery Via Modulations of Source Temperature for Cyclical Heat Loadings
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Topics: Energy recovery, Heat, Temperature, Thermoelectric devices, Aerospace industry, Computer simulation, Exergy, Heat recovery, Switches, Waste heat
Proceedings Papers

Measurement and Analysis of Insertion Loss in an Optical Collimation System Designed for a 2D MEMS Optical Switch

Tsuyoshi Ikehara, Ryutaro Maeda, Xue Chuan Shan
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 767-772, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73335
https://doi.org/10.1115/IPACK2005-73335
View Paper titled, Measurement and Analysis of Insertion Loss in an Optical Collimation System Designed for a 2D MEMS Optical Switch
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Topics: Microelectromechanical systems, Switches, Lenses (Optics), Mirrors, Ray tracing