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Proceedings Papers

Thermal Metamaterials for Heat Flow Control in Electronics

Ercan M. Dede, Feng Zhou, Paul Schmalenberg, Tsuyoshi Nomura
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A006, August 29–September 1, 2017
Paper No: IPACK2017-74112
DOI: https://doi.org/10.1115/IPACK2017-74112
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Topics: Electronics, Flow control, Heat, Metamaterials, Flow (Dynamics), Anisotropy, Blocks (Building materials), Circuit design, Composite materials, Design
Proceedings Papers

Optimized Thermoelectric Module-Heat Sink Assemblies for Precision Temperature Control

Rui Zhang, David A. Brooks, Marc Hodes, Matthew van Lieshout, Vincent P. Manno
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 37-45, July 6–8, 2011
Paper No: IPACK2011-52019
DOI: https://doi.org/10.1115/IPACK2011-52019
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Topics: Heat, Temperature control, Heat sinks, Temperature, Energy consumption, Algorithms, Thermal resistance, Circuits, Currents, Electrical resistivity
Proceedings Papers

Evaluation of Air-Side Economizer Use in a Compute-Intensive Data Center

Michael K. Patterson, Don Atwood, John G. Miner
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 1009-1014, July 19–23, 2009
Paper No: InterPACK2009-89358
DOI: https://doi.org/10.1115/InterPACK2009-89358
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Topics: Data centers, Cooling, Cooling systems, Energy consumption, Temperature control, Air conditioning, Design, Doors, Engineers, Heating
Proceedings Papers

Transition Temperature Stratified Thermal Energy Storage Systems Applied to On-Demand Cooling of High Power-Density Hand-Held Electronics

Matt Yaquinto, Richard Wirtz
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 887-896, July 19–23, 2009
Paper No: InterPACK2009-89237
DOI: https://doi.org/10.1115/InterPACK2009-89237
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Topics: Cooling, Electronics, Phase transition temperature, Power density, Thermal energy storage, Storage, Flat heat pipes, Phase change materials, Skin, Temperature
Proceedings Papers

Local Cooling Control of Data Centers With Adaptive Vent Tiles

Monem H. Beitelmal, Zhikui Wang, Carlos Felix, Cullen Bash, Christopher Hoover, Alan McReynolds
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 645-652, July 19–23, 2009
Paper No: InterPACK2009-89035
DOI: https://doi.org/10.1115/InterPACK2009-89035
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Topics: Cooling, Data centers, Tiles, Vents, Control equipment, Air flow, Algorithms, Design, Dynamic models, Errors
Proceedings Papers

CMOS Compatible Wafer-Scale Encapsulation MEMS Resonators

Bongsang Kim, Matthew A. Hopcroft, Renata Melamud, Chandra M. Jha, Manu Agarwal, Saurabh A. Chandorkar, Thomas W. Kenny
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 499-504, July 8–12, 2007
Paper No: IPACK2007-33234
DOI: https://doi.org/10.1115/IPACK2007-33234
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Topics: Complementary metal oxide semiconductors, Microelectromechanical systems, Semiconductor wafers, Stability, Temperature, Composite materials, Packaging, Q-factor, Sealing (Process), Silicon
Proceedings Papers

Thermal and Structural Analysis of a Suspended Physics Package for a Chip-Scale Atomic Clock

A. D. Laws, Y. C. Lee
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 953-962, July 8–12, 2007
Paper No: IPACK2007-33013
DOI: https://doi.org/10.1115/IPACK2007-33013
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Topics: Atomic clocks, Physics, Structural analysis, Finite element analysis, Shock (Mechanics), Design, Thermal resistance, Alkali metals, Cavities, Energy dissipation
Proceedings Papers

Neural-Genetic Optimization of Temperature Control in a Continuous Flow Polymerase Chain Reaction Microdevice

Hing Wah Lee, Parthiban Arunasalam, Ishak A. Azid, Kankanhally N. Seetharamu
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 733-740, July 17–22, 2005
Paper No: IPACK2005-73280
DOI: https://doi.org/10.1115/IPACK2005-73280
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Topics: Chain, Flow (Dynamics), Optimization, Temperature control, Artificial neural networks, Finite element analysis, Microfluidics, Simulation results, Temperature distribution, Annealing
Proceedings Papers

Thermal Management for Chip-Scale Atomic Clocks

Alexander Laws, Richard Y. J. Chang, Victor M. Bright, Y. C. Lee
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 741-745, July 17–22, 2005
Paper No: IPACK2005-73444
DOI: https://doi.org/10.1115/IPACK2005-73444
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Topics: Atomic clocks, Thermal management, Temperature, Switches, Clocks, Design, Energy dissipation, Vehicles, Waste heat, Cavities
Proceedings Papers

Design of a Transient, Temperature Control System for a Low-Temperature Infrared Optical Telescope Utilizing a Ramai R-Cooled Thermoelectric Assembly as the Condenser of a Two-Phase Cooling System

Donald C. Price, W. Gerald Wyatt, Pete Townsend, Mark C. Woods, Brad W. Fennell
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 683-695, July 17–22, 2005
Paper No: IPACK2005-73496
DOI: https://doi.org/10.1115/IPACK2005-73496
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Topics: Condensers (steam plant), Cooling systems, Design, Low temperature, Manufacturing, Telescopes, Temperature control, Transients (Dynamics), Temperature, Optical elements
Proceedings Papers

Capacity Control in Refrigerated Systems

Johnston W. Peeples
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 153-157, July 6–11, 2003
Paper No: IPACK2003-35070
DOI: https://doi.org/10.1115/IPACK2003-35070
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Topics: Architecture, Compression, Computer cooling, Condensers (steam plant), Construction, Cooling, Design, Electronics, Energy dissipation, Flow (Dynamics)