Search Results | InterPACK | ASME Digital Collection

1-20 of 22

Sort by

Sort Order Select

Proceedings Papers

Transient and Steady State Thermal Response of a System With Thermoelectric Coolers

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A005, August 29–September 1, 2017

Paper No: IPACK2017-74015

DOI: https://doi.org/10.1115/IPACK2017-74015

View Paper

Topics: Steady state, Thermoelectric coolers, Transients (Dynamics), Thermal resistance, Eigenfunctions, Eigenvalues, Insulation, Thermal systems

Proceedings Papers

Thermal Management of Ultra Intense Hot Spots With Two-Phase Multi-Microchannels and Embedded Thermoelectric Cooling

Jackson B. Marcinichen, Brian P. d’Entremont, John R. Thome, Gary Bulman, Jay Lewis, Rama Venkatasubramanian

Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A023, July 16–18, 2013

Paper No: IPACK2013-73276

DOI: https://doi.org/10.1115/IPACK2013-73276

View Paper

Topics: Microchannels, Thermal management, Thermoelectric cooling, Cooling, Thermoelectric coolers, Heat, Computer simulation, Currents, Design, Electric current

Proceedings Papers

Design of High Packing Fraction Thermoelectric Modules for High Heat Flux Cooling

Ram Ranjan, Joseph E. Turney, Chuck E. Lents

Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A016, July 16–18, 2013

Paper No: IPACK2013-73073

DOI: https://doi.org/10.1115/IPACK2013-73073

View Paper

Topics: Cooling, Design, Heat flux, Packing (Shipments), Packings (Cushioning), Heat, Coolers, Electric current, Flux (Metallurgy), Heating

Proceedings Papers

Thermoelectric Cooling Analysis Using Modified Graphical Method

Huy N. Phan, Dereje Agonafer

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 33-37, July 19–23, 2009

Paper No: InterPACK2009-89077

DOI: https://doi.org/10.1115/InterPACK2009-89077

View Paper

Topics: Thermoelectric cooling, Computation, Computational fluid dynamics, Cooling, Cooling systems, Currents, Design, Fluids, Temperature, Thermoelectric coolers

Proceedings Papers

Site-Specific and On-Demand High Heat-Flux Cooling Using Superlattice Based Thin-Film Thermoelectrics

Ihtesham Chowdhury, Ravi Prasher, Kelly Lofgreen, Sridhar Narasimhan, Ravi Mahajan, David Koester, Rama Venkatasubramanian

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 521-526, July 19–23, 2009

Paper No: InterPACK2009-89268

DOI: https://doi.org/10.1115/InterPACK2009-89268

View Paper

Topics: Cooling, Heat flux, Superlattices, Thin films, Thermoelectric coolers, Thermal management, Electronic packages, Electronics, Lasers, Microscale devices

Proceedings Papers

Impact of Double Walled Telecommunication Cabinet on Solar Load: Natural and Forced Convection

Bharathkrishnan Muralidharan, Feroz Ahamed Iqbal Mariam, Veerendra Mulay, Dereje Agonafer, Mark Hendrix

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 985-991, July 19–23, 2009

Paper No: InterPACK2009-89340

DOI: https://doi.org/10.1115/InterPACK2009-89340

View Paper

Topics: Mixed convection, Solar energy, Stress, Telecommunications, Construction, Cooling systems, Electronics, Optical instruments, Acoustics, Air conditioning

Proceedings Papers

Thermal Analysis of Thermoelectric Coolers for Processors

Hengyun Zhang, Y. C. Mui, Michael Tarin, Yizhang Yang

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 311-318, July 19–23, 2009

Paper No: InterPACK2009-89087

DOI: https://doi.org/10.1115/InterPACK2009-89087

View Paper

Topics: Thermal analysis, Thermoelectric coolers, Cooling, Quality control, Energy dissipation, Junctions, Temperature

Proceedings Papers

Effect of Thermal Contact Resistance on Optimum Mini-Contact TEC Cooling of On-Chip Hot Spots

Viatcheslav Litvinovitch, Avram Bar-Cohen

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 147-158, July 19–23, 2009

Paper No: InterPACK2009-89289

DOI: https://doi.org/10.1115/InterPACK2009-89289

View Paper

Topics: Contact resistance, Cooling, Thermal management, Thermoelectric coolers

Proceedings Papers

Enhanced Thermoelectric Cooler for On-Chip Hot Spot Cooling

Peng Wang, Avram Bar-Cohen, Bao Yang

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 249-258, July 8–12, 2007

Paper No: IPACK2007-33798

DOI: https://doi.org/10.1115/IPACK2007-33798

View Paper

Topics: Contact resistance, Cooling, Thermal management, Thermoelectric coolers

Proceedings Papers

A Semi-Empirically Thermal Optimization for Heat Sink/TEC Assemblies With Various External Thermal Resistances

M. C. Wu, T. Y. Wu, J. T. Horng, S. F. Chang, P. L. Chen, Y. H. Hung

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 205-212, July 8–12, 2007

Paper No: IPACK2007-33281

DOI: https://doi.org/10.1115/IPACK2007-33281

View Paper

Topics: Design, Heat capacity, Heat sinks, Optimization, Response surface methodology, Thermal resistance, Thermoelectric coolers

Proceedings Papers

Thermal Optimal Design for Heat Sinks or Heat Sink/TEC Assemblies in a Ducted Flow

T. Y. Wu, M. C. Wu, J. T. Horng, S. F. Chang, P. L. Chen, Y. H. Hung

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 213-220, July 8–12, 2007

Paper No: IPACK2007-33285

DOI: https://doi.org/10.1115/IPACK2007-33285

View Paper

Topics: Design, Flow (Dynamics), Heat sinks, Quadratic programming, Sensitivity analysis, Thermal resistance, Thermoelectric coolers

Proceedings Papers

Thermoelectric Cooler Based Regenerative Adsorption Refrigeration System for High Temperature Electronics

Ashish Sinha, Yogendra Joshi, Bruce H. Storm, Jr.

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 59-68, July 8–12, 2007

Paper No: IPACK2007-33235

DOI: https://doi.org/10.1115/IPACK2007-33235

View Paper

Topics: Electronics, High temperature, Refrigeration, Thermoelectric coolers, Heat, Temperature, Cycles, Desorption, Cooling, Pumps

Proceedings Papers

High Power LED Integrated With Silicon-Based Thermoelectric Cooler Package

Ming-Ji Dai, Chih-Kuang Yu, Chun Kai Liu, Sheng-Liang Kuo

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 229-233, July 8–12, 2007

Paper No: IPACK2007-33369

DOI: https://doi.org/10.1115/IPACK2007-33369

View Paper

Topics: Silicon, Thermoelectric coolers, Cooling, Flip-chip assemblies, Junctions, Light-emitting diodes, Manufacturing, Microelectromechanical systems, Packaging, Temperature

Proceedings Papers

Towards a Thermal Moore’s Law

Shankar Krishnan, Suresh V. Garimella, Greg M. Chrysler, Ravi V. Mahajan

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 591-603, July 17–22, 2005

Paper No: IPACK2005-73409

DOI: https://doi.org/10.1115/IPACK2005-73409

View Paper

Topics: Computers, Cooling, Design, Electrons, Energy dissipation, Heat, Heat sinks, Heat transfer, Leakage, Power density

Proceedings Papers

Thermal Devices Integrated With Thermoelectric Modules With Applications to CPU Cooling

Ioan Sauciuc, Hakan Erturk, Gregory Chrysler, Vikram Bala, Ravi Mahajan

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 2153-2159, July 17–22, 2005

Paper No: IPACK2005-73243

DOI: https://doi.org/10.1115/IPACK2005-73243

View Paper

Topics: Compressors, Computation, Computational fluid dynamics, Computer cooling, Control equipment, Cooling, Cycles, Energy consumption, Fluids, Geometry

Proceedings Papers

Thermal Simulation and Experimental Validation for TEC Design

Peter Shi, Stephen Wong, Yeow Meng Tan, Vasudivan Sunappan, Wei Fan, Kai Meng Chua, Bill Freeman, Hongjin Jiang

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 2173-2178, July 17–22, 2005

Paper No: IPACK2005-73309

DOI: https://doi.org/10.1115/IPACK2005-73309

View Paper

Topics: Design, Simulation, Thermoelectric coolers

Proceedings Papers

Optimization of Bulk Thermoelectric Modules for Chip Cooling Applications

Kazuhiko Fukutani, Ali Shakouri

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 2179-2183, July 17–22, 2005

Paper No: IPACK2005-73410

DOI: https://doi.org/10.1115/IPACK2005-73410

View Paper

Topics: Cooling, Optimization, Thermal resistance, Energy dissipation, Power density, Circuits, Coolers, Geometry, Heat, Integrated circuits

Proceedings Papers

Design of a Transient, Temperature Control System for a Low-Temperature Infrared Optical Telescope Utilizing a Ramai R-Cooled Thermoelectric Assembly as the Condenser of a Two-Phase Cooling System

Donald C. Price, W. Gerald Wyatt, Pete Townsend, Mark C. Woods, Brad W. Fennell

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 683-695, July 17–22, 2005

Paper No: IPACK2005-73496

DOI: https://doi.org/10.1115/IPACK2005-73496

View Paper

Topics: Condensers (steam plant), Cooling systems, Design, Low temperature, Manufacturing, Telescopes, Temperature control, Transients (Dynamics), Temperature, Optical elements

Proceedings Papers

Thermal Performance of a Thermo-Electric Base Thermal Control Unit Using Various Interface Materials

Jihad Y. Hammoud

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 551-556, July 6–11, 2003

Paper No: IPACK2003-35259

DOI: https://doi.org/10.1115/IPACK2003-35259

View Paper

Topics: Cooling systems, Design, Graphite, Heat, Heat transfer, Manufacturing, Pressure, Temperature, Thermal management, Thermal resistance

Proceedings Papers

Performance Comparison of Mesoscale Refrigeration Technologies for Electronics Packaging

Patrick E. Phelan, Victor Chiriac, Tien-Yu Tom Lee

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 309-315, July 6–11, 2003

Paper No: IPACK2003-35140

DOI: https://doi.org/10.1115/IPACK2003-35140

View Paper

Topics: Electronic packaging, Refrigeration, Compression, Vapors, Compressors, Cycles, Microelectronic devices, Thermoelectric coolers

NARROW

Transient and Steady State Thermal Response of a System With Thermoelectric Coolers

Thermal Management of Ultra Intense Hot Spots With Two-Phase Multi-Microchannels and Embedded Thermoelectric Cooling

Design of High Packing Fraction Thermoelectric Modules for High Heat Flux Cooling

Thermoelectric Cooling Analysis Using Modified Graphical Method

Site-Specific and On-Demand High Heat-Flux Cooling Using Superlattice Based Thin-Film Thermoelectrics

Impact of Double Walled Telecommunication Cabinet on Solar Load: Natural and Forced Convection

Thermal Analysis of Thermoelectric Coolers for Processors

Effect of Thermal Contact Resistance on Optimum Mini-Contact TEC Cooling of On-Chip Hot Spots

Enhanced Thermoelectric Cooler for On-Chip Hot Spot Cooling

A Semi-Empirically Thermal Optimization for Heat Sink/TEC Assemblies With Various External Thermal Resistances

Thermal Optimal Design for Heat Sinks or Heat Sink/TEC Assemblies in a Ducted Flow

Thermoelectric Cooler Based Regenerative Adsorption Refrigeration System for High Temperature Electronics

High Power LED Integrated With Silicon-Based Thermoelectric Cooler Package

Towards a Thermal Moore’s Law

Thermal Devices Integrated With Thermoelectric Modules With Applications to CPU Cooling

Thermal Simulation and Experimental Validation for TEC Design

Optimization of Bulk Thermoelectric Modules for Chip Cooling Applications

Design of a Transient, Temperature Control System for a Low-Temperature Infrared Optical Telescope Utilizing a Ramai R-Cooled Thermoelectric Assembly as the Condenser of a Two-Phase Cooling System

Thermal Performance of a Thermo-Electric Base Thermal Control Unit Using Various Interface Materials

Performance Comparison of Mesoscale Refrigeration Technologies for Electronics Packaging

Journals

Conference Proceedings

eBooks

Resources

Opportunities

Journals

Conference Proceedings

eBooks

Resources

Opportunities

This Feature Is Available To Subscribers Only