1-20 of 75
Thin films
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

Performance Analysis of Micro-Raman Spectroscopy Models for Thermal Conductivity Calculation

Taher Meydando, Nazli Donmezer
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A004, October 26–28, 2021
Paper No: IPACK2021-73648
DOI: https://doi.org/10.1115/IPACK2021-73648
View Paper
PDF
Topics: Phonons, Spectroscopy, Thermal conductivity, Thin films
Proceedings Papers

Surface Engineering Through Atomic Layer Deposition on Three-Dimensionally Structured Materials

Nhi V. Quach, Quang N. Pham, Ju-Hwan Han, Youngjoon Suh, Jin-Seong Park, Yoonjin Won
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A005, October 27–29, 2020
Paper No: IPACK2020-2613
DOI: https://doi.org/10.1115/IPACK2020-2613
View Paper
PDF
Topics: Architecture, Coatings, Condensation, Condensed matter, Drops, Fluids, Hydrophilicity, Membranes, Metals, Nickel
Proceedings Papers

Heat Transfer Characteristics and Flow Pattern Visualization for Flow Boiling in a Vertical Narrow Microchannel

Kan Zhou, Junye Li, Zhao-zan Feng, Wei Li, Hua Zhu, Kuang Sheng
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A021, August 27–30, 2018
Paper No: IPACK2018-8447
DOI: https://doi.org/10.1115/IPACK2018-8447
View Paper
PDF
Topics: Boiling, Flow (Dynamics), Heat transfer, Microchannels, Visualization, Nucleate boiling, Bubbles, Fluids, Flux (Metallurgy), Heat
Proceedings Papers

Evaporative Wicking Phenomena on Nanotextured Surfaces for Heat Pipe Applications

Duong Vy Le, Shiwei Zhang, Jonggyu Lee, Yoonjin Won
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A025, August 27–30, 2018
Paper No: IPACK2018-8456
DOI: https://doi.org/10.1115/IPACK2018-8456
View Paper
PDF
Topics: Cooling, Copper, Design, Electronics, Energy dissipation, Evaporation, Evaporative cooling, Heat, Heat conduction, Heat flux
Proceedings Papers

Effect of Bonding Structure and Heater Design on Performance Enhancement of FEEDS Embedded Manifold-Microchannel Cooling

Daniel Bae, Raphael Mandel, Michael Ohadi
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A024, August 29–September 1, 2017
Paper No: IPACK2017-74158
DOI: https://doi.org/10.1115/IPACK2017-74158
View Paper
PDF
Topics: Bonding, Cooling, Design, Manifolds, Microchannels, Heat flux, Electronics, Fluids, Manufacturing, Computational fluid dynamics
Proceedings Papers

Thermo-Mechanical Study of AlN Thin-Films As Heat Spreaders in III-V Photonic Devices

Shenghui Lei, Ertugrul Kardemir, David McCloskey, John F. Donegan, Ryan Enright
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A010, August 29–September 1, 2017
Paper No: IPACK2017-74184
DOI: https://doi.org/10.1115/IPACK2017-74184
View Paper
PDF
Topics: Flat heat pipes, Photonic equipment, Thermomechanics, Thin films, Stress, Waveguides, Cladding systems (Building), Design, Failure, Polymers
Proceedings Papers

Modeling of Flow and Heat Transfer in a Molten Glass Mini-Film for High Temperature Heat Collection in a Falling-Film Solar Central Receiver

Ruth H. Reed, Justin Raade, Benjamin Elkin, Van P. Carey
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A013, July 6–9, 2015
Paper No: IPACK2015-48532
DOI: https://doi.org/10.1115/IPACK2015-48532
View Paper
PDF
Topics: Flow (Dynamics), Glass, Heat, Heat transfer, High temperature, Modeling, Solar energy, Temperature, Viscosity, Fluids
Proceedings Papers

Experimental Study of Aqueous Binary Mixture Droplet Vaporization on Nanostructured Surfaces

Russell J. LaBrie, II, Jorge Padilla, Jr., Van P. Carey
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A003, July 6–9, 2015
Paper No: IPACK2015-48153
DOI: https://doi.org/10.1115/IPACK2015-48153
View Paper
PDF
Topics: Drops, Heat transfer, Water, Nanocrystals, Heat transfer coefficients, Copper, Evaporation, Film thickness, Gravity (Force), Hydrophilicity
Proceedings Papers

Improvement of Thermal Conductivity of Electroplated Copper Interconnections by Controlling Their Crystallinity

Masaru Gotoh, Ken Suzuki, Hideo Miura
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A005, July 6–9, 2015
Paper No: IPACK2015-48197
DOI: https://doi.org/10.1115/IPACK2015-48197
View Paper
PDF
Topics: Copper, Thermal conductivity, Thin films, Grain boundaries, Electrical resistivity, Heating, Joules, Stress, Thermal properties, Diffusion (Physics)
Proceedings Papers

Effects of Thermal Cycle Conditions on Thermal Fatigue Life of Substrate With Cu Through-Hole

Yu Yamayose, Tetsuya Kugimiya, Kenji Hirohata, Akihiko Happoya, Nobutada Ohno, Masao Sakane
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A022, July 6–9, 2015
Paper No: IPACK2015-48247
DOI: https://doi.org/10.1115/IPACK2015-48247
View Paper
PDF
Topics: Cycles, Fatigue life, Temperature, Finite element methods, Thin films, Glass, Textiles, Constitutive equations, Creep, Epoxy resins
Proceedings Papers

Improvement of the Long-Term Reliability of Interconnection by Controlling the Crystallinity of Grain Boundaries

Takahiro Nakanishi, Ken Suzuki, Hideo Miura
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A006, July 6–9, 2015
Paper No: IPACK2015-48200
DOI: https://doi.org/10.1115/IPACK2015-48200
View Paper
PDF
Topics: Grain boundaries, Reliability, Copper, Thin films, Electrical resistivity, Electron backscatter diffraction, Brittleness, Diffusion (Physics), Dislocations, Focused ion beams
Proceedings Papers

Small-Scale Vorticity Induced by a Self-Oscillating Fluttering Reed for Heat Transfer Augmentation in Air Cooled Heat Sinks

Pablo Hidalgo, Ari Glezer
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A004, July 6–9, 2015
Paper No: IPACK2015-48511
DOI: https://doi.org/10.1115/IPACK2015-48511
View Paper
PDF
Topics: Heat sinks, Heat transfer, Vorticity, Flow (Dynamics), Fluids, Heat transfer coefficients, Cooling, Energy dissipation, Fins, Heat flux
Proceedings Papers

Harvesting CPU Waste Heat Through Pyroelectric Materials

Soochan Lee, Nishant Singh, Patrick E. Phelan, Carole-Jean Wu
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A079, July 6–9, 2015
Paper No: IPACK2015-48421
DOI: https://doi.org/10.1115/IPACK2015-48421
View Paper
PDF
Topics: Waste heat, Heat, Temperature, Materials properties, Thermal conductivity, Computation, Electric power generation, Energy dissipation, Energy efficiency, Energy generation
Proceedings Papers

Microscale Layering of Liquid and Vapor Phases Within Microstructures for Self-Regulated Flow Delivery to Local Hot Spots

Abdolreza Fazeli, Sajjad Bigham, Mehdi Mortazavi, Saeed Moghaddam
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A013, July 6–9, 2015
Paper No: IPACK2015-48632
DOI: https://doi.org/10.1115/IPACK2015-48632
View Paper
PDF
Topics: Flow (Dynamics), Microscale devices, Vapors, Temperature, Boiling, Heat sinks, Thin films, Design, Evaporation, Heat transfer
Proceedings Papers

Experimental Study of Damage Mechanism of Carbon Nanotube as Nano-Component of Electronic Devices Under High Current Density

Kazuhiko Sasagawa, Kazuhiro Fujisaki, Jun Unuma, Ryota Azuma
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T03A003, July 16–18, 2013
Paper No: IPACK2013-73130
DOI: https://doi.org/10.1115/IPACK2013-73130
View Paper
PDF
Topics: Carbon nanotubes, Current density, Damage, Oxidation, Oxygen, Atoms, Carbon, Density, Electrodes, Electrodiffusion
Proceedings Papers

Effect of the Lattice Mismatch Between Copper Thin-Film Interconnection and Base Material on the Crystallinity of the Interconnection

Chuanhong Fan, Ryosuke Furuya, Osamu Asai, Ken Suzuki, Hideo Miura
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T05A005, July 16–18, 2013
Paper No: IPACK2013-73147
DOI: https://doi.org/10.1115/IPACK2013-73147
View Paper
PDF
Topics: Copper, Thin films, Design, Diffraction, Electron backscatter diffraction, Electrons, Ruthenium, Semiconductor devices
Proceedings Papers

Improvement of the Reliability of Thin-Film Interconnections Based on the Control of the Crystallinity of the Thin Films

Osamu Asai, Ryosuke Furuya, Chuanhong Fan, Ken Suzuki, Hideo Miura
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T07A006, July 16–18, 2013
Paper No: IPACK2013-73149
DOI: https://doi.org/10.1115/IPACK2013-73149
View Paper
PDF
Topics: Reliability, Thin films, Electroplating, Copper, Annealing, Current density, Electrical properties, Electron backscatter diffraction, Electrical resistivity, Grain boundaries
Proceedings Papers

Thermal Management of Ultra Intense Hot Spots With Two-Phase Multi-Microchannels and Embedded Thermoelectric Cooling

Jackson B. Marcinichen, Brian P. d’Entremont, John R. Thome, Gary Bulman, Jay Lewis, Rama Venkatasubramanian
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A023, July 16–18, 2013
Paper No: IPACK2013-73276
DOI: https://doi.org/10.1115/IPACK2013-73276
View Paper
PDF
Topics: Microchannels, Thermal management, Thermoelectric cooling, Cooling, Thermoelectric coolers, Heat, Computer simulation, Currents, Design, Electric current
Proceedings Papers

Evaluation of the Crystallographic Quality of Electroplated Copper Thin-Film Interconnection Embedded in a Si Substrate

Ryosuke Furuya, Osamu Asai, Chuanhong Fan, Ken Suzuki, Hideo Miura
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T05A006, July 16–18, 2013
Paper No: IPACK2013-73148
DOI: https://doi.org/10.1115/IPACK2013-73148
View Paper
PDF
Topics: Copper, Thin films, Electroplating, Electrical properties, Electrical resistivity, Annealing, Bulk solids, Density, Grain boundaries, High temperature
Proceedings Papers

A Hierarchical Framework for Thermal Modelling of Electronic Devices: From Atoms to Chips

David A. Romero, Elham Pakseresht, Daniel Sellan, Aydin Nabovati, Cristina Amon
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A043, July 16–18, 2013
Paper No: IPACK2013-73202
DOI: https://doi.org/10.1115/IPACK2013-73202
View Paper
PDF
Topics: Atoms, Modeling, Engineering simulation, Simulation, Thermal conductivity, Phonons, Physics, Silicon, Gates (Closures), Lattice Boltzmann methods