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Proceedings Papers

Additively Manufactured Liquid-Cooled Heat Sink: Gyroid-Based Design, Fabrication, and Testing

Adrian Jourdan, Alexander Sarvadi, Hector R. Siller, Huseyin Bostanci

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A003, October 25–27, 2022

Paper No: IPACK2022-97476

DOI: https://doi.org/10.1115/IPACK2022-97476

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Topics: Additive manufacturing, Design, Heat sinks, Manufacturing, Testing, Topology

Proceedings Papers

Topology Optimization of Heat Sink for 3d Integrated Power Converters

Xiaoqiang Xu, Abdul Basit Mirza, Lingfeng Gao, Fang Luo, Shikui Chen

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T09A009, October 25–27, 2022

Paper No: IPACK2022-98066

DOI: https://doi.org/10.1115/IPACK2022-98066

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Topics: Heat sinks, Optimization, Power converters, Topology, Design, Convection, Cooling, Computer simulation, Density, Filtration

Proceedings Papers

Additive Manufacturing of Electronic Patterns for Harsh Environments

Nicolas Delavault, Tanguy Lacondemine, Rémy Kalmar, Manuel Fendler, Sofiane Achache, Frederic Sanchette

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A001, October 25–27, 2022

Paper No: IPACK2022-94052

DOI: https://doi.org/10.1115/IPACK2022-94052

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Topics: Additive manufacturing, Extruding, Modeling, Strain measurement, Internet of things, Adhesives, Blocks (Building materials), Inks, Optimization, Oscillations

Proceedings Papers

An Advanced Energy Efficient Rack Server Design With Distributed Battery Subsystem

Chun Wang, Xiaoguang Sun, Jun Zhang, Nishi Ahuja

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A004, August 29–September 1, 2017

Paper No: IPACK2017-74033

DOI: https://doi.org/10.1115/IPACK2017-74033

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Topics: Batteries, Design, Data centers, Energy efficiency, Energy consumption, Data collection, Design methodology, Lead-acid batteries, Optimization, Topology

Proceedings Papers

Topology Optimization, Additive Layer Manufacturing, and Experimental Testing of an Air-Cooled Heat Sink

Ercan M. Dede, Shailesh N. Joshi, Feng Zhou

Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T03A001, July 6–9, 2015

Paper No: IPACK2015-48027

DOI: https://doi.org/10.1115/IPACK2015-48027

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Topics: Heat sinks, Manufacturing, Optimization, Testing, Topology, Computer-aided design, Design, Aluminum, Convection, Cooling

Proceedings Papers

Lid-Integral Cold Plate Topology Integration, Performance, and Reliability

Gerd Schlottig, Marco de Fazio, Werner Escher, Paola Granatieri, Vijayeshwar D. Khanna, Thomas Brunschwiler

Paper No: IPACK2015-48427

DOI: https://doi.org/10.1115/IPACK2015-48427

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Topics: Reliability, Topology, Silicon, Packaging, Composite materials, Cooling, Finite element model, Fracture (Materials), Fracture (Process), Gaskets

Proceedings Papers

Experimental Investigation of the Thermal Performance of a Manifold Hierarchical Microchannel Cold Plate

Ercan M. Dede

Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 59-67, July 6–8, 2011

Paper No: IPACK2011-52023

DOI: https://doi.org/10.1115/IPACK2011-52023

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Topics: Manifolds, Microchannels, Flat plates, Pressure drop, Heat transfer, Optimization, Pressure, Temperature, Thermal resistance, Thermofluids

Proceedings Papers

Topology Optimization on Targeting Frequency and Mode of Ultrasonic Bonding Tool for Microchip Packaging

Chang Yong Ha, Soo Il Lee

Paper No: IPACK2011-52100

DOI: https://doi.org/10.1115/IPACK2011-52100

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Topics: Bonding, Integrated circuits, Optimization, Packaging, Topology, Design, Modal assurance criterion, Vibration, Errors, Finite element model

Proceedings Papers

Development of Boundary Condition Independent Compact Thermal Models for Opto-Electronic Packages

Arun Prakash Raghupathy, Attila Aranyosi, Urmila Ghia, Karman Ghia, William Maltz

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 741-751, July 19–23, 2009

Paper No: InterPACK2009-89092

DOI: https://doi.org/10.1115/InterPACK2009-89092

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Topics: Boundary-value problems, Heat, Construction, Design, Errors, Flow (Dynamics), Junctions, Matlab, Natural convection, Optimization

Proceedings Papers

Fracture Life Evaluation of Cu-Cored Solder Joint in BGA Package

Hisashi Tanie, Nobuhiko Chiwata, Motoki Wakano, Masaru Fujiyoshi, Takeyuki Itabashi

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 797-802, July 19–23, 2009

Paper No: InterPACK2009-89232

DOI: https://doi.org/10.1115/InterPACK2009-89232

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Topics: Ball-Grid-Array packages, Fracture (Materials), Solder joints, Solders, Crack propagation, Shapes, Finite element analysis, Particulate matter, Stiffness, Deformation

Proceedings Papers

Flat Tree Networks

P. Khanduri, A. Wood, D. Cohen, I. Birkeli, F. Sem-Jacobsen

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 49-55, July 19–23, 2009

Paper No: InterPACK2009-89336

DOI: https://doi.org/10.1115/InterPACK2009-89336

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Topics: Packaging, Signals, Switches, Textiles, Topology

Proceedings Papers

Nodal Topology in Compact Thermal Models

D. H. Greisen, V. P. Manno

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 637-643, July 8–12, 2007

Paper No: IPACK2007-33425

DOI: https://doi.org/10.1115/IPACK2007-33425

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Topics: Ball-Grid-Array packages, Boundary-value problems, Design, Electronic packages, Errors, Heat flux, Heat transfer coefficients, Mechanical admittance, Topology

Proceedings Papers

A New Resistor-Capacitor (RC) Transient Thermal Network Approach for Power Amplifier Module in Handheld Telecommunication

Youmin Yu, Victor Adrian Chiriac, Tien-Yu Tom Lee

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 783-790, July 8–12, 2007

Paper No: IPACK2007-33335

DOI: https://doi.org/10.1115/IPACK2007-33335

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Topics: Capacitors, Resistors, Telecommunications, Transients (Dynamics), Temperature, Cycles, Heat, Topology, Curve fitting, Simulation

Proceedings Papers

Shape Prediction of Molten Micro-Solder Joints Using Particle Method and Application to Evaluation of Fracture Life

Hisashi Tanie

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 87-94, July 8–12, 2007

Paper No: IPACK2007-33319

DOI: https://doi.org/10.1115/IPACK2007-33319

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Topics: Fracture (Materials), Particulate matter, Shapes, Solders, Crack propagation, Topology, Deformation, Lead-free solders, Solder joints, Finite element analysis

Proceedings Papers

Thermal Characterization of Dual-Core Processor in Computer Equipment

Manoj Nagulapally, Gamal Refai-Ahmed

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 487-491, July 17–22, 2005

Paper No: IPACK2005-73365

DOI: https://doi.org/10.1115/IPACK2005-73365

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Topics: Agglomeration (Materials), Boundary-value problems, Computational fluid dynamics, Computers, Energy conservation, Engineering simulation, Network models, Physics, Simulation, Simulation results

Proceedings Papers

A Broadband Wave Division Multiplexed (WDM) Local Area Network for Military Aircraft Using Commercial Off-the-Shelf (COTS) Components

Andrew S. Glista, Jr., John Nahvi

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 621-628, July 6–11, 2003

Paper No: IPACK2003-35062

DOI: https://doi.org/10.1115/IPACK2003-35062

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Topics: Military aircraft, Waves, Fibers, Aircraft, Cables, Design, Flight, Testing, Signals, Aerospace industry

NARROW

Additively Manufactured Liquid-Cooled Heat Sink: Gyroid-Based Design, Fabrication, and Testing

Topology Optimization of Heat Sink for 3d Integrated Power Converters

Additive Manufacturing of Electronic Patterns for Harsh Environments

An Advanced Energy Efficient Rack Server Design With Distributed Battery Subsystem

Topology Optimization, Additive Layer Manufacturing, and Experimental Testing of an Air-Cooled Heat Sink

Lid-Integral Cold Plate Topology Integration, Performance, and Reliability

Experimental Investigation of the Thermal Performance of a Manifold Hierarchical Microchannel Cold Plate

Topology Optimization on Targeting Frequency and Mode of Ultrasonic Bonding Tool for Microchip Packaging

Development of Boundary Condition Independent Compact Thermal Models for Opto-Electronic Packages

Fracture Life Evaluation of Cu-Cored Solder Joint in BGA Package

Flat Tree Networks

Nodal Topology in Compact Thermal Models

A New Resistor-Capacitor (RC) Transient Thermal Network Approach for Power Amplifier Module in Handheld Telecommunication

Shape Prediction of Molten Micro-Solder Joints Using Particle Method and Application to Evaluation of Fracture Life

Thermal Characterization of Dual-Core Processor in Computer Equipment

A Broadband Wave Division Multiplexed (WDM) Local Area Network for Military Aircraft Using Commercial Off-the-Shelf (COTS) Components

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