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Proceedings Papers

Transient CFD Analysis of Dynamic Liquid-Cooling Implementation at Rack Level

Himanshu Modi, Pardeep Shahi, Akiilessh Sivakumar, Satyam Saini, Pratik Bansode, Vibin Shalom, Amrutha Valli Rachakonda, Gautam Gupta, Dereje Agonafer
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A012, October 25–27, 2022
Paper No: IPACK2022-97443
DOI: https://doi.org/10.1115/IPACK2022-97443
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Topics: Computational fluid dynamics, Cooling, Transient analysis, Transients (Dynamics)
Proceedings Papers

Data Driven Modeling Advancements for Thermal Predictions in Data Center Applications

Dhaval Patel, Yogendra Joshi
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A015, October 25–27, 2022
Paper No: IPACK2022-97478
DOI: https://doi.org/10.1115/IPACK2022-97478
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Topics: Data centers, Modeling, Transients (Dynamics)
Proceedings Papers

Experimental Study of Transient Hydraulic Characteristics for Liquid Cooled Data Center Deployment

Ali Heydari, Pardeep Shahi, Vahideh Radmard, Bahareh Eslami, Uschas Chowdhury, Akiilessh Sivakumar, Akshay Lakshminarayana, Harold Miyamura, Gautam Gupta, Dereje Agonafer, Jeremy Rodriguez
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A009, October 25–27, 2022
Paper No: IPACK2022-97425
DOI: https://doi.org/10.1115/IPACK2022-97425
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Topics: Cooling, Data centers, Flow control, Plates (structures), Transients (Dynamics)
Proceedings Papers

Reliable Additive Manufacturing Using Transient Liquid Phase Sintering

Gilad Nave, Clifton Buxbaum, F. Patrick McCluskey
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A012, October 26–28, 2021
Paper No: IPACK2021-73367
DOI: https://doi.org/10.1115/IPACK2021-73367
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Topics: Additive manufacturing, Sintering, Tension-leg platforms, Transients (Dynamics)
Proceedings Papers

A Novel Concept for Air Removal in Two-Phase Immersion Cooling Systems

Eric Peterson, Seth Morris, Husam Alissa, Nicholas Keehn, Bharath Ramakrishnan, Vaidehi Oruganti, Ioannis Manousakis, Noah Mckay
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A009, October 26–28, 2021
Paper No: IPACK2021-72682
DOI: https://doi.org/10.1115/IPACK2021-72682
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Topics: Boilers, Carbon, Condensers (steam plant), Cooling, Cooling systems, Emissions, Energy consumption, Film thickness, Fluids, Gases
Proceedings Papers

Transient Performance and Melt Front Characterization of Phase Change Materials

Tyler Stamps, David Huitink
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A005, October 26–28, 2021
Paper No: IPACK2021-73252
DOI: https://doi.org/10.1115/IPACK2021-73252
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Topics: Phase change materials, Transients (Dynamics), Matlab, Temperature, Computation, Computer simulation, Convection, Finite element analysis, Heat, Heat flux
Proceedings Papers

Phase Change Material’s (PCMs) Effectiveness Index for Rapid Assessment in Thermal Management of Transient Pulse Electronics

Adrian Olivera, Jhonathan Rosales, Pedro O. Quintero
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A003, October 26–28, 2021
Paper No: IPACK2021-69321
DOI: https://doi.org/10.1115/IPACK2021-69321
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Topics: Design, Electronics, Heat, Phase change materials, Thermal management, Transients (Dynamics)
Proceedings Papers

Thermal Model of the Package Integrated Cyclone COoler (PICCO): Achieving High Thermal Conductance Using Swirled Two-Phase Flow

Rinaldo L. Miorini, Darin J. Sharar, Peter deBock
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A012, October 27–29, 2020
Paper No: IPACK2020-2605
DOI: https://doi.org/10.1115/IPACK2020-2605
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Topics: Thermal conductivity, Two-phase flow, Flow (Dynamics), Additive manufacturing, Army, Boundary-value problems, Bubbles, Buoyancy, Capacitance, Collaboration
Proceedings Papers

Experimental Characterization of Heat Transfer and Thermal Energy Storage Capability Using Swirling Two-Phase Flow in the Package Integrated Cyclone COoler (PICCO)

Peter deBock, Rinaldo Miorini, Cathleen Hoel, Darin Sharar, Bryan Whalen
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A013, October 27–29, 2020
Paper No: IPACK2020-2606
DOI: https://doi.org/10.1115/IPACK2020-2606
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Topics: Electronics, Experimental characterization, Heat transfer, Swirling flow, Thermal energy storage, Transients (Dynamics), Two-phase flow
Proceedings Papers

Silicon Carbide Power Module Co-Designed for Enhanced Thermal and Electrical Performance in Steady State and Transient Conditions

Arun V. Gowda, Rinaldo L. Miorini, Michael Fish, Darin J. Sharar, Peter deBock
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A014, October 27–29, 2020
Paper No: IPACK2020-2608
DOI: https://doi.org/10.1115/IPACK2020-2608
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Topics: Silicon, Steady state, Transients (Dynamics), Additive manufacturing, Flow (Dynamics), Army, Bubbles, Buoyancy, Capacitance, Collaboration
Proceedings Papers

Design, Analysis and Comparison of Insulated Metal Substrates for High Power Wide-Bandgap Power Modules

Emre Gurpinar, Burak Ozpineci, Shajjad Chowdhury
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A013, October 7–9, 2019
Paper No: IPACK2019-6436
DOI: https://doi.org/10.1115/IPACK2019-6436
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Topics: Design, Energy gap, Metals, Transients (Dynamics), Ceramics, Copper, Finite element analysis, Materials properties, MOSFET transistors, Semiconductors (Materials)
Proceedings Papers

System Electrothermal Transient Analysis of a High Current (40A) Synchronous Step Down Converter

Rajen Murugan, Jie Chen, Todd Harrison, C. T. Kao, Nathan Ai
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A004, October 7–9, 2019
Paper No: IPACK2019-6384
DOI: https://doi.org/10.1115/IPACK2019-6384
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Topics: Capacitors, Design, Inductors, Modeling, Multi-chip modules, Packaging, Power density, Silicon, Simulation, Transient analysis
Proceedings Papers

Metallic PCM’s Microstructural Stability Under Repetitive Melting/Solidification Cycles

Rafael Báez, Luis E. González, Pedro O. Quintero, Lauren M. Boteler
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A005, October 7–9, 2019
Paper No: IPACK2019-6385
DOI: https://doi.org/10.1115/IPACK2019-6385
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Topics: Cooling, Cycles, Melting, Solidification, Stability, Thermal stability, Alloys, Metals, Temperature, Thermal management
Proceedings Papers

Evaluation of Thermal and Electrical Properties of Nano-Enhanced PCM for Usage in High-Voltage Systems

Ange-Christian Iradukunda, Josh Kasitz, Fernando Moreno, David Huitink
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A010, October 7–9, 2019
Paper No: IPACK2019-6422
DOI: https://doi.org/10.1115/IPACK2019-6422
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Topics: Electrical properties, Electronic packages, Electronics, Graphene, Heat, Iron, Latent heat, Nanocomposites, Particulate matter, Phase change materials
Proceedings Papers

Investigation Regarding Transient Compact Thermal Model for Microprocessor Packages

Koji Nishi
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A005, October 7–9, 2019
Paper No: IPACK2019-6390
DOI: https://doi.org/10.1115/IPACK2019-6390
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Topics: Transients (Dynamics)
Proceedings Papers

An Experimental Investigation on the Fluid Distribution in a Two-Phase Cooled Rack Under Steady and Transient IT Load

Sadegh Khalili, Srikanth Rangarajan, Bahgat Sammakia, Vadim Gektin
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A007, October 7–9, 2019
Paper No: IPACK2019-6463
DOI: https://doi.org/10.1115/IPACK2019-6463
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Topics: Cooling, Fluids, Stress, Transients (Dynamics)
Proceedings Papers

Heat Transfer Characteristics and Flow Pattern Visualization for Flow Boiling in a Vertical Narrow Microchannel

Kan Zhou, Junye Li, Zhao-zan Feng, Wei Li, Hua Zhu, Kuang Sheng
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A021, August 27–30, 2018
Paper No: IPACK2018-8447
DOI: https://doi.org/10.1115/IPACK2018-8447
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Topics: Boiling, Flow (Dynamics), Heat transfer, Microchannels, Visualization, Nucleate boiling, Bubbles, Fluids, Flux (Metallurgy), Heat
Proceedings Papers

Mechanical Characterization of Transient Liquid Phase Sintered (TLPS) Cu-Sn

Erick Gutierrez, Subramani Manoharan, Maxim Serebreni, Patrick McCluskey
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A018, August 27–30, 2018
Paper No: IPACK2018-8392
DOI: https://doi.org/10.1115/IPACK2018-8392
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Topics: Tension-leg platforms, Tin, Transients (Dynamics), Alloys, High temperature, Nanoindentation, Shear (Mechanics), Stress, Copper, Electronic systems
Proceedings Papers

Multifunctional Chip for Use in Thermal Analysis of Power Systems

David Gonzalez-Nino, Lauren Boteler, Damian P. Urciuoli, Iain M. Kierzewski, Dimeji Ibitayo, Pedro O. Quintero
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A014, August 27–30, 2018
Paper No: IPACK2018-8355
DOI: https://doi.org/10.1115/IPACK2018-8355
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Topics: Design, Electronic systems, Flux (Metallurgy), Heat, Heat flux, High temperature, Instrumentation, Junctions, Military systems, Power systems (Machinery)
Proceedings Papers

Prediction and Mitigation of Vertical Cracking in High-Temperature Transient Liquid Phase Sintered Joints by Thermo-Mechanical Simulation

Hannes Greve, S. Ali Moeini, Patrick McCluskey, Shailesh Joshi
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A003, August 29–September 1, 2017
Paper No: IPACK2017-74138
DOI: https://doi.org/10.1115/IPACK2017-74138
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Topics: Cracking (Materials), Fracture (Process), High temperature, Simulation, Thermomechanics, Transients (Dynamics), Tension-leg platforms, Stress, Fracture (Materials), Tin