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Proceedings Papers

Drop Durability of Printed Hybrid Electronic (PHE) Assemblies Under Extreme Acceleration Level

Hisham Abusalma, Abhijit Dasgupta, Andres Bujanda, Jian Yu, Harvey Tsang
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A003, October 25–27, 2022
Paper No: IPACK2022-97382
DOI: https://doi.org/10.1115/IPACK2022-97382
View Paper titled, Drop Durability of Printed Hybrid Electronic (PHE) Assemblies Under Extreme Acceleration Level
Click here to open pdf in another window PDF for Drop Durability of Printed Hybrid Electronic (PHE) Assemblies Under Extreme Acceleration Level
Topics: Durability, Failure, Domes (Structural elements), Cantilever beams, Disks, Silver, Additive manufacturing, Bending (Stress), Clamps (Tools), Damage
Proceedings Papers

Correlated Effects of Self-Heating, Light Output, and Efficiency of GaN Light-Emitting Diodes on Junction Temperature

Bikramjit Chatterjee, James Spencer Lundh, Daniel Shoemaker, Tae Kyoung Kim, Joon Seop Kwak, Jaehee Cho, Sukwon Choi
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A004, October 7–9, 2019
Paper No: IPACK2019-6426
DOI: https://doi.org/10.1115/IPACK2019-6426
View Paper titled, Correlated Effects of Self-Heating, Light Output, and Efficiency of GaN Light-Emitting Diodes on Junction Temperature
Click here to open pdf in another window PDF for Correlated Effects of Self-Heating, Light Output, and Efficiency of GaN Light-Emitting Diodes on Junction Temperature
Topics: Gallium nitride, Heating, Junctions, Light-emitting diodes, Temperature, Brightness (Photometry), Indium gallium nitride, Nanoparticles, Quantum wells, Temperature measurement
Proceedings Papers

The Effects of Curing Profile, Temperature, and Aging on the Mechanical Behavior of Solder Mask Materials

Promod R. Chowdhury, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A004, August 27–30, 2018
Paper No: IPACK2018-8405
DOI: https://doi.org/10.1115/IPACK2018-8405
View Paper titled, The Effects of Curing Profile, Temperature, and Aging on the Mechanical Behavior of Solder Mask Materials
Click here to open pdf in another window PDF for The Effects of Curing Profile, Temperature, and Aging on the Mechanical Behavior of Solder Mask Materials
Topics: Hardening (Curing), Mechanical behavior, Solder masks, Temperature, Ultraviolet radiation, Creep, Mechanical properties, Elastic moduli, Stress, Tensile testing
Proceedings Papers

Low Temperature Fabrication of Three-Dimensional Ceramic Substrate by Using Inorganic Alkali Activated Aluminosilicate Cement Paste for UV-LED Packaging

Hao Cheng, Zi Zhou Yang, Yang Peng, Yun Mou, Ming Xiang Chen
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A003, August 27–30, 2018
Paper No: IPACK2018-8226
DOI: https://doi.org/10.1115/IPACK2018-8226
View Paper titled, Low Temperature Fabrication of Three-Dimensional Ceramic Substrate by Using Inorganic Alkali Activated Aluminosilicate Cement Paste for UV-LED Packaging
Click here to open pdf in another window PDF for Low Temperature Fabrication of Three-Dimensional Ceramic Substrate by Using Inorganic Alkali Activated Aluminosilicate Cement Paste for UV-LED Packaging
Topics: Cements (Adhesives), Ceramics, Low temperature, Manufacturing, Packaging, Ultraviolet radiation, Shear strength, Hardening (Curing), Heat, Light-emitting diodes
Proceedings Papers

Design and Development of Biometric Sensor Wearable Band Using Flexible Electronics

Pradeep Lall, Hao Zhang, Rahul Lall
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A002, August 29–September 1, 2017
Paper No: IPACK2017-74232
DOI: https://doi.org/10.1115/IPACK2017-74232
View Paper titled, Design and Development of Biometric Sensor Wearable Band Using Flexible Electronics
Click here to open pdf in another window PDF for Design and Development of Biometric Sensor Wearable Band Using Flexible Electronics
Topics: Biometry, Design, Flexible electronics, Sensors, Electronics, Manufacturing, Reliability, Thermal stresses, Biomedicine, Copper
Proceedings Papers

Investigation of Peeling Behavior of UV Curable Pressure Sensitive Adhesive for Bump-Wafer

Naoya Saiki, Yuichiro Komasu, Kazuto Aizawa, Jun Maeda
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A007, August 29–September 1, 2017
Paper No: IPACK2017-74010
DOI: https://doi.org/10.1115/IPACK2017-74010
View Paper titled, Investigation of Peeling Behavior of UV Curable Pressure Sensitive Adhesive for Bump-Wafer
Click here to open pdf in another window PDF for Investigation of Peeling Behavior of UV Curable Pressure Sensitive Adhesive for Bump-Wafer
Topics: Adhesives, Pressure, Semiconductor wafers, Ultraviolet radiation, String, Finite element analysis, Deformation, Elongation, Finite element model, Fracture (Materials)
Proceedings Papers

3-D Antenna Structures Using Novel Direct-Write Additive Manufacturing Method

Md Taibur Rahman, Rahul Panat, Deuk Heo
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T03A002, July 6–9, 2015
Paper No: IPACK2015-48187
DOI: https://doi.org/10.1115/IPACK2015-48187
View Paper titled, 3-D Antenna Structures Using Novel Direct-Write Additive Manufacturing Method
Click here to open pdf in another window PDF for 3-D Antenna Structures Using Novel Direct-Write Additive Manufacturing Method
Topics: Additive manufacturing, Aerosols, Metals, Inks, Manufacturing, Nanoparticles, Shapes, Sintering, Ultraviolet radiation, Wavelength
Proceedings Papers

Observation of UV Nanoimprint Lithography Process by Micro-Digitalholographic-PTV

Jun Taniguchi, Shin-ichi Satake, Noriyuki Unno, Takahiro Kanai
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 593-597, July 19–23, 2009
Paper No: InterPACK2009-89220
DOI: https://doi.org/10.1115/InterPACK2009-89220
View Paper titled, Observation of UV Nanoimprint Lithography Process by Micro-Digitalholographic-PTV
Click here to open pdf in another window PDF for Observation of UV Nanoimprint Lithography Process by Micro-Digitalholographic-PTV
Topics: Lithography, Ultraviolet radiation, Resins, Hardening (Curing), Errors, Fluids, Nanofabrication, Particulate matter, Resolution (Optics), Shrinkage (Materials)
Proceedings Papers

Exploration of Thermolithography for Micro- and Nano-Manufacturing

Ming-Tsung Hung, Y. Sungtaek Ju
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1949-1954, July 17–22, 2005
Paper No: IPACK2005-73424
DOI: https://doi.org/10.1115/IPACK2005-73424
View Paper titled, Exploration of Thermolithography for Micro- and Nano-Manufacturing
Click here to open pdf in another window PDF for Exploration of Thermolithography for Micro- and Nano-Manufacturing
Topics: Experimental methods, Heat, Heating, Lithography, Manufacturing, Nanomanufacturing, Nanoscale devices, Photoresists, Polymer films, Temperature
Proceedings Papers

Effects of Localized Heat Generations Due to the Color Conversion in Phosphor Particles and Layers of High Brightness Light Emitting Diodes

Mehmet Arik, Stanton Weaver, Charles Becker, Michael Hsing, Alok Srivastava
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 611-619, July 6–11, 2003
Paper No: IPACK2003-35015
DOI: https://doi.org/10.1115/IPACK2003-35015
View Paper titled, Effects of Localized Heat Generations Due to the Color Conversion in Phosphor Particles and Layers of High Brightness Light Emitting Diodes
Click here to open pdf in another window PDF for Effects of Localized Heat Generations Due to the Color Conversion in Phosphor Particles and Layers of High Brightness Light Emitting Diodes
Topics: Brightness (Photometry), Heat, Light-emitting diodes, Particulate matter, Phosphors, Reliability, Computer simulation, Finite element analysis, Heating, Light sources