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Proceedings Papers

On the Viscoelastic Property Measurement of Filled Polymers by Dynamic Mechanical Analyzer (DMA)

Sukrut Prashant Phansalkar, Bongtae Han, Ehsan Akbari, Paulius Vaitiekunas

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A004, October 25–27, 2022

Paper No: IPACK2022-97719

DOI: https://doi.org/10.1115/IPACK2022-97719

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Topics: Filled polymers, Viscoelasticity

Proceedings Papers

Modeling Underfill Degradation and Its Effect on FCBGA Package Reliability Under High-Temperature Operation

Pradeep Lall, Madhu Kasturi, Haotian Wu, Edward Davis

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A009, October 25–27, 2022

Paper No: IPACK2022-97433

DOI: https://doi.org/10.1115/IPACK2022-97433

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Topics: High temperature, Modeling, Reliability, Flip-chip, Solder joints, Ball-Grid-Array packaging, Electronics, Fatigue failure, Fatigue life, Materials degradation

Proceedings Papers

Characterization of Linear Viscoelasticity Evolution of Epoxy Molding Compound Subjected to High Temperature Long Term Aging

Pradeep Lall, Yunli Zhang, Haotian Wu, Jeff Suhling, Edward Davis, Jaimal Williamson

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A023, October 26–28, 2021

Paper No: IPACK2021-74075

DOI: https://doi.org/10.1115/IPACK2021-74075

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Topics: Epoxy adhesives, Epoxy resins, High temperature, Molding, Viscoelasticity

Proceedings Papers

Property Evolution and Reliability of Underfills Under Sustained High Temperature Storage

Pradeep Lall, Madhu Kasturi, Haotian Wu, Jeff Suhling, Edward Davis

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A017, October 26–28, 2021

Paper No: IPACK2021-74061

DOI: https://doi.org/10.1115/IPACK2021-74061

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Topics: High temperature, Relaxation (Physics), Reliability, Storage, Temperature, Viscoelasticity, Electronics, Glass transition, Materials properties, Mechanical properties

Proceedings Papers

Correlation of Microstructural Evolution With the Dynamic-Mechanical Viscoelastic Properties of Underfill Under Sustained High Temperature Operation

Pradeep Lall, Madhu Kasturi, Haotian Wu, Ed Davis, Jeff Suhling

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A012, October 27–29, 2020

Paper No: IPACK2020-2675

DOI: https://doi.org/10.1115/IPACK2020-2675

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Topics: Glass transition, High temperature, Mechanical properties, Optical microscopes, Oxidation, Viscoelasticity, Electronics, Operating temperature, Reliability, Storage

Proceedings Papers

Modeling of Underfilled PBGA Assemblies Using Both Viscoelastic and Elastic Material Properties

Promod R. Chowdhury, Jeffrey C. Suhling, Pradeep Lall

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A007, October 7–9, 2019

Paper No: IPACK2019-6561

DOI: https://doi.org/10.1115/IPACK2019-6561

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Topics: Fatigue life, Finite element analysis, Materials properties, Modeling, Stress, Viscoelasticity, Temperature, Polymers, Simulation, Relaxation (Physics)

Proceedings Papers

Shrinkage of Post-Cure Die Attach Adhesives During Isothermal Storage

Ruiyang Liu, HoHyung Lee, Seungbae Park, Xiaojie Xue

Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T07A005, July 6–9, 2015

Paper No: IPACK2015-48086

DOI: https://doi.org/10.1115/IPACK2015-48086

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Topics: Adhesives, Shrinkage (Materials), Storage, Finite element analysis, Sensors, Viscoelasticity, Epoxy adhesives, Epoxy resins, MEMS packaging, Microelectromechanical systems

Proceedings Papers

Characterization of Cure-Dependent Viscoelastic Behavior for Molding Compound and Application to Package Warpage Simulation

Tz-Cheng Chiu, Je-Li Kung, Yi-Shao Lai

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 9-17, July 19–23, 2009

Paper No: InterPACK2009-89040

DOI: https://doi.org/10.1115/InterPACK2009-89040

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Topics: Molding, Simulation, Viscoelasticity, Warping, Ball-Grid-Array packaging, Finite element analysis, Temperature, Constitutive equations, Cooling, Epoxy adhesives

Proceedings Papers

Effect of Viscoelasticity on Thermalmechanical Stress in Polymers

Yaoyu Pang, Jie-Hua Zhao, Darvin Edwards

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 379-384, July 19–23, 2009

Paper No: InterPACK2009-89169

DOI: https://doi.org/10.1115/InterPACK2009-89169

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Topics: Polymers, Stress, Viscoelasticity, Polymer films, Temperature, Temperature profiles, Thermomechanics

Proceedings Papers

Characterization of Viscoelasticity of Molding Compounds in Time Domain

Seung-Hyun Chae, Jie-Hua Zhao, Darvin R. Edwards, Paul S. Ho

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 435-441, July 19–23, 2009

Paper No: InterPACK2009-89388

DOI: https://doi.org/10.1115/InterPACK2009-89388

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Topics: Molding, Viscoelasticity, Relaxation (Physics), Polymers, Stress, Microelectronic packaging, Stress analysis (Engineering), Temperature

Proceedings Papers

Visco-Elastic Effect of Underfill Material in Reliability Analysis of Flip-Chip Package

Yoshihiko Kanda, Kunihiro Zama, Yoshiharu Kariya, Takao Mikami, Takaya Kobayashi, Toshiyuki Sato, Toshiaki Enomoto, Koichi Hirata

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 755-759, July 19–23, 2009

Paper No: InterPACK2009-89152

DOI: https://doi.org/10.1115/InterPACK2009-89152

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Topics: Event history analysis, Flip-chip packages, Fatigue life, Finite element analysis, Viscoelasticity, Cooling, Solders, Warping

Proceedings Papers

Thermo-Viscoelastic Analysis for Warpage in CSP With Different Viscoelastic Properties for Several Layers

Hideo Koguchi, Atsushi Ueno

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 13-19, July 8–12, 2007

Paper No: IPACK2007-33591

DOI: https://doi.org/10.1115/IPACK2007-33591

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Topics: Viscoelasticity, Warping, Resins, Manufacturing, Packaging, Temperature, Theoretical analysis, Thermal expansion

Proceedings Papers

A Thermo-Viscoelastic Analysis and Reliability Evaluation for a Single-Sided CSP

Hideo Koguchi, Mirai Ishida, Kazuto Nishida, Tomoaki Kuroishi

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1405-1412, July 17–22, 2005

Paper No: IPACK2005-73096

DOI: https://doi.org/10.1115/IPACK2005-73096

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Topics: Deflection, Reliability, Stress, Viscoelasticity, Relaxation (Physics), Resins, Thermodynamic cycles, Adhesives, Thermal expansion, Thermal stresses

Proceedings Papers

Utilizing the Novel Laser Spallation Technique to Measure Interfacial Strength in Microelectronic Packages

Arun Raman, Jun Tian, Alfred A. La Mar, Shalabh Tandon

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1881-1887, July 17–22, 2005

Paper No: IPACK2005-73389

DOI: https://doi.org/10.1115/IPACK2005-73389

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Topics: Lasers, Spallation (Nuclear physics), Adhesion, Adhesives, Ball-Grid-Array packaging, Copper, Dielectric materials, Epoxy adhesives, Epoxy resins, Flip-chip

Proceedings Papers

Exploring the Possibility of Approximating Viscoelastic Response of Underfill Materials Through the Use of Appropriate Linear-Elastic Material Models

Shankar Ganapathysubramanian, Sandeep Sane, Richard Raymond Dimagiba, Biju I. Chandran

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1523-1528, July 17–22, 2005

Paper No: IPACK2005-73401

DOI: https://doi.org/10.1115/IPACK2005-73401

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Topics: Approximation, Computer simulation, Elastic analysis, Electronic packaging, Flip-chip, Manufacturing, Modeling, Packaging, Polymers, Risk assessment

Proceedings Papers

Characterization of Non-Conductive Adhesives

Daniel Farley, Abhijit Dasgupta, J. F. J. M. Caers

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1365-1370, July 17–22, 2005

Paper No: IPACK2005-73021

DOI: https://doi.org/10.1115/IPACK2005-73021

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Topics: Adhesives, Manufacturing, Stress, Metals, Modeling, Contact resistance, Simulation, Temperature, Bonding, Compression

Proceedings Papers

Prediction of Equilibrium and Stability of Molten Solder Geometries by Finite Element Analysis

Takahiro Nagata, Takaya Kobayashi

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1181-1186, July 17–22, 2005

Paper No: IPACK2005-73162

DOI: https://doi.org/10.1115/IPACK2005-73162

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Topics: Equilibrium (Physics), Finite element analysis, Solders, Stability, Drops, Surface tension, Constitutive equations, Deformation, Fluids, Creep

NARROW

On the Viscoelastic Property Measurement of Filled Polymers by Dynamic Mechanical Analyzer (DMA)

Modeling Underfill Degradation and Its Effect on FCBGA Package Reliability Under High-Temperature Operation

Characterization of Linear Viscoelasticity Evolution of Epoxy Molding Compound Subjected to High Temperature Long Term Aging

Property Evolution and Reliability of Underfills Under Sustained High Temperature Storage

Correlation of Microstructural Evolution With the Dynamic-Mechanical Viscoelastic Properties of Underfill Under Sustained High Temperature Operation

Modeling of Underfilled PBGA Assemblies Using Both Viscoelastic and Elastic Material Properties

Shrinkage of Post-Cure Die Attach Adhesives During Isothermal Storage

Characterization of Cure-Dependent Viscoelastic Behavior for Molding Compound and Application to Package Warpage Simulation

Effect of Viscoelasticity on Thermalmechanical Stress in Polymers

Characterization of Viscoelasticity of Molding Compounds in Time Domain

Visco-Elastic Effect of Underfill Material in Reliability Analysis of Flip-Chip Package

Thermo-Viscoelastic Analysis for Warpage in CSP With Different Viscoelastic Properties for Several Layers

A Thermo-Viscoelastic Analysis and Reliability Evaluation for a Single-Sided CSP

Utilizing the Novel Laser Spallation Technique to Measure Interfacial Strength in Microelectronic Packages

Exploring the Possibility of Approximating Viscoelastic Response of Underfill Materials Through the Use of Appropriate Linear-Elastic Material Models

Characterization of Non-Conductive Adhesives

Prediction of Equilibrium and Stability of Molten Solder Geometries by Finite Element Analysis

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