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Proceedings Papers

Feasibility Demonstration of Server Chip Package With Direct-to-Chip Optical Transceivers

Shidong Li, Bakul Parikh, Chelsea Savoy, Daniel Kuchta, Guillaume Jutras, Harry Bagheri, Hilton Toy, Joe Ross, Ken-Ichi Akasofu, Mark Kapfhammer, Mark Schultz, Steven Ostrander, Thomas Wassick
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A004, October 25–27, 2022
Paper No: IPACK2022-97455
DOI: https://doi.org/10.1115/IPACK2022-97455
View Paper titled, Feasibility Demonstration of Server Chip Package With Direct-to-Chip Optical Transceivers
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Topics: Cables, Construction, Copper, Cycles, Density, Elastomers, Fibers, Flat heat pipes, Flip-chip, Flip-chip devices
Proceedings Papers

Development of a Novel Test Setup to Study the Combined Effects of Electromigration and Mechanical Stress in Solder Interconnects

Mahsa Montazeri, David R. Huitink
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A004, October 27–29, 2020
Paper No: IPACK2020-2598
DOI: https://doi.org/10.1115/IPACK2020-2598
View Paper titled, Development of a Novel Test Setup to Study the Combined Effects of Electromigration and Mechanical Stress in Solder Interconnects
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Topics: Electrodiffusion, Solders, Stress, Reliability, Tension, Copper, Current density, Wire, Bonding, Electrical resistance
Proceedings Papers

Experimental Study of a Set of Integrated Cross-Media Heat Exchangers (iCMHXs) for Liquid Cooling in Desktop Computers

Gargi Kailkhura, Raphael Mandel, Amir Shooshtari, Michael Ohadi
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A006, October 27–29, 2020
Paper No: IPACK2020-2591
DOI: https://doi.org/10.1115/IPACK2020-2591
View Paper titled, Experimental Study of a Set of Integrated Cross-Media Heat Exchangers (iCMHXs) for Liquid Cooling in Desktop Computers
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Topics: Additive manufacturing, Computational fluid dynamics, Computers, Cooling, Heat exchangers, Urethane elastomers, Sealants, Wire, Fluids, Calibration
Proceedings Papers

Thermoreflectance Imaging of Electromigration in Aluminum Interconnects at Different Ambient Temperatures

Sami Alajlouni, Kerry Maize, Peter Bermel, Ali Shakouri
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A008, October 7–9, 2019
Paper No: IPACK2019-6413
DOI: https://doi.org/10.1115/IPACK2019-6413
View Paper titled, Thermoreflectance Imaging of Electromigration in Aluminum Interconnects at Different Ambient Temperatures
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Topics: Aluminum, Electrodiffusion, Imaging, Temperature, Thermoreflectance, Failure, Design, Resolution (Optics), Temperature profiles, Wire
Proceedings Papers

Failure Mechanism Assessment of TO-247 Packaged SiC Power Devices

Klas Brinkfeldt, Göran Wetter, Andreas Lövberg, Dag Andersson, Zsolt Toth-Pal, Mattias Forslund, Samer Shisha
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A016, August 27–30, 2018
Paper No: IPACK2018-8385
DOI: https://doi.org/10.1115/IPACK2018-8385
View Paper titled, Failure Mechanism Assessment of TO-247 Packaged SiC Power Devices
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Topics: Failure mechanisms, Electronics, Reliability, Acoustics, Automotive industry, Cooling, Elastic moduli, Failure analysis, Heating, High temperature
Proceedings Papers

Improving Energy Efficiency in Data Centers by Controlling Task Distribution and Cooling

Yusuke Nakajo, Jayati Athavale, Minami Yoda, Yogendra Joshi, Hiroaki Nishi
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A005, August 27–30, 2018
Paper No: IPACK2018-8305
DOI: https://doi.org/10.1115/IPACK2018-8305
View Paper titled, Improving Energy Efficiency in Data Centers by Controlling Task Distribution and Cooling
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Topics: Cooling, Data centers, Energy efficiency, Temperature, Stress, Energy consumption, Internet of things, Air conditioning, Air flow, Cloud computing
Proceedings Papers

Copper, Silver, and PCC Wirebonds Reliability in Automotive Underhood Environments

Pradeep Lall, Shantanu Deshpande, Luu Nguyen
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A006, August 27–30, 2018
Paper No: IPACK2018-8358
DOI: https://doi.org/10.1115/IPACK2018-8358
View Paper titled, Copper, Silver, and PCC Wirebonds Reliability in Automotive Underhood Environments
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Topics: Copper, Reliability, Silver, Wire, Failure mechanisms, Shear strength, High temperature, Shear (Mechanics), Wire bonding, Aluminum
Proceedings Papers

Reliability Analysis of Ultra-Low-K Large-Die Package and Wire Bond Chip Package on Varying Structural Parameter Under Thermal Loading

Unique Rahangdale, Pavan Rajmane, Abel Misrak, Dereje Agonafer
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A020, August 29–September 1, 2017
Paper No: IPACK2017-74279
DOI: https://doi.org/10.1115/IPACK2017-74279
View Paper titled, Reliability Analysis of Ultra-Low-K Large-Die Package and Wire Bond Chip Package on Varying Structural Parameter Under Thermal Loading
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Topics: Event history analysis, Wire, Reliability, Failure, Solders, Copper, Dielectric materials, Manufacturing, Microelectronic devices, Solder joints
Proceedings Papers

3D Wire Bondless Integration: The Future of Silicon Carbide (SiC) Packaging

Sayan Seal, Andrea K. Wallace, John E. Zumbro, H. Alan Mantooth
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A015, August 29–September 1, 2017
Paper No: IPACK2017-74213
DOI: https://doi.org/10.1115/IPACK2017-74213
View Paper titled, 3D Wire Bondless Integration: The Future of Silicon Carbide (SiC) Packaging
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Topics: Packaging, Silicon, Wire, MOSFET transistors, Bonding, Electromagnetic interference, Electronics, Energy gap, Flip-chip, High temperature
Proceedings Papers

Advancements in Silver Wire Bonding

Subramani Manoharan, Chandradip Patel, Patrick McCluskey
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A004, August 29–September 1, 2017
Paper No: IPACK2017-74286
DOI: https://doi.org/10.1115/IPACK2017-74286
View Paper titled, Advancements in Silver Wire Bonding
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Topics: Silver, Wire bonding, Copper, Wire, Reliability, Bonding, Corrosion, Light-emitting diodes, Palladium, Aerospace industry
Proceedings Papers

Measurement of Ion-Mobility in Copper-Aluminum Wirebond Electronics Under Operation at High Voltage and High Temperature

Pradeep Lall, Yihua Luo, Shantanu Deshpande, Luu Nguyen
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A006, August 29–September 1, 2017
Paper No: IPACK2017-74325
DOI: https://doi.org/10.1115/IPACK2017-74325
View Paper titled, Measurement of Ion-Mobility in Copper-Aluminum Wirebond Electronics Under Operation at High Voltage and High Temperature
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Topics: Aluminum, Copper, Electronics, High temperature, Ionic mobility, Wire, Corrosion, Diffusion (Physics), Gates (Closures), Bonding
Proceedings Papers

LED Chip Deformation Measurement During the Operation Using the X-Ray CT Digital Volume Correlation

Pradeep Lall, Junchao Wei
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A011, July 6–9, 2015
Paper No: IPACK2015-48785
DOI: https://doi.org/10.1115/IPACK2015-48785
View Paper titled, LED Chip Deformation Measurement During the Operation Using the X-Ray CT Digital Volume Correlation
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Topics: Computerized tomography, Deformation, Displacement, Computation, Electron configuration, Electronics, Heat, Interferometry, Light-emitting diodes, Shapes
Proceedings Papers

Fuming Acid Based Decapsulation Process for Copper-Aluminum Wirebond System Molded With Different EMCs

Pradeep Lall, Shantanu Deshpande, Luu Nguyen
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A004, July 6–9, 2015
Paper No: IPACK2015-48638
DOI: https://doi.org/10.1115/IPACK2015-48638
View Paper titled, Fuming Acid Based Decapsulation Process for Copper-Aluminum Wirebond System Molded With Different EMCs
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Topics: Aluminum, Copper, Wire, Temperature, Chemistry, Compression, Failure analysis, Image processing, Metals, Molding
Proceedings Papers

Mechanical Constitutive Properties of Two High-Temperature Lead-Rich Solders

Qian Jiang, Subhasis Mukherjee, Bastian Vogt, Abhijit Dasgupta, David Shaddock, Liang Yin
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A005, July 6–9, 2015
Paper No: IPACK2015-48708
DOI: https://doi.org/10.1115/IPACK2015-48708
View Paper titled, Mechanical Constitutive Properties of Two High-Temperature Lead-Rich Solders
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Topics: High temperature, Solders, Temperature, Stress, Creep, Equipment performance, Mechanical properties, Melting, Wire
Proceedings Papers

Chlorine-Ion Related Corrosion in Cu-Al Wirebond Microelectronic Packages

Pradeep Lall, Yihua Luo, Luu Nguyen
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A012, July 6–9, 2015
Paper No: IPACK2015-48639
DOI: https://doi.org/10.1115/IPACK2015-48639
View Paper titled, Chlorine-Ion Related Corrosion in Cu-Al Wirebond Microelectronic Packages
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Topics: Corrosion, Wire, Diffusion (Physics), Electrolytic corrosion, Ions, Copper, Electrical resistivity, Molding, Temperature, Deformation
Proceedings Papers

Analysis of Intermetallic Formation During Ultrasonic Ball Bonding

Panthea Sepehrband, Maryam Gholamirad
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A028, July 6–9, 2015
Paper No: IPACK2015-48812
DOI: https://doi.org/10.1115/IPACK2015-48812
View Paper titled, Analysis of Intermetallic Formation During Ultrasonic Ball Bonding
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Topics: Bonding, Intermetallic compounds, Alloys, Aluminum, Copper, Diffusion (Physics), Experimental analysis, Finite element analysis, Low temperature, Micromechanical devices
Proceedings Papers

Co-Placement for Pin-Fin Based Micro-Fluidically Cooled 3D ICs

Zhiyuan Yang, Ankur Srivastava
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A036, July 6–9, 2015
Paper No: IPACK2015-48354
DOI: https://doi.org/10.1115/IPACK2015-48354
View Paper titled, Co-Placement for Pin-Fin Based Micro-Fluidically Cooled 3D ICs
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Topics: Algorithms, Cooling, Design, Flow (Dynamics), Gates (Closures), Heat, Pins (Engineering), Silicon, Temperature, Temperature uniformity
Proceedings Papers

Experimental and Numerical Characterization of a Raised Floor Data Center Using Rapid Operational Flow Curves Model

Husam A. Alissa, Kourosh Nemati, Bahgat Sammakia, Mark Seymour, Ken Schneebeli, Roger Schmidt
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A016, July 6–9, 2015
Paper No: IPACK2015-48234
DOI: https://doi.org/10.1115/IPACK2015-48234
View Paper titled, Experimental and Numerical Characterization of a Raised Floor Data Center Using Rapid Operational Flow Curves Model
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Topics: Data centers, Flow (Dynamics), Modeling, Computational fluid dynamics, Pressure, Tiles, Boundary-value problems, Cooling, Dimensions, Ducts
Proceedings Papers

Resistance Spectroscopy Based Assessment of Degradation in Cu-Al Wire Bond Interconnects

Pradeep Lall, Yihua Luo
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T05A017, July 16–18, 2013
Paper No: IPACK2013-73308
DOI: https://doi.org/10.1115/IPACK2013-73308
View Paper titled, Resistance Spectroscopy Based Assessment of Degradation in Cu-Al Wire Bond Interconnects
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Topics: Spectroscopy, Wire
Proceedings Papers

Simulations of Deformation and Stress During Copper Wirebond on ULK Chips

Hung-Yun Lin, Kritika Upreti, Allen Tippmann, Ganesh Subbarayan, Dae Young Jung, Bahgat Sammakia
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A012, July 16–18, 2013
Paper No: IPACK2013-73178
DOI: https://doi.org/10.1115/IPACK2013-73178
View Paper titled, Simulations of Deformation and Stress During Copper Wirebond on ULK Chips
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Topics: Copper, Deformation, Engineering simulation, Simulation, Stress, Fracture (Materials), Vibration, Critical points (Physics), Wire, Wire bonding