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Proceedings Papers

Temperature Effects on the Performance and Reliability of MEMS Gyroscope Sensors

Chandradip Patel, Allen Jones, Joshua Davis, Patrick McCluskey, David Lemus
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 507-512, July 19–23, 2009
Paper No: InterPACK2009-89370
https://doi.org/10.1115/InterPACK2009-89370
View Paper titled, Temperature Effects on the Performance and Reliability of MEMS Gyroscope Sensors
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Topics: Microelectromechanical systems, Reliability, Sensors, Temperature effects, Temperature, Displacement, Displacement measurement, Fire, High temperature, Resonance
Proceedings Papers

Development of 6mil Copper Wire Bonding for Replacing 10–15mil Aluminum Wire

Yingwei Jiang, Ronglu Sun, Sonder Wang, Kenny Tan, Youmin Yu, Weimin Chen, Xiao Wei
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 451-457, July 19–23, 2009
Paper No: InterPACK2009-89046
https://doi.org/10.1115/InterPACK2009-89046
View Paper titled, Development of 6mil Copper Wire Bonding for Replacing 10–15mil Aluminum Wire
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Topics: Aluminum, Copper, Wire, Wire bonding, Reliability, Bonding, Manufacturing, Metals, Cycles, Damage
Proceedings Papers

Novel Miniature DMFC With Monolithic Si Electrodes

Masanori Hayase, Yosuke Saito
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 459-462, July 19–23, 2009
Paper No: InterPACK2009-89143
https://doi.org/10.1115/InterPACK2009-89143
View Paper titled, Novel Miniature DMFC With Monolithic Si Electrodes
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Topics: Direct methanol fuel cells, Electrodes, Catalysts, Plating, Semiconductor wafers, Energy generation, Engineering prototypes, Fuels, Metals, Methanol
Proceedings Papers

Evaluation of the Accuracy of Out-of-Plane Normal Stress Detection Using Novel Piezoresistive CMOS Sensors

Benjamin Lemke, Rajashree Baskaran, Oliver Paul
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 463-469, July 19–23, 2009
Paper No: InterPACK2009-89171
https://doi.org/10.1115/InterPACK2009-89171
View Paper titled, Evaluation of the Accuracy of Out-of-Plane Normal Stress Detection Using Novel Piezoresistive CMOS Sensors
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Topics: Complementary metal oxide semiconductors, Sensors, Stress, Temperature, Uncertainty, Currents, Sensitivity analysis
Proceedings Papers

Direct Measurement of Gyroscope Quadrature Error Using Interferometric Tools

Ryan T. Marinis, Ryszard J. Pryputniewicz
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 471-476, July 19–23, 2009
Paper No: InterPACK2009-89222
https://doi.org/10.1115/InterPACK2009-89222
View Paper titled, Direct Measurement of Gyroscope Quadrature Error Using Interferometric Tools
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Topics: Errors, Rotation, Interferometry, Coriolis force, Excitation, Resonance, Sensors, Shapes
Proceedings Papers

Evaluation of Resistance Change as a Predictor of Thermal Actuator Displacement

J. H. Constable, Michael Stevenson, Ming Hung Hung, Bill Infantolino
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 477-484, July 19–23, 2009
Paper No: InterPACK2009-89246
https://doi.org/10.1115/InterPACK2009-89246
View Paper titled, Evaluation of Resistance Change as a Predictor of Thermal Actuator Displacement
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Topics: Actuators, Displacement, Electrical resistivity, Microelectromechanical systems, Silicon, Temperature, Dimensions, Electrical resistance, Feedback, Heat conduction
Proceedings Papers

Optimization of the Tip of Microwave AFM Probe

Yang Ju, Motohiro Hamada, Atsushi Hosoi, Akifumi Fujimoto
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 485-490, July 19–23, 2009
Paper No: InterPACK2009-89252
https://doi.org/10.1115/InterPACK2009-89252
View Paper titled, Optimization of the Tip of Microwave AFM Probe
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Topics: Atomic force microscopy, Microwaves, Optimization, Probes, Gallium arsenide, Manufacturing, Resolution (Optics), Waveguides, Cantilevers, Diffraction gratings
Proceedings Papers

An Optimization Design for a MEMS Fabricated Jet Impingement Cooling Device

Yoon Jin Won, Jae ho Lee, Evelyn N. Wang, Kenneth E. Goodson, Thomas W. Kenny
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 491-496, July 19–23, 2009
Paper No: InterPACK2009-89257
https://doi.org/10.1115/InterPACK2009-89257
View Paper titled, An Optimization Design for a MEMS Fabricated Jet Impingement Cooling Device
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Topics: Design, Impingement cooling, Microelectromechanical systems, Optimization, Cooling, Computer cooling, Flow (Dynamics), Heat transfer, Heat transfer coefficients, Pressure drop
Proceedings Papers

The IP Landscape for MEMS Packaging

Charles E. Bauer, Raymond A. Fillion, Herbert J. Neuhaus, Marc Papageorge
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 497-500, July 19–23, 2009
Paper No: InterPACK2009-89291
https://doi.org/10.1115/InterPACK2009-89291
View Paper titled, The IP Landscape for MEMS Packaging
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Topics: MEMS packaging, Microelectromechanical systems, Databases, MEMS packages, Microelectronic devices, Patents, Semiconductors (Materials), Valuation
Proceedings Papers

Package Designs and Associated Challenges for Environment Sensitive MEMS Sensors

Vijay Sarihan, Jian Wen, Gary Li
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 501-505, July 19–23, 2009
Paper No: InterPACK2009-89330
https://doi.org/10.1115/InterPACK2009-89330
View Paper titled, Package Designs and Associated Challenges for Environment Sensitive MEMS Sensors
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Topics: Microelectromechanical systems, Reliability, Resonance, Sensors