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Proceedings Papers

Pool Boiling Heat Transfer in Dielectric Fluids and Impact of Surfaces on the Repeatability

Tolga Emir, Yakup Gokalp Yazici, Mete Budakli, Mehmet Arik
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A002, October 25–27, 2022
Paper No: IPACK2022-97266
https://doi.org/10.1115/IPACK2022-97266
View Paper titled, Pool Boiling Heat Transfer in Dielectric Fluids and Impact of Surfaces on the Repeatability
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Topics: Critical heat flux, Fluids, Heat transfer, Oxidation, Pool boiling
Proceedings Papers

High Brightness Illumination Based on Laser Light Diffusion With Mie Scattering

Mohammad Azarifar, Ceren Cengiz, Kerem Ocaksönmez, Asim Onal, Sedat Nizamoglu, Mehmet Arik
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A001, October 25–27, 2022
Paper No: IPACK2022-97220
https://doi.org/10.1115/IPACK2022-97220
View Paper titled, High Brightness Illumination Based on Laser Light Diffusion With Mie Scattering
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Topics: Brightness (Photometry), Diffusion (Physics), Electromagnetic scattering, Lasers, Radiation scattering, Scattering (Physics)
Proceedings Papers

Feasibility Demonstration of Server Chip Package With Direct-to-Chip Optical Transceivers

Shidong Li, Bakul Parikh, Chelsea Savoy, Daniel Kuchta, Guillaume Jutras, Harry Bagheri, Hilton Toy, Joe Ross, Ken-Ichi Akasofu, Mark Kapfhammer, Mark Schultz, Steven Ostrander, Thomas Wassick
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A004, October 25–27, 2022
Paper No: IPACK2022-97455
https://doi.org/10.1115/IPACK2022-97455
View Paper titled, Feasibility Demonstration of Server Chip Package With Direct-to-Chip Optical Transceivers
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Topics: Cables, Construction, Copper, Cycles, Density, Elastomers, Fibers, Flat heat pipes, Flip-chip, Flip-chip devices
Proceedings Papers

Experimental Investigation of R134a Flow Boiling in Copper Foam Evaporators for High Heat Flux Electronics Cooling

Deogratius Kisitu, Carol Caceres, Metodi Zlatinov, Denver Schaffarzick, Alfonso Ortega
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A003, October 25–27, 2022
Paper No: IPACK2022-97400
https://doi.org/10.1115/IPACK2022-97400
View Paper titled, Experimental Investigation of R134a Flow Boiling in Copper Foam Evaporators for High Heat Flux Electronics Cooling
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Topics: Boiling, Computer cooling, Cooling, Copper, Flow (Dynamics), Heat flux, Metal foams
Proceedings Papers

Numerical Analysis of Pulse Laser Assisted Curing Region of Photocurable Resins

Yuta Nakamura, Kazuyoshi Fushinobu, Asato Tamura
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A001, October 7–9, 2019
Paper No: IPACK2019-6356
https://doi.org/10.1115/IPACK2019-6356
View Paper titled, Numerical Analysis of Pulse Laser Assisted Curing Region of Photocurable Resins
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Topics: Additive manufacturing, Computer simulation, Hardening (Curing), Lasers, Numerical analysis, Photons, Polymerization, Resins, Manufacturing, Nanoscale phenomena
Proceedings Papers

Vandal Glass Heat Distribution and the Effect of Glass Gap Adjustments in Outdoor Digital Display Components

Jeho Kim, J. Michael Brown, Yogendra Joshi, Kevin O’Connor, Marcos Diaz, Zhuomin Zhang, Peiyan Yang
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A002, October 7–9, 2019
Paper No: IPACK2019-6391
https://doi.org/10.1115/IPACK2019-6391
View Paper titled, Vandal Glass Heat Distribution and the Effect of Glass Gap Adjustments in Outdoor Digital Display Components
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Topics: Computational fluid dynamics, Glass, Heat, Heat transfer, Liquid crystals, Solar energy, Solar radiation, Testing, Temperature, Computer software
Proceedings Papers

Prediction and Control Technique of the Paper Media Temperature After Fusing in Electrophotographic Process

Shunsuke Kawasaki, Shinichi Kuramoto, Kazuyoshi Fushinobu, Koichi Kato, Kimiharu Yamazaki, Kaori Hemmi
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A003, October 7–9, 2019
Paper No: IPACK2019-6396
https://doi.org/10.1115/IPACK2019-6396
View Paper titled, Prediction and Control Technique of the Paper Media Temperature After Fusing in Electrophotographic Process
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Topics: Machine learning, Temperature
Proceedings Papers

Correlated Effects of Self-Heating, Light Output, and Efficiency of GaN Light-Emitting Diodes on Junction Temperature

Bikramjit Chatterjee, James Spencer Lundh, Daniel Shoemaker, Tae Kyoung Kim, Joon Seop Kwak, Jaehee Cho, Sukwon Choi
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A004, October 7–9, 2019
Paper No: IPACK2019-6426
https://doi.org/10.1115/IPACK2019-6426
View Paper titled, Correlated Effects of Self-Heating, Light Output, and Efficiency of GaN Light-Emitting Diodes on Junction Temperature
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Topics: Gallium nitride, Heating, Junctions, Light-emitting diodes, Temperature, Brightness (Photometry), Indium gallium nitride, Nanoparticles, Quantum wells, Temperature measurement
Proceedings Papers

Modeling of Light Emitting Device Populations in the Electrical, Thermal, and Optical Domain for Luminaire Design

Gabor Farkas, Andras Vass-Varnai, Lajos Gaal, Marta Rencz
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A005, October 7–9, 2019
Paper No: IPACK2019-6547
https://doi.org/10.1115/IPACK2019-6547
View Paper titled, Modeling of Light Emitting Device Populations in the Electrical, Thermal, and Optical Domain for Luminaire Design
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Topics: Design, Modeling, Physics
Proceedings Papers

Direct Ink Printing of Cavities in DPC Ceramic Substrates With Kaolin Pastes for Hermetic Packaging

Qinglei Sun, Yang Peng, Hao Cheng, Yun Mou, Mingxiang Chen
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A006, October 7–9, 2019
Paper No: IPACK2019-6616
https://doi.org/10.1115/IPACK2019-6616
View Paper titled, Direct Ink Printing of Cavities in DPC Ceramic Substrates With Kaolin Pastes for Hermetic Packaging
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Topics: Cavities, Ceramics, Inks, Kaolin, Packaging, Printing, Rheology
Proceedings Papers

Novel Application-Specific LED Packages Integrated With Compact Freeform Lens

Kai Wang, Fei Chen, Zongyuan Liu, Xiaobing Luo, Sheng Liu
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 685-691, July 19–23, 2009
Paper No: InterPACK2009-89335
https://doi.org/10.1115/InterPACK2009-89335
View Paper titled, Novel Application-Specific LED Packages Integrated With Compact Freeform Lens
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Topics: Lenses (Optics), Packaging, Light-emitting diodes, Roads, Silicones, Computer simulation, Design methodology, Manufacturing, Optics
Proceedings Papers

Design and Testing of a Carbon Foam Based Supercooler for High Heat Flux Cooling in Optoelectronic Packages

Walter W. Yuen, Jianping Tu, Wai-Cheong Tam, Dan Blumenthal
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 637-645, July 19–23, 2009
Paper No: InterPACK2009-89008
https://doi.org/10.1115/InterPACK2009-89008
View Paper titled, Design and Testing of a Carbon Foam Based Supercooler for High Heat Flux Cooling in Optoelectronic Packages
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Topics: Carbon, Cooling, Design, Heat flux, Testing
Proceedings Papers

Continuous Wavelet Transform Based Nanoscale Strain Field Measurement Using Moire´ Interferometry With Phase Shifting

Bicheng Chen, Cemal Basaran
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 647-654, July 19–23, 2009
Paper No: InterPACK2009-89016
https://doi.org/10.1115/InterPACK2009-89016
View Paper titled, Continuous Wavelet Transform Based Nanoscale Strain Field Measurement Using Moire´ Interferometry With Phase Shifting
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Topics: Interferometry, Nanoscale phenomena, Wavelet transforms, Resolution (Optics), Tensors, Accelerated life testing, Ball-Grid-Array packaging, Computer software, Design, Dynamic testing (Materials)
Proceedings Papers

Thermo-Mechanical Analysis of a Laser Diode Chip in an Opto-Electronic Package

Satish C. Chaparala, Lawrence C. Hughes, Jae Kwak, Seungbae Park
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 655-663, July 19–23, 2009
Paper No: InterPACK2009-89108
https://doi.org/10.1115/InterPACK2009-89108
View Paper titled, Thermo-Mechanical Analysis of a Laser Diode Chip in an Opto-Electronic Package
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Topics: Gallium arsenide, Lasers, Packaging, Thermomechanics
Proceedings Papers

Performance Study of a GaAs Based Laser Diode Chip in a Condensing Environment

Sushma Madduri, Bahgat G. Sammakia, William Infantolino, Satish C. Chaparala, Lawrence C. Hughes, J. Micheal Harris
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 665-671, July 19–23, 2009
Paper No: InterPACK2009-89115
https://doi.org/10.1115/InterPACK2009-89115
View Paper titled, Performance Study of a GaAs Based Laser Diode Chip in a Condensing Environment
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Topics: Condensation, Gallium arsenide, Lasers
Proceedings Papers

Weibull Analysis Method Applied to Optical Fiber Breaking Stress Data

Paul J. Huspeni, Ly Le, Wei Liu, Elli Saravanos, Shannon Adkins
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 673-683, July 19–23, 2009
Paper No: InterPACK2009-89217
https://doi.org/10.1115/InterPACK2009-89217
View Paper titled, Weibull Analysis Method Applied to Optical Fiber Breaking Stress Data
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Topics: Optical fiber, Stress, Fibers, Manufacturing, Maximum likelihood estimation, Failure, Reliability, Statistical analysis, Coating processes, Coatings