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Proceedings Papers

Orientation Effects in Two-Phase Microgap Flow

Franklin L. Robinson, Avram Bar-Cohen
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A015, August 27–30, 2018
Paper No: IPACK2018-8383
DOI: https://doi.org/10.1115/IPACK2018-8383
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Topics: Flow (Dynamics), Gravity (Force), Coolers, Boiling, Cooling, Flux (Metallurgy), Heat, Aircraft, Fluids, Gravitational acceleration
Proceedings Papers

Heat Transfer Characteristics and Flow Pattern Visualization for Flow Boiling in a Vertical Narrow Microchannel

Kan Zhou, Junye Li, Zhao-zan Feng, Wei Li, Hua Zhu, Kuang Sheng
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A021, August 27–30, 2018
Paper No: IPACK2018-8447
DOI: https://doi.org/10.1115/IPACK2018-8447
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Topics: Boiling, Flow (Dynamics), Heat transfer, Microchannels, Visualization, Nucleate boiling, Bubbles, Fluids, Flux (Metallurgy), Heat
Proceedings Papers

Analysis of Thermal Properties of Power Multifinger HEMT Devices

Aleš Chvála, Robert Szobolovszký, Jaroslav Kováč, Jr., Martin Florovič, Juraj Marek, Luboš Černaj, Patrik Príbytný, Daniel Donoval, Jaroslav Kováč, Sylvain Laurent Delage, Jean-Claude Jacquet
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A003, August 27–30, 2018
Paper No: IPACK2018-8256
DOI: https://doi.org/10.1115/IPACK2018-8256
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Topics: Cooling, Design, Electrons, Gallium nitride, Heat, Manufacturing, Mechanical admittance, Optimization, Packaging, Raman spectroscopy
Proceedings Papers

Thermal Interface Materials Enhanced by Micro and Nanostructures

Mei-Chien Lu
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A009, August 27–30, 2018
Paper No: IPACK2018-8307
DOI: https://doi.org/10.1115/IPACK2018-8307
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Topics: Architecture, Corners (Structural elements), Design, Electronic packages, Electronics, Energy gap, Failure, Finite element methods, High temperature, Nanostructures
Proceedings Papers

Failure Mechanism Assessment of TO-247 Packaged SiC Power Devices

Klas Brinkfeldt, Göran Wetter, Andreas Lövberg, Dag Andersson, Zsolt Toth-Pal, Mattias Forslund, Samer Shisha
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A016, August 27–30, 2018
Paper No: IPACK2018-8385
DOI: https://doi.org/10.1115/IPACK2018-8385
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Topics: Failure mechanisms, Electronics, Reliability, Acoustics, Automotive industry, Cooling, Elastic moduli, Failure analysis, Heating, High temperature
Proceedings Papers

Thermal-Hydraulic Performance and Optimization of Tube Ellipticity in a Plate Fin-and-Tube Heat Exchanger

Zhuo Yang, Tariq Amin Khan, Wei Li, Hua Zhu, Zhijian Sun, Zhengjiang Zhang, Jincai Du, Jianxin Zhou
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A022, August 27–30, 2018
Paper No: IPACK2018-8448
DOI: https://doi.org/10.1115/IPACK2018-8448
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Topics: Heat exchangers, Optimization, Artificial neural networks, Flow (Dynamics), Reynolds number, Friction, Pressure drop, Computational fluid dynamics, Computer simulation, Design
Proceedings Papers

A Review of Degradation Behavior and Modeling of Capacitors

Anunay Gupta, Om Prakash Yadav, Douglas DeVoto, Joshua Major
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A004, August 27–30, 2018
Paper No: IPACK2018-8262
DOI: https://doi.org/10.1115/IPACK2018-8262
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Topics: Capacitors, Modeling, Failure, Electronic systems, Metallized plastic film, Physics, Reliability
Proceedings Papers

Numerical Investigation of Shape Effect on Microdroplet Evaporation

Shuai Shuai, Zichen Du, Binjian Ma, Li Shan, Baris Dogruoz, Damena Agonafer
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A010, August 27–30, 2018
Paper No: IPACK2018-8311
DOI: https://doi.org/10.1115/IPACK2018-8311
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Topics: Evaporation, Shapes, Drops, Vapors, Cooling, Computer cooling, Computer simulation, Design, Diffusion (Physics), Electric fields
Proceedings Papers

Comparison of Evaporation and Condensation Characteristics Among Three Enhanced Tubes

Kunrong Shen, Zhichuan Sun, Xiaolong Yan, Wei Li, David J. Kukulka, Jianxin Zhou, Deyu Luan, Yan He, Bin Zhang
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A023, August 27–30, 2018
Paper No: IPACK2018-8449
DOI: https://doi.org/10.1115/IPACK2018-8449
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Topics: Condensation, Evaporation, Heat transfer, Heat transfer coefficients, Refrigerants, Pressure drop, Temperature, Vapors, Climate change, Flux (Metallurgy)
Proceedings Papers

A Novel Activated Carbon Enabled Steam Generation System Under Simulated Solar Light

Ashreet Mishra, A. G. Agwu Nnanna
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A017, August 27–30, 2018
Paper No: IPACK2018-8387
DOI: https://doi.org/10.1115/IPACK2018-8387
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Topics: Activated carbon, Steam, Sunlight, Carbon nanotubes, Nanoparticles, Water, Solar energy, Evaporation, Light, Medical devices
Proceedings Papers

Interconnect Fatigue Failure Parameter Isolation for Power Device Reliability Prediction

Cody J. Marbut, Mahsa Montazeri, David Huitink
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A005, August 27–30, 2018
Paper No: IPACK2018-8275
DOI: https://doi.org/10.1115/IPACK2018-8275
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Topics: Fatigue failure, Reliability, Stress, Damage, Design, Fatigue, Finite element analysis, Solders, Failure, Flip-chip
Proceedings Papers

Molecular Dynamics Simulation of AlN Deposition: Effect of N:Al Flux Ratio

Libin Zhang, Guo Zhu, Kuan Sun, Zhiyin Gan, Xiaobing Luo
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A011, August 27–30, 2018
Paper No: IPACK2018-8315
DOI: https://doi.org/10.1115/IPACK2018-8315
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Topics: Atoms, Crystals, Molecular dynamics simulation, Surface roughness, Temperature
Proceedings Papers

Mechanical Characterization of Transient Liquid Phase Sintered (TLPS) Cu-Sn

Erick Gutierrez, Subramani Manoharan, Maxim Serebreni, Patrick McCluskey
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A018, August 27–30, 2018
Paper No: IPACK2018-8392
DOI: https://doi.org/10.1115/IPACK2018-8392
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Topics: Tension-leg platforms, Tin, Transients (Dynamics), Alloys, High temperature, Nanoindentation, Shear (Mechanics), Stress, Copper, Electronic systems
Proceedings Papers

Experimental Study on Flow Evaporation Heat Transfer Characteristics Inside Horizontal Three-Dimensional Enhanced Tubes

Wei Li, Chuancai Zhang, Zhichuan Sun, Zhichun Liu, Lianxiang Ma, Yan He, Bin Zhang, Wei Chen, David J. Kukulka
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A024, August 27–30, 2018
Paper No: IPACK2018-8454
DOI: https://doi.org/10.1115/IPACK2018-8454
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Topics: Evaporation, Flow (Dynamics), Heat transfer, Heat transfer coefficients, Temperature, Turbulence, Vapors
Proceedings Papers

Mechanical Characterization Study of Sintered Silver Pastes Bonded in a Double-Lap Configuration

Paul Paret, Joshua Major, Douglas DeVoto, Sreekant Narumanchi, Yansong Tan, Guo-Quan Lu
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A006, August 27–30, 2018
Paper No: IPACK2018-8276
DOI: https://doi.org/10.1115/IPACK2018-8276
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Topics: Silver, Particulate matter, Pressure, Collaboration, Displacement, Electronics, Energy gap, High pressure (Physics), High temperature, Manufacturing
Proceedings Papers

Experimental Study of Flexible Electrohydrodynamic Conduction Pumping for Electronics Cooling

Nicolas Vayas Tobar, Pavolas N. Christidis, Nathaniel J. O'Connor, Michal Talmor, Jamal Seyed-Yagoobi
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A012, August 27–30, 2018
Paper No: IPACK2018-8322
DOI: https://doi.org/10.1115/IPACK2018-8322
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Topics: Computer cooling, Electrohydrodynamics, Heat conduction, Pumps, Flow (Dynamics), Flexible electronics, Microscale devices, Actuators, Biology, Biomedicine
Proceedings Papers

Comparison of Thermal and Stress Analysis Results for a High Voltage Module Using FEA and a Quick Parametric Analysis Tool

L. M. Boteler, S. M. Miner
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A019, August 27–30, 2018
Paper No: IPACK2018-8394
DOI: https://doi.org/10.1115/IPACK2018-8394
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Topics: Finite element analysis, Stress analysis (Engineering), Design, Temperature, Stress, Modeling, Thermal stresses, Computation, Convection, Flat heat pipes
Proceedings Papers

Numerical Study of the Flow Condition of the Hydrodynamic Levitated Mechanical Micropump

Ruikang Wu, Wei Lan, Xingjian Yu, Weicheng Shu, Meng Wang, Xiaobing Luo
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A001, August 27–30, 2018
Paper No: IPACK2018-8210
DOI: https://doi.org/10.1115/IPACK2018-8210
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Topics: Flow (Dynamics), Micropumps, Fluid dynamics, Pressure, Journal bearings, Pumps, Rotors, Bearings, Cooling, Cooling systems
Proceedings Papers

Numerical Approach to Cold Gas Spray on Ceramic Substrates for Power Electronics Packaging

Marco J. Echeverría, Pedro O. Quintero, Dimeji Ibitayo, Lauren Boteler
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A007, August 27–30, 2018
Paper No: IPACK2018-8279
DOI: https://doi.org/10.1115/IPACK2018-8279
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Topics: Ceramics, Electronic packaging, Sprays, Copper, Manufacturing, Reliability, Aluminum, Bonding, Brittleness, Computer simulation
Proceedings Papers

Evaporative Wicking Phenomena on Nanotextured Surfaces for Heat Pipe Applications

Duong Vy Le, Shiwei Zhang, Jonggyu Lee, Yoonjin Won
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A025, August 27–30, 2018
Paper No: IPACK2018-8456
DOI: https://doi.org/10.1115/IPACK2018-8456
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Topics: Cooling, Copper, Design, Electronics, Energy dissipation, Evaporation, Evaporative cooling, Heat, Heat conduction, Heat flux