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Proceedings Papers

On Simple Prediction Method for Thermal Contact Resistance Between Wavy Surfaces With Thermal Interface Material Under Low Mean Nominal Contact Pressure (Fundamental Study Based on 1-D Model)

Toshio Tomimura, Yasushi Koito, Taewan Do, Masaru Ishizuka, Tomoyuki Hatakeyama

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A073, July 6–9, 2015

Paper No: IPACK2015-48302

DOI: https://doi.org/10.1115/IPACK2015-48302

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Topics: Contact resistance, Pressure, Heat, Surface roughness, Temperature, Bearings, Control systems, Electronic equipment, Errors, Satellites

Proceedings Papers

Steady State and Transient Comparison of Perimeter and Row-Based Cooling Employing Controlled Cooling Curves

Husam A. Alissa, Kourosh Nemati, Bahgat Sammakia, Alfonso Ortega, David King, Mark Seymour, Russell Tipton

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A017, July 6–9, 2015

Paper No: IPACK2015-48237

DOI: https://doi.org/10.1115/IPACK2015-48237

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Topics: Cooling, Steady state, Transients (Dynamics), Data centers, Containment, Air flow, Coolers, Failure, Flow (Dynamics), Computational fluid dynamics

Proceedings Papers

Quantification of Phase Change Material Energy Storage Capability Using Multiphysics Simulations

W. E. O’Connor, A. P. Wemhoff

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A065, July 6–9, 2015

Paper No: IPACK2015-48522

DOI: https://doi.org/10.1115/IPACK2015-48522

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Topics: Energy storage, Engineering simulation, Phase change materials, Simulation, Thermal energy storage, Finite element analysis, Heat flux, Heating, Latent heat, Melting

Proceedings Papers

Hot Spot Elimination by Thin and Smart Heat Spreader

Mohammad Shahed Ahamed, Yuji Saito, Masataka Mochizuki, Koichi Mashiko

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A049, July 6–9, 2015

Paper No: IPACK2015-48019

DOI: https://doi.org/10.1115/IPACK2015-48019

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Topics: Flat heat pipes, Heat pipes, Heat, Clocks, Computer cooling, Metals, Aerospace industry, Cooling, Data centers, Experimental analysis

Proceedings Papers

Discrete Control of Air Conditioning Units in Mission Critical Facilities

Sergio A. Bermudez, Hendrik F. Hamann, Levente J. Klein, Fernando J. Marianno, Alan C. Claassen

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A033, July 6–9, 2015

Paper No: IPACK2015-48593

DOI: https://doi.org/10.1115/IPACK2015-48593

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Topics: Air conditioning, Fans, Automatic control, Control systems, Cooling, Data centers, Energy consumption, Failure, Redundancy (Engineering), Safety

Proceedings Papers

Data Center Cooling Efficiency With Simulation-Based Optimization

Laurent M. Billet, Christopher M. Healey, James W. VanGilder, Zachary M. Pardey

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A025, July 6–9, 2015

Paper No: IPACK2015-48425

DOI: https://doi.org/10.1115/IPACK2015-48425

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Topics: Cooling, Data centers, Optimization, Simulation, Energy consumption, Air flow, Cooling systems, Pressure, Sensors, Temperature

Proceedings Papers

A Study on the Thermo-Fluid Simulation Model Using Porous Media in the Power Conversion System

Chang-Woo Han, You-Lim Moon, Seung-Boong Jeong, Jong-Hee Han

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A001, July 6–9, 2015

Paper No: IPACK2015-48085

DOI: https://doi.org/10.1115/IPACK2015-48085

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Topics: Porous materials, Power conversion systems, Simulation models, Thermofluids, Heat sinks, Air flow, Power semiconductor devices, Temperature, Computation, Computer simulation

Proceedings Papers

Unsteady Heat Flux Measurements in Agitated Channel Flows

Smita Agrawal, Terrence Simon, Mark North, Tianhong Cui

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A009, July 6–9, 2015

Paper No: IPACK2015-48753

DOI: https://doi.org/10.1115/IPACK2015-48753

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Topics: Channel flow, Heat flux, Flow (Dynamics), Cycles, Heat sinks, Convection, Fluctuations (Physics), Heat exchangers, Heat transfer, Turbulence

Proceedings Papers

Full Scale Simulation of an Integrated Monolithic Heat Sink for Thermal Management of a High Power Density GaN-SiC Chip

Tanya Liu, Farzad Houshmand, Catherine Gorle, Sebastian Scholl, Hyoungsoon Lee, Yoonjin Won, Mehdi Asheghi, Kenneth Goodson, Hooman Kazemi, Kenneth Vanhille

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A057, July 6–9, 2015

Paper No: IPACK2015-48592

DOI: https://doi.org/10.1115/IPACK2015-48592

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Topics: Gallium nitride, Heat sinks, Power density, Simulation, Thermal management, Cooling, Flow (Dynamics), Microchannels, Design, Heat transfer

Proceedings Papers

Experimentally Validated Numerical Model of a Fully-Enclosed Hybrid Cooled Server Cabinet

Kourosh Nemati, Husam A. Alissa, Bruce T. Murray, Bahgat Sammakia, Mark Seymour

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A041, July 6–9, 2015

Paper No: IPACK2015-48244

DOI: https://doi.org/10.1115/IPACK2015-48244

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Topics: Computer simulation, Cooling, Data centers, Heat, Air flow, Energy dissipation, Leakage, Water, Boundary-value problems, Computational fluid dynamics

Proceedings Papers

The Detection of Minimum BLT Condition With Electrical Capacitance Measurement

Yasuhiro Saito, Satoru Suzuki, Takanori Komuro

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A074, July 6–9, 2015

Paper No: IPACK2015-48303

DOI: https://doi.org/10.1115/IPACK2015-48303

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Topics: Capacitance, Heat, Fillers (Materials), Heat sinks, Solids, Electrical measurement, Mass production, Pressure, Semiconductor devices, Silicones

Proceedings Papers

Design Guideline to Improve Thermal Management of 3D Package Using Cu-to-Cu Direct Bonding

Ah-Young Park, S. B. Park

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A066, July 6–9, 2015

Paper No: IPACK2015-48042

DOI: https://doi.org/10.1115/IPACK2015-48042

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Topics: Bonding, Design, Thermal management, Finite element analysis, Packaging, Solders, Dimensions, Energy consumption, Heat transfer, Integrated circuits

Proceedings Papers

A Miniature Double Oscillating-Fan Cooling System Using Electromagnetic Force

Hsien-Chin Su

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A002, July 6–9, 2015

Paper No: IPACK2015-48151

DOI: https://doi.org/10.1115/IPACK2015-48151

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Topics: Cooling systems, Electromagnetic force, Cooling, Blades, Dimensions, Electromagnets, Bearings, Design, Energy consumption, Engines

Proceedings Papers

Thermal Behavior of Rectangular Flux Channels With Discretely Specified Contact Flux and Temperature

Masood Razavi, Yuri S. Muzychka, Serpil Kocabiyik

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A050, July 6–9, 2015

Paper No: IPACK2015-48051

DOI: https://doi.org/10.1115/IPACK2015-48051

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Topics: Temperature, Boundary-value problems, Finite element methods, Computer software, Cooling, Flux (Metallurgy), Fourier series, Heat, Heat flux, Laplace equations

Proceedings Papers

Neural Network Modeling in Model-Based Control of a Data Center

Nachiket Kansara, Rohit Katti, Kourosh Nemati, Alan P. Bowling, Bahgat Sammakia

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A034, July 6–9, 2015

Paper No: IPACK2015-48684

DOI: https://doi.org/10.1115/IPACK2015-48684

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Topics: Artificial neural networks, Data centers, Modeling, Computational fluid dynamics, Temperature, Neural network models, Sensors, Storage, Transients (Dynamics)

Proceedings Papers

Theoretical and Empirical Energy Impacts of Economization in Data Centers

Dan Comperchio, Sameer Behere

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A018, July 6–9, 2015

Paper No: IPACK2015-48274

DOI: https://doi.org/10.1115/IPACK2015-48274

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Topics: Data centers, Compressors, Energy consumption, Air conditioners, Computers, Cooling, Electronic systems, Evaporative cooling, System architecture, System monitoring

Proceedings Papers

Parameter Estimation for Lumped Capacitance Modeling of CRAH Units During Chilled Water Interruption

Hamza Salih Erden, H. Ezzat Khalifa

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A026, July 6–9, 2015

Paper No: IPACK2015-48430

DOI: https://doi.org/10.1115/IPACK2015-48430

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Topics: Capacitance, Modeling, Parameter estimation, Water, Data centers, Transients (Dynamics), Air flow, Computers, Cooling, Failure

Proceedings Papers

Key Technologies to Implement High Thermal Ambient Data Center

Shu Zhang, Yu Han, Nishi Ahuja, Xiaohong Liu, Huahua Ren, Guangliang Guo

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A010, July 6–9, 2015

Paper No: IPACK2015-48015

DOI: https://doi.org/10.1115/IPACK2015-48015

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Topics: Data centers, Temperature, Cooling, Design, Internet, Air conditioners, Ceilings, Computers, Energy consumption, Failure

Proceedings Papers

Numerical Investigation of Thermal Resistance in a Rectangular Flux Channel With Non-Uniform Heat Convection in the Sink Plane

Masood Razavi, Alireza Dehghani-Sanij, Yuri S. Muzychka

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A058, July 6–9, 2015

Paper No: IPACK2015-48685

DOI: https://doi.org/10.1115/IPACK2015-48685

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Topics: Convection, Thermal resistance, Heat transfer coefficients, Boundary-value problems, Cooling, Thermal analysis, Computer software, Design, Engineers, Finite volume methods

Proceedings Papers

Rack Server Solution in Data Center

Sheng Kang, Guofeng Chen, Chun Wang, Ruiquan Ding, Jiajun Zhang, Pinyan Zhu, Chao Liu, Nishi Ahuja

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A042, July 6–9, 2015

Paper No: IPACK2015-48258

DOI: https://doi.org/10.1115/IPACK2015-48258

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Topics: Data centers, Cooling, Energy consumption, Design, Fans, Air flow, Energy efficiency, Server racks, Cloud computing, Heat

2 3 4 5

NARROW

On Simple Prediction Method for Thermal Contact Resistance Between Wavy Surfaces With Thermal Interface Material Under Low Mean Nominal Contact Pressure (Fundamental Study Based on 1-D Model)

Steady State and Transient Comparison of Perimeter and Row-Based Cooling Employing Controlled Cooling Curves

Quantification of Phase Change Material Energy Storage Capability Using Multiphysics Simulations

Hot Spot Elimination by Thin and Smart Heat Spreader

Discrete Control of Air Conditioning Units in Mission Critical Facilities

Data Center Cooling Efficiency With Simulation-Based Optimization

A Study on the Thermo-Fluid Simulation Model Using Porous Media in the Power Conversion System

Unsteady Heat Flux Measurements in Agitated Channel Flows

Full Scale Simulation of an Integrated Monolithic Heat Sink for Thermal Management of a High Power Density GaN-SiC Chip

Experimentally Validated Numerical Model of a Fully-Enclosed Hybrid Cooled Server Cabinet

The Detection of Minimum BLT Condition With Electrical Capacitance Measurement

Design Guideline to Improve Thermal Management of 3D Package Using Cu-to-Cu Direct Bonding

A Miniature Double Oscillating-Fan Cooling System Using Electromagnetic Force

Thermal Behavior of Rectangular Flux Channels With Discretely Specified Contact Flux and Temperature

Neural Network Modeling in Model-Based Control of a Data Center

Theoretical and Empirical Energy Impacts of Economization in Data Centers

Parameter Estimation for Lumped Capacitance Modeling of CRAH Units During Chilled Water Interruption

Key Technologies to Implement High Thermal Ambient Data Center

Numerical Investigation of Thermal Resistance in a Rectangular Flux Channel With Non-Uniform Heat Convection in the Sink Plane

Rack Server Solution in Data Center

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