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Proceedings Papers

Measuring Moisture Leakage Out of Water Cooling Hardware

Prabjit Singh, Michael Ellsworth
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A002, July 6–9, 2015
Paper No: IPACK2015-48154
https://doi.org/10.1115/IPACK2015-48154
View Paper titled, Measuring Moisture Leakage Out of Water Cooling Hardware
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Topics: Cooling, Hardware, Leakage, Water, Computers, Cooling systems, Electronics, Acoustics, Coolants, Errors
Proceedings Papers

Passive Thermosyphon Cooling System for High Heat Flux Servers

Sylwia Szczukiewicz, Nicolas Lamaison, Jackson B. Marcinichen, John R. Thome, Peter J. Beucher
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A009, July 6–9, 2015
Paper No: IPACK2015-48288
https://doi.org/10.1115/IPACK2015-48288
View Paper titled, Passive Thermosyphon Cooling System for High Heat Flux Servers
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Topics: Cooling systems, Heat flux, Cooling, Critical heat flux, Design, Condensers (steam plant), Fluids, Heat, Heat exchangers, Pipeline risers
Proceedings Papers

A Computational Study on the Momentum and Heat Transfer Distribution of a Low Frequency Round Impinging Synthetic Jet

Muhammad Ikhlaq, Baris Dogruoz, Omidreza Ghaffari, Mehmet Arik
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A016, July 6–9, 2015
Paper No: IPACK2015-48094
https://doi.org/10.1115/IPACK2015-48094
View Paper titled, A Computational Study on the Momentum and Heat Transfer Distribution of a Low Frequency Round Impinging Synthetic Jet
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Topics: Heat transfer, Momentum, Nozzles, Boundary-value problems, Flow (Dynamics), Temperature, Computational fluid dynamics, Cooling, Diaphragms (Mechanical devices), Diaphragms (Structural)
Proceedings Papers

Theoretical (Ideal) Module Cooling and Module Cooling Effectiveness

Michael J. Ellsworth, Jr., Levi A. Campbell
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A003, July 6–9, 2015
Paper No: IPACK2015-48324
https://doi.org/10.1115/IPACK2015-48324
View Paper titled, Theoretical (Ideal) Module Cooling and Module Cooling Effectiveness
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Topics: Cooling, Thermal resistance, Heat sinks, Density, Flow (Dynamics), Fluids, Heat exchangers, Pressure, Specific heat, Water
Proceedings Papers

High Heat Flux Subcooled Flow Boiling of Methanol in Microtubes

Farzad Houshmand, Hyoungsoon Lee, Mehdi Asheghi, Kenneth E. Goodson
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A010, July 6–9, 2015
Paper No: IPACK2015-48734
https://doi.org/10.1115/IPACK2015-48734
View Paper titled, High Heat Flux Subcooled Flow Boiling of Methanol in Microtubes
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Topics: Boiling, Flow (Dynamics), Heat flux, Methanol, Subcooling, Critical heat flux, Flux (Metallurgy), Pressure drop, Heat, Cooling
Proceedings Papers

Local Thermal Measurements of Impinging Liquid Jets With an Angled Confining Wall for Power Electronics Cooling

John F. Maddox, Roy W. Knight, Sushil H. Bhavnani
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A017, July 6–9, 2015
Paper No: IPACK2015-48393
https://doi.org/10.1115/IPACK2015-48393
View Paper titled, Local Thermal Measurements of Impinging Liquid Jets With an Angled Confining Wall for Power Electronics Cooling
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Topics: Computer cooling, Jets, Flow (Dynamics), Heat transfer coefficients, Reynolds number, Copper, Electronics, Heat flux, Impingement cooling, Sensors
Proceedings Papers

Multi-Objective Optimization of Micro Pin-Fin Arrays for Cooling of High Heat Flux Electronics With a Hot Spot

Sohail R. Reddy, Abas Abdoli, George S. Dulikravich, Cesar C. Pacheco, Genesis Vasquez, Rajesh Jha, Marcelo J. Colaco, Helcio R. B. Orlande
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A011, July 6–9, 2015
Paper No: IPACK2015-48242
https://doi.org/10.1115/IPACK2015-48242
View Paper titled, Multi-Objective Optimization of Micro Pin-Fin Arrays for Cooling of High Heat Flux Electronics With a Hot Spot
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Topics: Cooling, Electronics, Heat flux, Pareto optimization, Fins, Stress, Temperature, Design, Shapes, Airfoils
Proceedings Papers

Numerical Optimization of Advanced Monolithic Microcoolers for High Heat Flux Microelectronics

Sebastian Scholl, Catherine Gorle, Farzad Houshmand, Mehdi Asheghi, Kenneth Goodson, Tom Verstraete
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A018, July 6–9, 2015
Paper No: IPACK2015-48123
https://doi.org/10.1115/IPACK2015-48123
View Paper titled, Numerical Optimization of Advanced Monolithic Microcoolers for High Heat Flux Microelectronics
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Topics: Heat flux, Microcoolers, Microelectronic devices, Optimization, Cooling, Fluids, Heat transfer, Computational fluid dynamics, Design, Engineering simulation
Proceedings Papers

Lid-Integral Cold Plate Topology Integration, Performance, and Reliability

Gerd Schlottig, Marco de Fazio, Werner Escher, Paola Granatieri, Vijayeshwar D. Khanna, Thomas Brunschwiler
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A004, July 6–9, 2015
Paper No: IPACK2015-48427
https://doi.org/10.1115/IPACK2015-48427
View Paper titled, Lid-Integral Cold Plate Topology Integration, Performance, and Reliability
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Topics: Reliability, Topology, Silicon, Packaging, Composite materials, Cooling, Finite element model, Fracture (Materials), Fracture (Process), Gaskets
Proceedings Papers

Embedded Two-Phase Cooling of High Flux Electronics via Micro-Enabled Surfaces and Fluid Delivery Systems (FEEDS)

Raphael Mandel, Serguei Dessiatoun, Patrick McCluskey, Michael Ohadi
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A012, July 6–9, 2015
Paper No: IPACK2015-48496
https://doi.org/10.1115/IPACK2015-48496
View Paper titled, Embedded Two-Phase Cooling of High Flux Electronics via Micro-Enabled Surfaces and Fluid Delivery Systems (FEEDS)
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Topics: Cooling, Electronics, Fluids, Vapors, Heat flux, Pressure drop, Computational fluid dynamics, Engineering simulation, Experimental design, Heat transfer
Proceedings Papers

A Study on Flow Boiling in Microchannel With Piranha Pin Fin

X. Yu, C. Woodcock, Y. Wang, J. Plawsky, Y. Peles
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A005, July 6–9, 2015
Paper No: IPACK2015-48103
https://doi.org/10.1115/IPACK2015-48103
View Paper titled, A Study on Flow Boiling in Microchannel With Piranha Pin Fin
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Topics: Boiling, Flow (Dynamics), Microchannels, Critical heat flux, Fluid dynamics, Heat transfer, Pressure drop, Design, Energy dissipation, Fluids
Proceedings Papers

Inverse Design of Cooling of Electronic Chips Subject to Specified Hot Spot Temperature and Coolant Inlet Temperature

Sohail R. Reddy, George S. Dulikravich
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A019, July 6–9, 2015
Paper No: IPACK2015-48346
https://doi.org/10.1115/IPACK2015-48346
View Paper titled, Inverse Design of Cooling of Electronic Chips Subject to Specified Hot Spot Temperature and Coolant Inlet Temperature
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Topics: Coolants, Cooling, Design, Temperature, Heat, Heat flux, Fluids, Flux (Metallurgy), Airfoils, Computer cooling
Proceedings Papers

Microscale Layering of Liquid and Vapor Phases Within Microstructures for Self-Regulated Flow Delivery to Local Hot Spots

Abdolreza Fazeli, Sajjad Bigham, Mehdi Mortazavi, Saeed Moghaddam
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A013, July 6–9, 2015
Paper No: IPACK2015-48632
https://doi.org/10.1115/IPACK2015-48632
View Paper titled, Microscale Layering of Liquid and Vapor Phases Within Microstructures for Self-Regulated Flow Delivery to Local Hot Spots
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Topics: Flow (Dynamics), Microscale devices, Vapors, Temperature, Boiling, Heat sinks, Thin films, Design, Evaporation, Heat transfer
Proceedings Papers

Local Measurements of Flow Boiling Heat Transfer on Hot Spots in 3D Compatible Radial Microchannels

Fanghao Yang, Mark Schultz, Pritish Parida, Evan Colgan, Robert Polastre, Bing Dang, Cornelia Tsang, Michael Gaynes, John Knickerbocker, Timothy Chainer
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A006, July 6–9, 2015
Paper No: IPACK2015-48341
https://doi.org/10.1115/IPACK2015-48341
View Paper titled, Local Measurements of Flow Boiling Heat Transfer on Hot Spots in 3D Compatible Radial Microchannels
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Topics: Boiling, Flow (Dynamics), Heat transfer, Microchannels, Heating, Temperature, Cooling, Resistance thermometers, Coolants, Density
Proceedings Papers

Use of Two-Phase CFD Simulations to Develop a Boiling Heat Transfer Prediction Method for Slug Flow Within Microchannels

Mirco Magnini, John R. Thome
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A020, July 6–9, 2015
Paper No: IPACK2015-48033
https://doi.org/10.1115/IPACK2015-48033
View Paper titled, Use of Two-Phase CFD Simulations to Develop a Boiling Heat Transfer Prediction Method for Slug Flow Within Microchannels
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Topics: Boiling, Computational fluid dynamics, Engineering simulation, Heat transfer, Microchannels, Simulation, Slug flows, Bubbles, Evaporation, Flow (Dynamics)
Proceedings Papers

Embedded Cooling of High Heat Flux Electronics Utilizing Distributed Microfluidic Impingement Jets

John Ditri, Joseph Hahn, Roland Cadotte, Michael McNulty, Denise Luppa
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A014, July 6–9, 2015
Paper No: IPACK2015-48689
https://doi.org/10.1115/IPACK2015-48689
View Paper titled, Embedded Cooling of High Heat Flux Electronics Utilizing Distributed Microfluidic Impingement Jets
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Topics: Cooling, Electronics, Heat flux, Jets, Microfluidics, Simulation, Computational fluid dynamics, Reliability, Coolers, Cooling systems
Proceedings Papers

Novel Dynamic Numerical Microchannel Evaporator Model to Investigate Parallel Channel Instabilities

Tom Saenen, John R. Thome
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A021, July 6–9, 2015
Paper No: IPACK2015-48066
https://doi.org/10.1115/IPACK2015-48066
View Paper titled, Novel Dynamic Numerical Microchannel Evaporator Model to Investigate Parallel Channel Instabilities
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Topics: Microchannels, Dynamic models, Flow (Dynamics), Heat conduction, Heat transfer, Pressure, Simulation, Stability, Two-phase flow
Proceedings Papers

Reliable Integration of Microchannel Coolers for Power Electronics

David Squiller, Sumeer Khanna, Serguei Dessiatoun, Raphael Mandel, Michael Ohadi, Patrick McCluskey
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A015, July 6–9, 2015
Paper No: IPACK2015-48757
https://doi.org/10.1115/IPACK2015-48757
View Paper titled, Reliable Integration of Microchannel Coolers for Power Electronics
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Topics: Coolers, Electronics, Microchannels, Corrosion, Electronic packages, Electronic systems, Erosion, Failure mechanisms, Fracture (Materials), Fracture (Process)
Proceedings Papers

Embedded Two-Phase Cooling of Large 3D Compatible Chips With Radial Channels

Mark Schultz, Fanghao Yang, Evan Colgan, Robert Polastre, Bing Dang, Cornelia Tsang, Michael Gaynes, Pritish Parida, John Knickerbocker, Timothy Chainer
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A007, July 6–9, 2015
Paper No: IPACK2015-48348
https://doi.org/10.1115/IPACK2015-48348
View Paper titled, Embedded Two-Phase Cooling of Large 3D Compatible Chips With Radial Channels
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Topics: Cooling, Coolants, Temperature, Vehicles, Flux (Metallurgy), Heat, Dimensions, Flow (Dynamics), Heating, Pressure drop
Proceedings Papers

Validation Study for VOF Simulations of Boiling in a Microchannel

Catherine Gorlé, Hyoungsoon Lee, Farzad Houshmand, Mehdi Asheghi, Kenneth Goodson, Pritish R. Parida
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A022, July 6–9, 2015
Paper No: IPACK2015-48129
https://doi.org/10.1115/IPACK2015-48129
View Paper titled, Validation Study for VOF Simulations of Boiling in a Microchannel
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Topics: Boiling, Microchannels, Simulation, Boundary-value problems, Temperature, Two-phase flow, Flow (Dynamics), Fluids, Heat flux, Heat transfer