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Keywords: ATC tests
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Proceedings Papers
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A005, October 25–27, 2022
Paper No: IPACK2022-97253
... deals with understanding the root cause for the variation in the estimated life of two BGA packages by the three different vendors. SMD NSMD fatigue life ATC tests BGA solder joints Proceedings of the ASME 2022 International Technical Conference and Exhibition on Packaging and Integration...
