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Keywords: BGA
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Proceedings Papers

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1283-1291, July 17–22, 2005
Paper No: IPACK2005-73366
... (BGAs) are reported. During testing, measurements from strain gages were recorded using a high-speed data acquisition system. Electrical continuity through each package was monitored during the impact event in order to detect failure of package-to-board interconnects. Life distributions were established...
Proceedings Papers

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 287-293, July 6–11, 2003
Paper No: IPACK2003-35031
...of all super for h vibra numb the t vibra are v 550 H are m betwe stress calibr mode Keyw Intro Proceedings of IPACK03 Electronic Packaging Technical Conference and Exhibition July 6-11, 2003, Maui, Hawaii, USA the components. The stiffer packages of tape BGA and BGA, which have copper heat...
Proceedings Papers

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 783-788, July 6–11, 2003
Paper No: IPACK2003-35248
.... HDI Grid Array BGA Micro-via CCGA Proceedings of IPACK03 International Electronic Packaging Technical Conference and Exhibition July 6 11, 2003, Maui, Hawaii, USA Systems on the mechanical durability of HDI (High Density Interconn applicati Keyword INTROD The lates mostly Significa packages...
Proceedings Papers

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 201-206, July 6–11, 2003
Paper No: IPACK2003-35092
... technique to model the thermal vias by a block can lead to appreciable errors in predicting the die temperature. IC packages thermal vias thermal modeling BGA Proceedings of InterPACK 2003 Proceedings of IPACK03 International Electronic Packaging Technical Conference and Exhibition July 6-11...
Proceedings Papers

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 693-699, July 6–11, 2003
Paper No: IPACK2003-35017
...TVs indicat manufacturin particular pa life tenfold. used for cal prediction m publications. Keywords: Fatigue, BGA Introduction The em semiconduct electronics h have shown ceramic, an including pla Proceedings of IPACK03 Internatioe that the influence of these design and g parameters on fatigue...