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Keywords: BGA solder joints
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Proceedings Papers

A Study on Parameters That Impact the Thermal Fatigue Life of BGA Solder Joints

Karthik Arun Deo, Raymond-Noel Kono, Chongyang Cai, Junbo Yang, Yangyang Lai, Seungbae Park
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A005, October 25–27, 2022
Paper No: IPACK2022-97253
DOI: https://doi.org/10.1115/IPACK2022-97253
... deals with understanding the root cause for the variation in the estimated life of two BGA packages by the three different vendors. SMD NSMD fatigue life ATC tests BGA solder joints Proceedings of the ASME 2022 International Technical Conference and Exhibition on Packaging and Integration...
View Paper titled, A Study on Parameters That Impact the Thermal Fatigue Life of <span class="search-highlight">BGA</span> <span class="search-highlight">Solder</span> <span class="search-highlight">Joints</span>
Click here to open pdf in another window PDF for A Study on Parameters That Impact the Thermal Fatigue Life of <span class="search-highlight">BGA</span> <span class="search-highlight">Solder</span> <span class="search-highlight">Joints</span>
Topics: Ball-Grid-Array packaging, Fatigue life, Solder joints, Surface mount devices
Proceedings Papers

Low-Cycle Fatigue Reliability Evaluation for Lead-Free Solders in Vehicle Electronics Devices

Qiang Yu, Tadahiro Shibutani, Akifumi Tanaka, Takahiro Koyama, Masaki Shiratori
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 531-537, July 8–12, 2007
Paper No: IPACK2007-33250
DOI: https://doi.org/10.1115/IPACK2007-33250
... of the large chip was evaluated based on Miner s rule, and reliability of including the fatigue crack propagation can be evaluated by the analytical approach. Key Words: BGA Solder Joints, Low cycle fatigue, Reliability, Lead-free solder, Inelastic strain range, Chip component INTRODUCTION Recently, a lot...
View Paper titled, Low-Cycle Fatigue Reliability Evaluation for Lead-Free Solders in Vehicle Electronics Devices
Click here to open pdf in another window PDF for Low-Cycle Fatigue Reliability Evaluation for Lead-Free Solders in Vehicle Electronics Devices
Topics: Electronics, Lead-free solders, Low cycle fatigue, Reliability, Vehicles
Proceedings Papers

Impact Reliability Study of BGA Solder Joints and Dropping Test Method

Qiang Yu, Hironobu Kikuchi, Keiji Watanabe, Masaki Siratori, Manabu Kakino, Noriyuki Fujiwara
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 777-782, July 6–11, 2003
Paper No: IPACK2003-35139
DOI: https://doi.org/10.1115/IPACK2003-35139
... Proceedings of IPACK 03 The Pacific Rim/ASME International Electronic Packaging Technical Conference and Exhibition for drop impact reliability of BGA solder joints. In this paper, t e d D t P c w a i s o j m g s n I r t t b d a Proceedings of IPACK03 International Electronic Packaging Technical...
View Paper titled, Impact Reliability Study of <span class="search-highlight">BGA</span> <span class="search-highlight">Solder</span> <span class="search-highlight">Joints</span> and Dropping Test Method
Click here to open pdf in another window PDF for Impact Reliability Study of <span class="search-highlight">BGA</span> <span class="search-highlight">Solder</span> <span class="search-highlight">Joints</span> and Dropping Test Method
Topics: Ball-Grid-Array packaging, Reliability, Solder joints, Transients (Dynamics)