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Keywords: BGA solder joints
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Proceedings Papers

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A005, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97253
... SMD NSMD fatigue life ATC tests BGA solder joints Abstract Estimation of the thermal fatigue life of solder joints and identification of parameters that enhance the fatigue life are important steps in the development stage of BGA packages. In this study, different parameters of Sn-Ag...
Proceedings Papers

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 531-537, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33250
..., but also crack propagation, affects the failure life. Thus, the crack path was simulated and the failure cycle of the large chip was evaluated based on Miner’s rule, and reliability of including the fatigue crack propagation can be evaluated by the analytical approach. BGA Solder Joints Low cycle...
Proceedings Papers

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 777-782, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35139
... The purpose of this study is to develop an assessment method for drop impact reliability of BGA solder joints. In this paper, the dynamic deformation behavior of PCB is examined to evaluate the dynamic fracture of solder joints, where a free fall drop-impact test was used, and explicit-based FEM...