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Keywords: Cu/TIM system
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Proceedings Papers

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A011, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97440
... to comprehend the progression of crack growth and the crack tip opening displacement (CTOD) to assess the deterioration of various TIM interfaces at various aging durations. Cu/TIM system four-point bend interfacial delamination crack tip opening displacement strain energy release rates critical...