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Keywords: FEA
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Proceedings Papers
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A003, October 25–27, 2022
Paper No: IPACK2022-97452
... rates SAC105 SAC-Q thermal aging Anand model FEA drop & shock Proceedings of the ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems InterPACK2022 October 25-27, 2022, Garden Grove, California IPACK2022-97452...
Proceedings Papers
Sebastien Sequeira, Kevin Bennion, J. Emily Cousineau, Sreekant Narumanchi, Gilbert Moreno, Satish Kumar, Yogendra Joshi
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A002, October 27–29, 2020
Paper No: IPACK2020-2550
... environment. The IPM motor’s stator is studied at steady state, and winding losses are generated by a constant DC current. The validation is based on temperature comparison with experimental data and with more detailed Finite Element Analysis (FEA). All critical input parameters of the LPTN are considered...
Proceedings Papers
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A007, October 7–9, 2019
Paper No: IPACK2019-6561
... compounds, underfill encapsulants, adhesives and other polymers used in electronic assemblies. After characterization, these parameters can be used as input material property data for finite element analysis (FEA) simulations. In this study, both frequency dependent dynamic mechanical analysis (DMA...
Proceedings Papers
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1101-1108, July 17–22, 2005
Paper No: IPACK2005-73059
... test and numerical result can be achieved by using proposed plastic strain based criterion only and thus it can be used in cross comparisons between different board designs. FEA Drop/impact modeling CSP/BGA Proceedings of IPACK 05 he ASME/Pacific Rim Technical Conference and Chi (BG dev a fi...
