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Keywords: GaAs chip
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Proceedings Papers

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 655-663, July 19–23, 2009
Paper No: InterPACK2009-89108
... thickness, voids, thermal gradients in the package, surface irregularities in the chip etc. Experiments and model indicated that the designed package was robust enough and does not cause any damage to the chip. KEYWORDS: GaAs chip, laser packaging, FE modeling, DIC measurement INTRODUCTION The laser...