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Keywords: IC packages
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Proceedings Papers

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 201-206, July 6–11, 2003
Paper No: IPACK2003-35092
... technique to model the thermal vias by a block can lead to appreciable errors in predicting the die temperature. IC packages thermal vias thermal modeling BGA Proceedings of InterPACK 2003 Proceedings of IPACK03 International Electronic Packaging Technical Conference and Exhibition July 6-11...