... characteristics of undoped SAC105 and doped SAC-Q solder alloys at low operation temperatures (−65°C to 0°C) at high strain rate after varied thermal aging periods up to one year. In addition, the evolution of Anand parameters for SAC solder alloys after prolonged thermal aging has been studied. The Anand model’s...

..., these electronic devices can be subjected to strain rates of 1 to 100 per second in a critical environment. Numerous doped solder alloys have emerged to mitigate the effects of sustained high-temperature operation. The mechanical properties of SAC-Q solder alloy, isothermally aged for prolonged durations...

... exposure. High strain-rate data on SAC solder alloys after prolonged storage operating at low operating temperatures is not available in published literature. In this paper, materials characterization of SAC (SAC105 and SAC-Q) solder after prolonged storage at low operating temperatures (−65°C–0 °C...

... storage in non-climate-controlled conditions. Electronic equipment can be subjected to strain rates of 1 to 100 per second in shock and vibration. Many of the doped SAC soldering alloys in the electronic components, including SAC-Q, SAC-R, Innolot have found applications in long-term thermal exposure...

... SAC (SAC105 and SAC-Q) solder alloys has been studied. Stress-Strain curves have been obtained at low operating temperatures using tensile tests. The SAC leadfree solder samples were subjected to isothermal-aged up to 4-months at 50°C before testing. Anand Viscoplastic model has been used to describe...

... ranging from −65°C to 200°C. Also, these electronic devices can be subjected to strain rates of 1 to 100 per second in the critical environment. Recently, many doped SAC solder alloys are being introduced in the electronic component including SAC-Q, SAC-R, Innolot. SAC-Q is made with addition of Bi in Sn...

... rates of 1 to 100 per seconds and operating temperature up to 200°C in the critical surroundings. SAC solder alloys (e.g. SAC-Q (CYCLOMAX), and Innolot) are being considered for use in fine-pitch electronic components. SAC-Q consists of Sn-Ag-Cu alloy in addition to Bi (SAC+Bi). The data presented till...

..., evolution of microstructure and Anand parameters for unaged and aged SAC (SAC105 and SAC-Q) lead free solder alloys at high strain rates has been investigated induced due to thermal aging. The microstructure of the SAC solder is studied using scanning electron microscopy (SEM) for different strain rate...