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Keywords: additive manufacturing
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Proceedings Papers

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T09A001, October 25–27, 2022
Paper No: IPACK2022-96635
... investigation is performed as a point of comparison using a modular, additively manufactured jet setup. Thermal energy is applied to an aluminum base plate using a 200 W resistive heater to emulate a hot spot generated in high-power electronics. It is observed that the introduction of inclined and parallel jets...
Proceedings Papers

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A003, October 25–27, 2022
Paper No: IPACK2022-97382
... was at the threads used for mounting to the fixture. drop testing shock resistance additive manufacturing hybrid printed electronics Proceedings of the ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems InterPACK2022 October 25...
Proceedings Papers

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A003, October 25–27, 2022
Paper No: IPACK2022-97476
... Abstract This study focuses on a topology-based design approach that can be applied to liquid-cooled heat sinks for high-heat-flux devices with the goal of improving heat dissipation and manufacturability. Specifically, the study investigates the use of additively manufactured topology-based...
Proceedings Papers

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A025, October 26–28, 2021
Paper No: IPACK2021-74199
... Abstract Re-distribution layer (RDL) is one key enabling technology for advance packaging. RDL is usually fabricated in wafer level by photolithography process. An alternative approach for implementing RDL by additive manufacturing (AM) method is proposed in this study. This allows RDL...
Proceedings Papers

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A012, October 26–28, 2021
Paper No: IPACK2021-73367
... Abstract Additive manufacturing is rapidly revolutionizing the way products are designed and built. Its advantages in terms of mobile manufacturing, mass customization, part reduction, waste reduction, and just-in-time sparing are causing it to be considered for many electronics applications...
Proceedings Papers

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A003, October 27–29, 2020
Paper No: IPACK2020-2532
... Abstract Significant levels of heat are generated in contemporary electronics, and next generation devices will continue to demand higher power despite decreasing size; therefore, highly effective cooling schemes are needed. Simultaneously, advances in metal additive manufacturing have enabled...
Proceedings Papers

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A010, October 27–29, 2020
Paper No: IPACK2020-2596
... approach which involves an increased number of fabrication steps depending on the complexity of the structures. This current study involves the fabrication of these structures using a different approach, utilizing additive manufacturing that reduces the number of fabrication steps required to obtain...
Proceedings Papers

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A006, October 27–29, 2020
Paper No: IPACK2020-2591
... Abstract The present study is an experimental investigation of a set of five additively-manufactured compact, lightweight, low-cost, air-to-water cross-media heat exchangers suitable for liquid cooling applications in desktop computers, among other applications. The heat transfer between...
Proceedings Papers

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A001, October 7–9, 2019
Paper No: IPACK2019-6356
... Abstract AM (Additive manufacturing) technology has huge demand from industry for its high-speed fabricating, ability of fabricating complex shapes and low-cost fabrication which does not require expensive equipment such as molds. In particular, resolution of stereolithography technology...
Proceedings Papers

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A023, October 7–9, 2019
Paper No: IPACK2019-6519
... in volume. To fully take advantage of the benefits offered by these devices, the packaging, including cooling infrastructure, must also be addressed. Additive manufactured (AM) structures, based on unit cells seen in stochastic foams, have been investigated as an improvement in thermal management...