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Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A029, October 7–9, 2019
Paper No: IPACK2019-6592
... power modules and determining whether to integrate novel technologies. co-design co-engineering parametric study thermal analysis 3D network Parametric and Sensitivity Analysis of Power Module Design L. M. Boteler, M. C. Fish, M. S. Berman U.S. Army Research Laboratory Adelphi, MD, USA...