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Keywords: co-packaging
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Proceedings Papers

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A004, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97455
... processor interconnect and across PCB causes significant signal integrity challenges. Co-packaging solution with the optical transceiver integrated on processor module and with direct-to-substrate cabling enables high-speed signals by avoiding the PCB altogether. The challenge lies in adapting the optical...