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Proceedings Papers

Feasibility Demonstration of Server Chip Package With Direct-to-Chip Optical Transceivers

Shidong Li, Bakul Parikh, Chelsea Savoy, Daniel Kuchta, Guillaume Jutras, Harry Bagheri, Hilton Toy, Joe Ross, Ken-Ichi Akasofu, Mark Kapfhammer, Mark Schultz, Steven Ostrander, Thomas Wassick
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A004, October 25–27, 2022
Paper No: IPACK2022-97455
DOI: https://doi.org/10.1115/IPACK2022-97455
... processor interconnect and across PCB causes significant signal integrity challenges. Co-packaging solution with the optical transceiver integrated on processor module and with direct-to-substrate cabling enables high-speed signals by avoiding the PCB altogether. The challenge lies in adapting the optical...
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Topics: Cables, Construction, Copper, Cycles, Density, Elastomers, Fibers, Flat heat pipes, Flip-chip, Flip-chip devices