1-2 of 2
Keywords: cohesive zone modeling
Close
Follow your search
Access your saved searches in your account

Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A005, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111950
... shock model. The study could have practical implications for manufacturers designing electronic components for harsh environmental applications, and it provides valuable insights into the interfacial properties of the potting/PCB interface. cohesive zone modeling high-temperature aging...
Proceedings Papers

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A008, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97427
... I ), and mode-II (K II ) stress intensity factors are determined for the PCB-Epoxy interface. Cohesive zone parameters for each of the PCB-Epoxy interfaces have been determined and implemented into a predictive cohesive zone model (CZM). The PCB-Epoxy bi-material specimen has been modeled in ABAQUS...