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Keywords: cold plate
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Proceedings Papers

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A002, October 25–27, 2022
Paper No: IPACK2022-96972
... for a product, and prepare the facility accordingly to align with long term strategy. In this presentation, we will introduce a passive cold plate loop solution (Tide 1.0), based on Meta’s AI training platform (Zion) with eight Open Accelerator Modules (OAM). It reflects the design considerations...
Topics: Cooling
Proceedings Papers

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A003, October 25–27, 2022
Paper No: IPACK2022-97476
... in terms of heat transfer and fluid flow characteristics, as well as manufacturability, and reduced weight, material usage, and production cost. topology-based design additive manufacturing heat sink cold plate liquid cooling Proceedings of the ASME 2022 International Technical Conference...
Proceedings Papers

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A013, October 25–27, 2022
Paper No: IPACK2022-97445
... Abstract Rising power densities at the server level due to increasing performance demands are being met by using efficient thermal management methods such as direct-to-chip liquid cooling. The use of cold plates that are directly installed yields a lower thermal resistance path from the chip...
Proceedings Papers

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A016, October 26–28, 2021
Paper No: IPACK2021-73954
... and qualification process for developing cost effective LAAC solutions to provide cooling capabilities for multiple socketed packages are also discussed. This effort includes qualifying high performing heat exchanger (finned radiator) and cold plate with different fin designs. Thermal simulations were conducted...
Proceedings Papers

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 389-394, July 19–23, 2009
Paper No: InterPACK2009-89144
...Proceedings of IPACK2009 ASME InterPACK 09 July 19-23, 2009, San Francisco, CA, USA Copyright @ 2009 by ASME 1 IPACK2009-89144 APPLICATION OF MICRO-CHANNEL FIN FOR COLD PLATE OF LIQUID COOLING SYSTEM AND VAPOR CHAMBER Koichi Mashiko, Masataka Mochizuki, Yuji Saito, Yasuhiro Horiuchi, Thang Nguyen...
Proceedings Papers

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 445-450, July 17–22, 2005
Paper No: IPACK2005-73293
... and spacing offer the potential for very high heat flux removal capability [2- 4]. Such designs require expensive machining of microchannels on copper cold plates or directly etching on backside of the silicon die. An alternate approach is to make the cold plate from conventional air-cooled heatsinks. Heat...
Topics: Cooling