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Keywords: crack tip opening displacement
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Proceedings Papers

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A011, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97440
... to comprehend the progression of crack growth and the crack tip opening displacement (CTOD) to assess the deterioration of various TIM interfaces at various aging durations. Cu/TIM system four-point bend interfacial delamination crack tip opening displacement strain energy release rates critical...
Proceedings Papers

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A013, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2676
... of 10 days, 30 days, 60 days at temperatures ranging from 100°C to 150°C. Quasi-static bending was used to observe and determine interfacial delamination of the sample specimen. A 2D-Digital Image Correlation (DIC) method was also employed to understand the Crack tip opening displacement (CTOD), crack...